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Journal: Sensors, 2015
Volume: 15
Number: 29885

Article: Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems
Authors: by Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, Takeshi Kawano, Makoto Ishida and Ippei Akita
Link: https://www.mdpi.com/1424-8220/15/12/29885

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