Search Results (47)

We present THz direct detectors based on an AlGaN/GaN high electron mobility transistor (HEMT), featuring excellent optical sensitivity and low noise-equivalent power (NEP). These detectors are monolithically integrated with various antenna designs and exhibit state-of-the-art performance at room temperature. Their architecture enables straightforward scaling to two-dimensional formats, paving the way for terahertz focal plane arrays (FPAs). In particular, for one detector type, a fully realized THz FPA has been demonstrated in this paper. Theoretical and experimental characterizations are provided for both single-pixel detectors (0.1–1.5 THz) and the FPA (0.1–1.1 THz). The broadband single detectors achieve optical sensitivities exceeding 20 mA/W up to 1 THz and NEP values below 100 pW/$\sqrt{\mathrm{Hz}}$. The best optical NEP is below 10 pW/$\sqrt{\mathrm{Hz}}$ at 175 GHz. The reported sensitivity and NEP values were achieved including antenna and optical coupling losses, underlining the excellent overall performance of the detectors. Full article

This paper proposes a compact 2 × 2 on-chip microstrip antenna array operating for W-band applications. The design utilizes a low-loss glass substrate to mitigate dielectric losses and integrates an embedded feeding structure with wideband T-junction power dividers, addressing bandwidth limitations and feed network losses in conventional approaches. Experimental results demonstrate a relative bandwidth of 10.1% (76.11–83.87 GHz) with gain exceeding 10 dBi across the bandwidth, closely aligning with simulated predictions. This work provides a cost-effective solution for millimeter-wave and terahertz antenna systems, balancing high-performance requirements with fabrication simplicity for automotive radar and 5G/6G communication applications. Full article

Recent advancements in hybrid photonic integrated circuits (PICs) for wireless communications are reviewed, with a focus on innovations developed at Fraunhofer HHI. This work leverages hybrid integration technology, which combines indium phosphide (InP) active elements, silicon nitride (Si₃N₄) low-loss waveguides, and high-efficient thermal-optical tunable polymers with micro-optical functions to achieve fully integrated wireless transceivers. Key contributions include (1) On-chip optical injection locking for generating phase-locked optical beat notes at 45 GHz, enabled by cascaded InP phase modulators and hybrid InP/polymer tunable lasers with a 3.8 GHz locking range. (2) Waveguide-integrated THz emitters and receivers, featuring photoconductive antennas (PCAs) with a 22× improved photoresponse compared to top-illuminated designs, alongside scalable 1 × 4 PIN-PD and PCA arrays for enhanced power and directivity. (3) Beam steering at 300 GHz using a polymer-based optical phased array (OPA) integrated with an InP antenna array, achieving continuous steering across 20° and a 10.6 dB increase in output power. (4) Demonstration of fully integrated hybrid wireless transceiver PICs combining InP, Si₃N₄, and polymer material platforms, validated through key component characterization, on-chip optical frequency comb generation, and coherent beat note generation at 45 GHz. These advancements result in compact form factors, reduced power consumption, and enhanced scalability, positioning PICs as an enabling technology for future high-speed wireless networks. Full article

This paper presents a compact on-chip multiple-input multiple-output (MIMO) antenna designed for future communication systems, featuring frequency-agile elements. The antenna achieves enhanced decoupling and reduced cross-section through the integration of a metasurface, which also introduces frequency agility. Designed for the millimeter-wave band using low-loss BenzoCycloButene (BCB) polymer, the antenna is manufactured with microelectronic processes, and the dimensions are 7.54 × 7.54 × 0.055 mm³. Simulations and measurements demonstrate excellent frequency agility around 60 GHz, with gains of 6.5 to 9 dBi. As a proof of concept, open and short circuits were used for switching, with future designs aiming to incorporate diodes for a full dynamic reconfiguration. This work highlights the potential for compact, high-performance, and frequency-reconfigurable on-chip antennas in next-generation millimeter-wave systems. Full article

This paper presents a circularly polarized on-chip antenna (OCA) operating in the D-band for a fully integrated bidirectional transceiver in TSMC 40 nm bulk CMOS process. Circular polarization is achieved by arranging two pairs of antennas in an orthogonal configuration. The target design at 145 GHz features a compact hybrid structure that integrates a bowtie antenna with a PCB package. This configuration not only shields the antenna from environmental interference but also improves its radiation efficiency. The proposed OCA demonstrates a simulated gain of −1.4 dBi and a radiation efficiency of 32% at 145 GHz, along with a compact footprint of 0.4 × 0.4 mm². To further enhance radiation efficiency and gain, the antenna elements are integrated into chip arrays. The OCA design presented in this work addresses key objectives in system design, including compactness, cost-effectiveness, and compatibility with existing technologies. Full article

The rise of artificial intelligence (AI) necessitates ultra-fast computing, with on-chip terahertz (THz) communication emerging as a key enabler. It offers high bandwidth, low power consumption, dense interconnects, support for multi-core architectures, and 3D circuit integration. However, transitioning between different waveguides remains a major challenge in THz systems. In this paper, we propose a THz band mode converter that converts from a rectangular waveguide (RWG) (WR-0.43) in ${\mathrm{TE}}_{10}$ mode to a substrate-integrated waveguide (SIW) in ${\mathrm{TE}}_{20}$ mode. The converter comprises a tapered waveguide, a widened waveguide, a zigzag antenna, and an aperture coupling slot. The zigzag antenna effectively captures the electromagnetic (EM) energy from the RWG, which is then coupled to the aperture slot. This coupling generates a quasi-slotline mode for the electric field (E-field) along the longitudinal side of the aperture, exhibiting odd symmetry akin to the SIW’s ${\mathrm{TE}}_{20}$ mode. Consequently, the ${\mathrm{TE}}_{20}$ mode is excited in the symmetrical plane of the SIW and propagates transversely. Our work details the mode transition principle through simulations of the EM field distribution and model optimization. A back-to-back RWG ${\mathrm{TE}}_{10}{\mathrm{-to-TE}}_{10}$ mode converter is designed, demonstrating an insertion loss of approximately 5 dB over the wide frequency range band of 2.15–2.36 THz, showing a return loss of 10 dB. An on-chip antenna is proposed which is fed by a single higher-order mode of the SIW, achieving a maximum gain of 4.49 dB. Furthermore, a balun based on the proposed converter is designed, confirming the presence of the ${\mathrm{TE}}_{20}$ mode in the SIW. The proposed mode converter demonstrates its feasibility for integration into a THz-band high-speed circuit due to its efficient mode conversion and compact planar design. Full article

This paper addresses the increasing demand for computing power and the challenges associated with adding more core units to a computer processor. It explores the utilization of System-on-Chip (SoC) technology, which integrates Terahertz (THz) wave communication capabilities for intra- and inter-chip communication, using the concept of Wireless Network-on-Chips (WNoCs). Various types of network topologies are discussed, along with the disadvantages of wired networks. We explore the idea of applying wireless connections among cores and across the chip. Additionally, we describe the WNoC architecture, the flip-chip package, and the THz antenna. Electromagnetic fields are analyzed using a full-wave simulation software, Ansys High Frequency Structure Simulator (HFSS). The simulation is conducted with dipole and zigzag antennas communicating within the chip at resonant frequencies of 446 GHz and 462.5 GHz, with transmission coefficients of around −28 dB and −33 to −41 dB, respectively. Transmission coefficient characterization, path loss analysis, a study of electric field distribution, and a basic link budget for transmission are provided. Furthermore, the feasibility of calculated transmission power is validated in cases of high insertion loss, ensuring that the achieved energy expenditure is less than 1 pJ/bit. Finally, employing a similar setup, we study intra-chip communication using the same antennas. Simulation results indicate that the zigzag antenna exhibits a higher electric field magnitude compared with the dipole antenna across the simulated chip structure. We conclude that transmission occurs through reflection from the ground plane of a printed circuit board (PCB), as evidenced by the electric field distribution. Full article

We review dielectric resonator antenna (DRA) designs. This review examines recent advancements across several categories, specifically focusing on their applicability in array configurations for millimeter-wave (mmW) bands, particularly in the context of 5G and beyond 5G applications. Notably, the off-chip DRA designs, including in-substrate and compact DRAs, have gained prominence in recent years. This surge in popularity can be attributed to the rapid development of cost-effective multilayer laminate manufacturing techniques, such as printed circuit boards (PCBs) and low-temperature co-fired ceramic (LTCC). Furthermore, there is a growing demand for DRAs with beam-steering, dual-band functions, and on-chip alignment availability, as they offer versatile alternatives to traditional lossy printed antennas. DRAs exhibit distinct advantages of lower conductive losses and greater flexibility in shapes and materials. We discuss and compare the performances of different DRA designs, considering their material usage, manufacturing feasibility, overall performance, and applications. By exploring the pros and cons of these diverse DRA designs, this review provides valuable insights for researchers in the field. Full article

Recent advancements in terahertz (THz) wave technology have highlighted the criticality of circular-polarization detection, fostering the development of more compact, efficient on-chip THz circular-polarization detectors. In response to this technological imperative, we presented a chiral-antenna-integrated GaAs/AlGaAs quantum well (QW) THz detector. The chiral antenna selectively couples the incident light of a specific circular-polarization state into a surface-plasmon polariton wave that enhances the absorptance of the QWs by a factor of 12 relative to a standard 45° faceted device, and reflects a significant amount of the incident light of the orthogonal circular-polarization state. The circular-polarization selectivity is further enhanced by the QWs with a strong intrinsic anisotropy, resulting in a circular-polarization extinction ratio (CPER) as high as 26 at 6.52 THz. In addition, the operation band of the device can be adjusted by tuning the structural parameters of the chiral structure. Moreover, the device preserves a high performance for oblique incidence within a range of ±5°, and the device architecture is compatible with a focal plane array. This report communicates a promising approach for the development of miniaturized on-chip THz circular-polarization detectors. Full article

This paper presents a comprehensive assessment of the performance of on-chip circularly polarized (CP) circular loop antennas that have been designed and fabricated to operate in the Q/V frequency band. The proposed antenna design incorporates two concentric loops, with the outer loop as the active element and the inner loop enhancing the CP bandwidth. The study utilizes gallium arsenide (GaAs) and silicon carbide (4H-SiC) semiconductor wafer substrates. The measured results highlight the successful achievement of impedance matching at 40 GHz and 44 GHz for the 4H-SiC and GaAs substrates, respectively. Furthermore, both cases yield an axial ratio (AR) of less than 3 dB, with variations in bandwidths and frequency bands contingent upon the dielectric constant of the respective substrate material. Moreover, the outcomes confirm that utilizing 4H-SiC substrates results in a significantly higher radiation efficiency of 95%, owing to lower substrate losses. In pursuit of these findings, a 4-element circularly polarized loop array antenna has been fabricated for operation at 40 GHz, employing a 4H-SiC wafer as a low-loss substrate. The results underscore the antenna’s remarkable performance, exemplified by a broadside gain of approximately 9.7 dBic and a total efficiency of circa 92%. A close agreement has been achieved between simulated and measured results. Full article

Graphene-based Field-Effect Transistors (FETs) integrated with microstrip patch antennas offer a promising approach for terahertz signal radiation. In this study, a dual-stage simulation methodology is employed to comprehensively investigate the device’s performance. The initial stage, executed in MATLAB, delves into charge transport dynamics within a FET under asymmetric boundary conditions, employing hydrodynamic equations for electron transport in the graphene channel. Electromagnetic field interactions are modeled via Finite-Difference Time-Domain (FDTD) techniques. The second stage, conducted in COMSOL Multiphysics, focuses on the microstrip patch antenna’s radiative characteristics. Notably, analysis of the S11 curve reveals minimal reflections at the FET’s resonant frequency of 1.34672 THz, indicating efficient impedance matching. Examination of the radiation pattern demonstrates the antenna’s favorable directional properties. This research underscores the potential of graphene-based FETs for terahertz applications, offering tunable impedance matching and high radiation efficiency for future terahertz devices. Full article

Wound healing is a complex process composed of different stages, which involves extensive communication between the different cellular factors of the extracellular matrix (ECM). The radio frequency electromagnetic field (RF-EMF) has been used to accelerate the wound-healing process and it has been found to enhance cell alignment and mobility. The conventional methods for cell mobility analysis in an electromagnetic field generated by a radiation source are not advisable due to the low-precision, nonuniform distribution of the field, low efficiency of the analysis in batch and the lack of system integration for autonomous on-body operation. Here, a novel and versatile electromagnetic exposure system integrated with a microfluidic chip was fabricated to explore the EMF-induced response. A gradient electromagnetic field in a two-dimensional plane has been successfully established in the microchambers placed along the field line. In this work, by deploying our radiation experiments in vitro, we validated the on-chip monitoring of cell response to exposure. This electromagnetic field was simulated and human amniotic epithelial cells (HAECs) were cultured in different microchambers for continuous exposure to the electromagnetic field excited by a monopole RF antenna (1.8 GHz). New protrusions were generated and an obvious increase in filopodia with the increased field intensity was investigated. Meanwhile, the variation in intracellular Ca²⁺ concentration under the electromagnetic field was examined. The inhibitory effect of the Ca²⁺ circulation was further inspected to reveal the potential downstream signaling pathway in the RF-EMF-related bioassay, suggesting that cytoskeletal dynamics of cells under exposure are highly associated with the EGF receptor (EGFR)-cytoskeleton downstream signaling pathway. Finally, the field-induced cell elongation and alignment parallel to the field direction were observed. Additionally, the subsequent recovery (field withdrawal) and re-establishment (field re-exposure) were explored. These results indicated that this reliable and versatile exposure system for bioassay could achieve precise and high-throughput detection of the RF-EMF-induced cytoskeletal reorganization in vitro and evaluate the possible health risk from RF-EMF exposure. Full article

LiDAR has attracted increasing attention because of its strong anti-interference ability and high resolution. Traditional LiDAR systems rely on discrete components and face the challenges of high cost, large volume, and complex construction. Photonic integration technology can solve these problems and achieve high integration, compact dimension, and low-cost on-chip LiDAR solutions. A solid-state frequency-modulated continuous-wave LiDAR based on a silicon photonic chip is proposed and demonstrated. Two sets of optical phased array antennas are integrated on an optical chip to form a transmitter–receiver interleaved coaxial all-solid-state coherent optical system which provides high power efficiency, in principle, compared with a coaxial optical system using a 2 × 2 beam splitter. The solid-state scanning on the chip is realized by optical phased array without a mechanical structure. A 32-channel transmitter–receiver interleaved coaxial all-solid-state FMCW LiDAR chip design is demonstrated. The measured beam width is 0.4° × 0.8°, and the grating lobe suppression ratio is 6 dB. Preliminary FMCW ranging of multiple targets scanned by OPA was performed. The photonic integrated chip is fabricated on a CMOS-compatible silicon photonics platform, providing a steady path to the commercialization of low-cost on-chip solid-state FMCW LiDAR. Full article

Optical Wireless Networks on-Chip are an emerging technology recently proposed to improve the interconnection between different processing units in densely integrated computing architectures. In this work, we propose a 4 × 4 optical wireless switch (OWS) based on optical phased arrays (OPAs) for broadband reconfigurable on-chip communication. The OPA and OWS design criteria are reported. Moreover, the performances of the OWS are analyzed and optimized considering the electromagnetic propagation in on-chip multilayer structures, with different thicknesses of the cladding layer. The effect on the OWS behavior of a non-ideal distribution of the power in input to the OPA is also investigated by designing a 1 × 7 beam splitter, based on a single-stage multi-mode interference (MMI) device to be used as a single element of the OWS. Then, the MMI output signals are considered in input to the transmitting OPAs and the OWS performances are evaluated. Full article

Optical on-chip wireless interconnection is an emerging technology that aims to overcome the communication bottleneck in computing architectures and in which multiple processing units are exploited for data-intensive applications. In this work, we propose an integrated dielectric Vivaldi antenna, which exhibits the same gain performances for both TE and TM input polarizations. Point-to-point on-chip communication links between two Vivaldi antennas are analyzed. Moreover, the effect of wave polarization on the link performances is numerically studied in on-chip multilayer structures in connection with the multilayer characteristic parameters, i.e., cladding layer thickness and refractive index. The numerical results show that, with the same antenna gain, TM polarization is affected by lower propagation losses when suitable cladding layer thickness and refractive index are considered. Full article