Technology CAD (TCAD) Simulations of Mg2Si/Si Heterojunction Photodetector Based on the Thickness Effect
Abstract
1. Introduction
2. Method and Model
3. Results and Discussion
3.1. I–V Curves
3.2. EQE
3.3. Responsivity
3.4. NEP
3.5. Detectivity
3.6. On/Off Ratio
3.7. Response Time and Recovery Time
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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| Parameters and Units | Mg2Si [15,16] | Si [16,17,18] |
|---|---|---|
| Bandgap (eV) | 0.77 | 1.12 |
| Affinity (eV) | 4.37 | 4.05 |
| Permittivity | 20 | 11.9 |
| Effective conduction band density (cm−3) | 7.8 × 1018 | 2.8 × 1019 |
| Effective valence band density (cm−3) | 2.06 × 1019 | 1.04 × 1019 |
| Electron mobility (cm2/V s) | 550 | 1350 |
| Hole mobility (cm2/V s) | 70 | 500 |
| Electron auger coefficient (cm6/s) | 9 × 10−29 | 2.8 × 10−31 |
| Hole auger coefficient (cm6/s) | 9 × 10−29 | 9.9 × 10−32 |
| SRH recombination life time, e, h (s) | 1 × 10−6 | 1 × 10−7 |
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Yu, H.; Ji, S.; Luo, X.; Xie, Q. Technology CAD (TCAD) Simulations of Mg2Si/Si Heterojunction Photodetector Based on the Thickness Effect. Sensors 2021, 21, 5559. https://doi.org/10.3390/s21165559
Yu H, Ji S, Luo X, Xie Q. Technology CAD (TCAD) Simulations of Mg2Si/Si Heterojunction Photodetector Based on the Thickness Effect. Sensors. 2021; 21(16):5559. https://doi.org/10.3390/s21165559
Chicago/Turabian StyleYu, Hong, Shentong Ji, Xiangyan Luo, and Quan Xie. 2021. "Technology CAD (TCAD) Simulations of Mg2Si/Si Heterojunction Photodetector Based on the Thickness Effect" Sensors 21, no. 16: 5559. https://doi.org/10.3390/s21165559
APA StyleYu, H., Ji, S., Luo, X., & Xie, Q. (2021). Technology CAD (TCAD) Simulations of Mg2Si/Si Heterojunction Photodetector Based on the Thickness Effect. Sensors, 21(16), 5559. https://doi.org/10.3390/s21165559

