Okabe, K.; Jeewan, H.P.; Yamagiwa, S.; Kawano, T.; Ishida, M.; Akita, I.
Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems. Sensors 2015, 15, 31821-31832.
https://doi.org/10.3390/s151229885
AMA Style
Okabe K, Jeewan HP, Yamagiwa S, Kawano T, Ishida M, Akita I.
Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems. Sensors. 2015; 15(12):31821-31832.
https://doi.org/10.3390/s151229885
Chicago/Turabian Style
Okabe, Kenji, Horagodage Prabhath Jeewan, Shota Yamagiwa, Takeshi Kawano, Makoto Ishida, and Ippei Akita.
2015. "Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems" Sensors 15, no. 12: 31821-31832.
https://doi.org/10.3390/s151229885
APA Style
Okabe, K., Jeewan, H. P., Yamagiwa, S., Kawano, T., Ishida, M., & Akita, I.
(2015). Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems. Sensors, 15(12), 31821-31832.
https://doi.org/10.3390/s151229885
