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Journal: Sensors, 2015
Volume: 15
Number: 29885
Article:
Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems
Authors:
by
Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, Takeshi Kawano, Makoto Ishida and Ippei Akita
Link:
https://www.mdpi.com/1424-8220/15/12/29885
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