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Search Results (29)

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Keywords = flexible printed circuit board (FPCB)

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12 pages, 3129 KiB  
Article
Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards
by Seonwoo Kim, Suin Chae, Mirae Seo, Yubin Kim, Soobin Park, Sehoon Park and Hyunjin Nam
Micro 2025, 5(2), 23; https://doi.org/10.3390/micro5020023 - 3 May 2025
Viewed by 881
Abstract
This study presents the development of a modified polyimide (MPI) with low dielectric properties and low-temperature curing capability for high-frequency flexible printed circuit boards (FPCBs). MPI was cured using dicumyl peroxide (DCP) at 80–140 °C through a radical process optimized via DSC analysis, [...] Read more.
This study presents the development of a modified polyimide (MPI) with low dielectric properties and low-temperature curing capability for high-frequency flexible printed circuit boards (FPCBs). MPI was cured using dicumyl peroxide (DCP) at 80–140 °C through a radical process optimized via DSC analysis, while Fourier-transform infrared (FT-IR) confirmed the elimination of C=C bonds and the formation of imide structures. The MPI film exhibited low dielectric constants (Dk) of 1.759 at 20 GHz and 1.734 at 28 GHz, with ultra-low dissipation factors (Df) of 0.00165 and 0.00157. High-frequency S-parameter evaluations showed an excellent performance, with S11 of −32.92 dB and S21 of approximately −1 dB. Mechanical reliability tests demonstrated a strong peel strength of 0.8–1.2 kgf/mm (IPC TM-650 2.4.8 standard) and stable electrical resistance during bending to ~6 mm radius, with full recovery after severe deformation. These results highlight MPI’s potential as a high-performance dielectric material for next-generation FPCBs, combining superior electrical performance, mechanical flexibility, and compatibility with low-temperature processing. Full article
(This article belongs to the Section Microscale Engineering)
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13 pages, 3031 KiB  
Communication
Enhancing Flexible Neural Probe Performance via Platinum Deposition: Impedance Stability under Various Conditions and In Vivo Neural Signal Monitoring
by Daerl Park, Hyeonyeong Jeong, Jungsik Choi, Juyeon Han, Honglin Piao, Jaehyun Kim, Seonghoon Park, Mingu Song, Dowoo Kim, Jaesuk Sung, Eunji Cheong and Heonjin Choi
Micromachines 2024, 15(8), 1058; https://doi.org/10.3390/mi15081058 - 22 Aug 2024
Cited by 1 | Viewed by 1715
Abstract
Monitoring neural activity in the central nervous system often utilizes silicon-based microelectromechanical system (MEMS) probes. Despite their effectiveness in monitoring, these probes have a fragility issue, limiting their application across various fields. This study introduces flexible printed circuit board (FPCB) neural probes characterized [...] Read more.
Monitoring neural activity in the central nervous system often utilizes silicon-based microelectromechanical system (MEMS) probes. Despite their effectiveness in monitoring, these probes have a fragility issue, limiting their application across various fields. This study introduces flexible printed circuit board (FPCB) neural probes characterized by robust mechanical and electrical properties. The probes demonstrate low impedance after platinum coating, making them suitable for multiunit recordings in awake animals. This capability allows for the simultaneous monitoring of a large population of neurons in the brain, including cluster data. Additionally, these probes exhibit no fractures, mechanical failures, or electrical issues during repeated-bending tests, both during handling and monitoring. Despite the possibility of using this neural probe for signal measurement in awake animals, simply applying a platinum coating may encounter difficulties in chronic tests and other applications. Furthermore, this suggests that FPCB probes can be advanced by any method and serve as an appropriate type of tailorable neural probes for monitoring neural systems in awake animals. Full article
(This article belongs to the Special Issue Biosensors for Diagnostic and Detection Applications, 2nd Edition)
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14 pages, 3667 KiB  
Communication
Wireless Temperature Measurement for Curved Surfaces Based on AlN Surface Acoustic Wave Resonators
by Huali Liu, Zhixin Zhou and Liang Lou
Micromachines 2024, 15(5), 562; https://doi.org/10.3390/mi15050562 - 25 Apr 2024
Cited by 4 | Viewed by 1503
Abstract
In this paper, we propose a novel method for temperature measurement using surface acoustic wave (SAW) temperature sensors on curved or irregular surfaces. We integrate SAW resonators onto flexible printed circuit boards (FPCBs) to ensure better conformity of the temperature sensor with the [...] Read more.
In this paper, we propose a novel method for temperature measurement using surface acoustic wave (SAW) temperature sensors on curved or irregular surfaces. We integrate SAW resonators onto flexible printed circuit boards (FPCBs) to ensure better conformity of the temperature sensor with the surface of the object under test. Compared to traditional rigid PCBs, FPCBs offer greater dynamic flexibility, lighter weight, and thinner thickness, which make them an ideal choice for making SAW devices working for temperature measurements under curved surfaces. We design a temperature sensor array consisting of three devices with different operating frequencies to measure the temperature at multiple points on the surface of the object. To distinguish between different target points in the sensor array, each sensor operates at a different frequency, and the operating frequency bands do not overlap. This differentiation is achieved using Frequency Division Multiple Access (FDMA) technology. Experimental results indicate that the frequency temperature coefficients of these sensors are −30.248 ppm/°C, −30.195 ppm/°C, and −30.115 ppm/°C, respectively. In addition, the sensor array enables wireless communication via antenna and transceiver circuits. This innovation heralds enhanced adaptability and applicability for SAW temperature sensor applications. Full article
(This article belongs to the Special Issue Micro/Nano Sensors: Fabrication and Applications)
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11 pages, 5269 KiB  
Article
Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma
by Chenggang Jin, Chen Wang, Shitao Song, Yongqi Zhang, Jie Wan, Liang He, Ziping Qiao and Peng E
Materials 2023, 16(18), 6214; https://doi.org/10.3390/ma16186214 - 14 Sep 2023
Cited by 8 | Viewed by 1596
Abstract
Polyimide (PI) films are widely used in electronic devices owing to their excellent mechanical and electrical properties and high thermal and chemical stabilities. In particular, PI films play an important role in flexible printed circuit boards (FPCBs). However, one challenge currently faced with [...] Read more.
Polyimide (PI) films are widely used in electronic devices owing to their excellent mechanical and electrical properties and high thermal and chemical stabilities. In particular, PI films play an important role in flexible printed circuit boards (FPCBs). However, one challenge currently faced with their use is that the adhesives used in FPCBs cause a high dielectric loss in high-frequency applications. Therefore, it is envisioned that PI films with a low dielectric loss and Cu films can be used to prepare two-layer flexible copper-clad laminates (FCCLs) without any adhesive. However, the preparation of ultra-thin FCCLs with no adhesives is difficult owing to the low peel strength between PI films and Cu films. To address this technical challenge, an FCCL with no adhesive was prepared via high-power helicon wave plasma (HWP) treatment. Field-emission scanning electron microscopy (FE-SEM), X-ray photoelectron spectroscopy (XPS), and X-ray diffraction (XRD) were tested. Also, the surface roughness of the PI film and the peel strength between the PI film and Cu film were measured. The experimental results show that the surface roughness of the PI film increased by 40–65% and the PI film demonstrated improved adhesion (the peel strength was >8.0 N/cm) with the Cu film following plasma treatment and Cu plating. Full article
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23 pages, 10838 KiB  
Article
A Period Energy Method for Demagnetization Detection in Surface Permanent Magnet Motors with Search Coils
by Wen Huang, Junquan Chen, Wu Su, Haitao Liu, Ke Lv and Jinghua Hu
Electronics 2023, 12(16), 3514; https://doi.org/10.3390/electronics12163514 - 19 Aug 2023
Cited by 1 | Viewed by 1663
Abstract
Irreversible demagnetization of permanent magnets (PMs) in PM synchronous motors (PMSMs) degrades the performance and efficiency of a machine and its drive system. There are numerous fault diagnosis methods for detecting demagnetization under steady-state conditions. However, only a few works could be found [...] Read more.
Irreversible demagnetization of permanent magnets (PMs) in PM synchronous motors (PMSMs) degrades the performance and efficiency of a machine and its drive system. There are numerous fault diagnosis methods for detecting demagnetization under steady-state conditions. However, only a few works could be found on fault diagnosis under dynamic conditions, whereas the dynamic operation of a motor is a very common scenario, e.g., electric vehicles. The voltage and current signal-based traditional fault detection method is not only affected by the structure of the motor, but it also becomes complicated to extract signals involving fault characteristics. Hence, this paper proposes a search coil-based online method for detecting demagnetization faults in PMSMs under dynamic conditions, which are not affected by the motor structure. To gather the flux of the stator tooth, flexible Printed circuit board (FPCB) search coils are positioned at the stator slot. The search coil is made up of two branches that are one pole apart and arranged in reverse sequence. In this installation option, the output signal in the fault state cannot be eliminated, and the output signal in the health state is zero. This paper defines only that characteristic value related to the position angle of the rotor. Further, the aim was to simultaneously eliminate the influence of elements like the search coil installation error and the inherent dispersion of the permanent magnet on the detection results. To characterize the fault degree, the measurement differential between the health state and the fault state is further integrated according to a predetermined angle range. Last but not least, speed-independent detection of individual permanent magnet demagnetization faults is possible using rotor position and stator tooth flux. A six-phase PMSM was used in experiments to show the efficiency of the suggested approach. The findings of the experiment demonstrate that the suggested strategy may precisely ascertain when a defect will occur. Full article
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13 pages, 4108 KiB  
Article
Enhancing Artifact Protection in Smart Transportation Monitoring Systems via a Porous Structural Triboelectric Nanogenerator
by Jiabin Zhang, Erming Su, Chengyu Li, Shuxing Xu, Wei Tang, Leo N.Y. Cao, Ding Li and Zhong Lin Wang
Electronics 2023, 12(14), 3031; https://doi.org/10.3390/electronics12143031 - 10 Jul 2023
Cited by 6 | Viewed by 2199
Abstract
Artifacts are irreplaceable treasures of human culture, and transportation monitoring is critical for safeguarding valuable artifacts against damage during culture exchanges. However, current collision-monitoring technologies have limitations in regard to real-time monitoring, cushioning protection, and power supply requirements. Here, we present a method [...] Read more.
Artifacts are irreplaceable treasures of human culture, and transportation monitoring is critical for safeguarding valuable artifacts against damage during culture exchanges. However, current collision-monitoring technologies have limitations in regard to real-time monitoring, cushioning protection, and power supply requirements. Here, we present a method for constructing a smart artifact-monitoring system (SAMS) based on a porous carbon black (CB)/Ecoflex triboelectric nanogenerator (PCE-TENG) that can monitor collisions in real time and absorb vibrations during artifact transportation. The PCE-TENG is assembled using a flexible printed circuit board (FPCB) and a porous Ecoflex layer with CB powder. It exhibits cushioning protection, stretchability, pressure sensitivity, and durability. To enhance its electrical output, modifications were made to optimize the CB content and surface structure. The SAMS comprises six PCE-TENGs attached to the inner wall of the artifact transport package and enables collision monitoring and protection in different directions. Moreover, the SAMS has the capability to instantly transmit warning information to monitoring terminals in the event of improper operations, empowering carriers to promptly and efficiently safeguard artifacts by taking necessary measures. This paper presents a practical strategy for artifact transportation monitoring and package engineering that could have significant implications for the field. Full article
(This article belongs to the Special Issue Nanogenerators for Energy Harvesting and Self-Powered Sensing)
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13 pages, 5147 KiB  
Article
Investigation into Photolithography Process of FPCB with 18 µm Line Pitch
by Ke Sun, Gai Wu, Kang Liang, Bin Sun and Jian Wang
Micromachines 2023, 14(5), 1020; https://doi.org/10.3390/mi14051020 - 10 May 2023
Cited by 2 | Viewed by 2816
Abstract
Due to the widespread application of flexible printed circuit boards (FPCBs), attention is increasing being paid to photolithography simulation with the continuous development of ultraviolet (UV) photolithography manufacturing. This study investigates the exposure process of an FPCB with an 18 µm line pitch. [...] Read more.
Due to the widespread application of flexible printed circuit boards (FPCBs), attention is increasing being paid to photolithography simulation with the continuous development of ultraviolet (UV) photolithography manufacturing. This study investigates the exposure process of an FPCB with an 18 µm line pitch. Using the finite difference time domain method, the light intensity distribution was calculated to predict the profiles of the developed photoresist. Moreover, the parameters of incident light intensity, air gap, and types of media that significantly influence the profile quality were studied. Using the process parameters obtained by photolithography simulation, FPCB samples with an 18 µm line pitch were successfully prepared. The results show that a higher incident light intensity and a smaller air gap result in a larger photoresisst profile. Better profile quality was obtained when water was used as the medium. The reliability of the simulation model was validated by comparing the profiles of the developed photoresist via four experimental samples. Full article
(This article belongs to the Special Issue Advanced Micro- and Nano-Manufacturing Technologies)
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15 pages, 6331 KiB  
Article
Development of Low-Contact-Impedance Dry Electrodes for Electroencephalogram Signal Acquisition
by Ramona B. Damalerio, Ruiqi Lim, Yuan Gao, Tan-Tan Zhang and Ming-Yuan Cheng
Sensors 2023, 23(9), 4453; https://doi.org/10.3390/s23094453 - 2 May 2023
Cited by 9 | Viewed by 6753
Abstract
Dry electroencephalogram (EEG) systems have a short set-up time and require limited skin preparation. However, they tend to require strong electrode-to-skin contact. In this study, dry EEG electrodes with low contact impedance (<150 kΩ) were fabricated by partially embedding a polyimide flexible printed [...] Read more.
Dry electroencephalogram (EEG) systems have a short set-up time and require limited skin preparation. However, they tend to require strong electrode-to-skin contact. In this study, dry EEG electrodes with low contact impedance (<150 kΩ) were fabricated by partially embedding a polyimide flexible printed circuit board (FPCB) in polydimethylsiloxane and then casting them in a sensor mold with six symmetrical legs or bumps. Silver–silver chloride paste was used at the exposed tip of each leg or bump that must touch the skin. The use of an FPCB enabled the fabricated electrodes to maintain steady impedance. Two types of dry electrodes were fabricated: flat-disk electrodes for skin with limited hair and multilegged electrodes for common use and for areas with thick hair. Impedance testing was conducted with and without a custom head cap according to the standard 10–20 electrode arrangement. The experimental results indicated that the fabricated electrodes exhibited impedance values between 65 and 120 kΩ. The brain wave patterns acquired with these electrodes were comparable to those acquired using conventional wet electrodes. The fabricated EEG electrodes passed the primary skin irritation tests based on the ISO 10993-10:2010 protocol and the cytotoxicity tests based on the ISO 10993-5:2009 protocol. Full article
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14 pages, 8922 KiB  
Article
Resolution Enhanced Array ECT Probe for Small Defects Inspection
by Cai Long, Na Zhang, Xinchen Tao, Yu Tao and Chaofeng Ye
Sensors 2023, 23(4), 2070; https://doi.org/10.3390/s23042070 - 12 Feb 2023
Cited by 8 | Viewed by 2246
Abstract
It is a continual and challenging problem to detect small defects in metallic structures for array eddy current testing (ECT) probes, which require the probe to have ultra-high resolution and sensitivity. However, the spatial resolution of an ECT array probe is limited by [...] Read more.
It is a continual and challenging problem to detect small defects in metallic structures for array eddy current testing (ECT) probes, which require the probe to have ultra-high resolution and sensitivity. However, the spatial resolution of an ECT array probe is limited by the size of the induction coils. Even if it is possible to increase the spatial resolution by using smaller coils, the sensitivity of the sensor also decreases. To obtain finer spatial resolution without sacrificing sensitivity, this paper proposes a resolution enhanced ECT array probe with four rows of coils attached to a flexible printed circuit board (FPCB). The distance between each two adjacent coils in a row is 2 mm and the position of each row is offset by 0.5 mm along the horizontal direction related to its prior row. The outputs of the four rows are aligned and interpolated in a line, and in this way the image resolution of the probe is increased to 0.5 mm. The probe is configured to operate with the differential setting, namely two differential coils operate simultaneously at each time. The currents in the two coils can be controlled to have the same flowing direction or opposite flowing direction, resulting in different distributions of the induced eddy current and two sets of output images. A patch-image model and an image fusion method based on discrete wavelet transforms are employed to suppress the noise and highlight the defects’ indications. Experimental results show that small defects with dimensions as small as length × width × depth = 1 mm × 0.1 mm × 0.3 mm on a 304 stainless-steel sample can be detected from the fused image, demonstrating that the probe has super sensitivity for small defects inspection. Full article
(This article belongs to the Section Physical Sensors)
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11 pages, 3343 KiB  
Article
Experimental Characterization of Millimeter-Wave Substrate-Integrated Waveguide Interconnect with Slot Transition in Flexible Printed Circuit Boards
by Myunghoi Kim, Bumhee Bae and Jeongnam Cheon
Electronics 2022, 11(19), 2995; https://doi.org/10.3390/electronics11192995 - 21 Sep 2022
Cited by 3 | Viewed by 2473
Abstract
For high-speed communication services such as 5G technology, the use of millimeter-wave (mmWave) components substantially increases in mobile applications. The interconnect based on a substrate-integrated waveguide (SIW) is an efficient solution for connecting these devices. However, the SIW characteristics in the mmWave frequency [...] Read more.
For high-speed communication services such as 5G technology, the use of millimeter-wave (mmWave) components substantially increases in mobile applications. The interconnect based on a substrate-integrated waveguide (SIW) is an efficient solution for connecting these devices. However, the SIW characteristics in the mmWave frequency range are not sufficiently presented from the practical viewpoint. In this paper, the experimental characterization of mmWave SIWs in flexible printed circuit boards (FPCBs) and their simulation results are presented. A practical method using balanced/single slot transition is proposed for microstrip-to-SIW transition. Using a full-wave simulation and genetic algorithm, the proposed slot technique is optimized. It is experimentally demonstrated that the cutoff frequency affects the operating band of the SIW differently. The per-unit-length losses of the full-mode and half-mode SIWs are obtained as 0.0375 dB/mm and 0.0609 dB/mm, respectively. Using the measurements, the SIW type effect on the transmission loss is quantitatively analyzed, and the loss is increased up to 62.4% at 39 GHz. Full article
(This article belongs to the Special Issue Advanced RF, Microwave, and Millimeter-Wave Circuits and Systems)
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15 pages, 12927 KiB  
Article
Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package
by Seonho Seok, HyungDal Park, Yong-Jun Kim and Jinseok Kim
Micromachines 2022, 13(8), 1295; https://doi.org/10.3390/mi13081295 - 11 Aug 2022
Cited by 3 | Viewed by 2419
Abstract
This paper presents the mechanical behaviors of different types of polyimide feedthroughs that are frequently used for implantable polymer encapsulation. Implantable packages of electronic devices often comprise circuits mounted on printed circuit boards (PCBs) encapsulated in a biocompatible polymer material, with input/output feedthroughs [...] Read more.
This paper presents the mechanical behaviors of different types of polyimide feedthroughs that are frequently used for implantable polymer encapsulation. Implantable packages of electronic devices often comprise circuits mounted on printed circuit boards (PCBs) encapsulated in a biocompatible polymer material, with input/output feedthroughs for electrical interconnections. The feedthroughs are regarded as essential elements of the reliability of the package since they create inevitable interfaces with the encapsulation materials. Flexible materials are frequently used for feedthroughs owing to their ease of manufacturing; thus, their mechanical properties are crucial as they directly interact with parts of the human body, such as the brain and neurons. For this purpose, tensile tests were performed to characterize the mechanical properties of flexible PCBs (FPCBs) and photosensitive polyimides (PSPIs). Commercial FPCBs and homemade PSPIs of two different thicknesses were subjected to tensile tests for mechanical characterization. The FPCBs showed typical stress–strain curves, while the PSPIs showed brittleness or strain hardening depending on the thickness. The material properties extracted from the tensile tests were used for explicit modeling using the finite element method (FEM) and simulations to assess mechanical behaviors, such as necking and strain hardening. Full article
(This article belongs to the Special Issue MEMS Packaging Technologies and 3D Integration, 2nd Edition)
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11 pages, 6103 KiB  
Article
Analysis of Microstrip Line with Asymmetric Arch Type Cross-Sectional Structure Using Micro Pattern Transfer Printing Method
by Seungmin Woo, Jaehyeok Choi, Kwangjong Choi, Bokyeong Kang, Hwasun Park and Youngoo Yang
Sensors 2022, 22(15), 5613; https://doi.org/10.3390/s22155613 - 27 Jul 2022
Cited by 1 | Viewed by 2144
Abstract
This paper presents the manufacturing procedure and electrical properties of a microstrip line on flexible printed circuit boards (FPCBs) fabricated using the micro pattern transfer printing (MPTP) method for millimeter wave band application. The MPTP method presented herein is compared to the conventional [...] Read more.
This paper presents the manufacturing procedure and electrical properties of a microstrip line on flexible printed circuit boards (FPCBs) fabricated using the micro pattern transfer printing (MPTP) method for millimeter wave band application. The MPTP method presented herein is compared to the conventional FPCB process based on the degree of insertion loss as it pertains to the cross-sectional shape of the formed microstrip line. Electromagnetic field simulations were performed to confirm that the cross-sectional arch shape fabricated by the MPTP process reduces insertion loss in the high-frequency band. Based on the simulation, the microstrip transmission line was optimized to a width of 217 µm and a length of 30 cm, fabricated on a 50 µm thick poly-cyclohexylene dimethylene terephthalate (PCT) substrate to measure the insertion loss. The insertion loss fabricated using the MPTP method is measured as 0.37 dB/cm at 10 GHz, while the conventional FPCB is measured as 0.66 dB/cm. Through the analysis, it was confirmed that the FPCBs manufactured by the MPTP process show lower insertion loss compared to the conventional FPCBs. Full article
(This article belongs to the Section Electronic Sensors)
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14 pages, 6086 KiB  
Article
ZnO and AZO Film Potentiometric pH Sensors Based on Flexible Printed Circuit Board
by Po-Hui Yang, Ying-Sheng Chang and Che-Tsung Chan
Chemosensors 2022, 10(8), 293; https://doi.org/10.3390/chemosensors10080293 - 26 Jul 2022
Cited by 15 | Viewed by 2577
Abstract
In this study, we deposited zinc oxide (ZnO) and aluminum-doped zinc oxide (AZO) on the electroless nickel immersion gold (ENIG) of a flexible printed circuit board (FPCB) as a potentiometric pH sensor. The sensing films of the pH sensor were fabricated by a [...] Read more.
In this study, we deposited zinc oxide (ZnO) and aluminum-doped zinc oxide (AZO) on the electroless nickel immersion gold (ENIG) of a flexible printed circuit board (FPCB) as a potentiometric pH sensor. The sensing films of the pH sensor were fabricated by a radio frequency (RF) sputtering system and analyzed by field emission scanning electron microscope (FE-SEM) and X-ray photoelectron spectroscopy (XPS). In the pH 2 to 10 buffer solutions, it was observed that the characteristics of the pH sensor through the voltage–time (V-T) measurement system include average sensitivity and linearity, drift effect, and repeatability. According to the experimental results, the pH sensors in this study could exhibit good characteristics. Full article
(This article belongs to the Section Electrochemical Devices and Sensors)
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13 pages, 2689 KiB  
Article
FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays
by Taemin Lee, Joontaek Jung, Sang-Mok Lee, Jongcheol Park, Jae-Hyeong Park, Kyung-Wook Paik and Hyunjoo J. Lee
Sensors 2022, 22(15), 5557; https://doi.org/10.3390/s22155557 - 25 Jul 2022
Cited by 8 | Viewed by 6270
Abstract
An acoustic matching layer is an essential component of an ultrasound transducer to achieve maximum ultrasound transmission efficiency. Here, we develop a flexible printed circuit board (FPCB) with a composite structure consisting of multiple polyimide and copper layers and demonstrate it as a [...] Read more.
An acoustic matching layer is an essential component of an ultrasound transducer to achieve maximum ultrasound transmission efficiency. Here, we develop a flexible printed circuit board (FPCB) with a composite structure consisting of multiple polyimide and copper layers and demonstrate it as a novel acoustic matching layer. With a flexible substrate and robust ACF bonding, the FPCB not only serves as an acoustic matching layer between piezoelectric elements and the surrounding medium but also as a ground for the electrical connection between the transducer array elements and the folded substrate. A 1D linear ultrasound transducer array with the FPCB matching layer exhibits larger output pressure, wider -3dB bandwidth, and higher ultrasound beam intensity compared to that of an ultrasound transducer array with the alumina/epoxy matching layer, which is one of the most commonly applied composite matching layers. The enhanced transmission performance verifies that the proposed FPCB is an excellent matching layer for 1D linear ultrasound transducer arrays. Full article
(This article belongs to the Special Issue Ultrasonic Sensing Technologies)
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15 pages, 2484 KiB  
Article
Flexible Platform of Acoustofluidics and Metamaterials with Decoupled Resonant Frequencies
by Shahrzad Zahertar, Hamdi Torun, Chao Sun, Christopher Markwell, Yinhua Dong, Xin Yang and Yongqing Fu
Sensors 2022, 22(12), 4344; https://doi.org/10.3390/s22124344 - 8 Jun 2022
Cited by 5 | Viewed by 3189
Abstract
The key challenge for a lab-on-chip (LOC) device is the seamless integration of key elements of biosensing and actuation (e.g., biosampling or microfluidics), which are conventionally realised using different technologies. In this paper, we report a convenient and efficient LOC platform fabricated using [...] Read more.
The key challenge for a lab-on-chip (LOC) device is the seamless integration of key elements of biosensing and actuation (e.g., biosampling or microfluidics), which are conventionally realised using different technologies. In this paper, we report a convenient and efficient LOC platform fabricated using an electrode patterned flexible printed circuit board (FPCB) pressed onto a piezoelectric film coated substrate, which can implement multiple functions of both acoustofluidics using surface acoustic waves (SAWs) and sensing functions using electromagnetic metamaterials, based on the same electrode on the FPCB. We explored the actuation capability of the integrated structure by pumping a sessile droplet using SAWs in the radio frequency range. We then investigated the hybrid sensing capability (including both physical and chemical ones) of the structure employing the concept of electromagnetic split-ring resonators (SRRs) in the microwave frequency range. The originality of this sensing work is based on the premise that the proposed structure contains three completely decoupled resonant frequencies for sensing applications and each resonance has been used as a separate physical or a chemical sensor. This feature compliments the acoustofluidic capability and is well-aligned with the goals set for a successful LOC device. Full article
(This article belongs to the Special Issue Passive Wireless and Self-Powered Wireless Sensors and Systems)
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