Search Results (27)

In the first part of this study, Y₂O₃-doped copper thiocyanate (CuSCN) with different x wt% (named CuSCN-xY, x = 0, 1, 2, and 3) films were synthesized onto ITO substrates using the spin coating method. UV-vis, SEM, AFM, EDS, and cyclic voltammetry were used to investigate the material properties of the proposed films. The conductivity and carrier mobility of the films increased with additional yttrium doping. It was found that the films with 2% Y₂O₃ (CuSCN-2Y) have the smallest valence band edges (5.28 eV). Meanwhile, CuSCN-2Y films demonstrated the densest surface morphology and the smallest surface roughness (22.8 nm), along with the highest conductivity value of 764 S cm⁻¹. Then, P-I-N self-powered UV photodetectors (PDs) were fabricated using the ITO substrate/ZnO seed layer/ZnO nanorod/CsPbBr₃/CuSCN-xY/Ag structure, and the characteristics of the devices were measured. In terms of response time, the rise time and fall time were reduced from 26 ms/22 ms to 9 ms/5 ms; the responsivity was increased from 243 mA/W to 534 mA/W, and the on/off ratio was increased to 2.47 × 10⁶. The results showed that Y₂O₃ doping also helped improve the P-I-N photodetector’s device performance, and the mechanisms were investigated. Compared with other published P-I-N self-powered photodetectors, our proposed devices show a fairly high on/off ratio, quick response times, and high responsivity and detectivity. Full article

Direct-writing submicron copper circuits on glass with laser precision—without lithography, vacuum deposition, or etching—represents a transformative step in next-generation microfabrication. We present a high-resolution, maskless method for metallizing glass using ultrashort pulse Bessel beam laser processing, followed by silver ion activation and electroless copper plating. The laser-modified glass surface hosts nanoscale chemical defects that promote the in situ reduction of Ag⁺ to metallic Ag⁰ upon exposure to AgNO₃ solution. These silver seeds act as robust catalytic and adhesion sites for subsequent copper growth. Using this approach, we demonstrate circuit traces as narrow as 0.7 µm, featuring excellent uniformity and adhesion. Compared to conventional redistribution-layer (RDL) and under-bump-metallization (UBM) techniques, this process eliminates multiple lithographic and vacuum-based steps, significantly reducing process complexity and production time. The method is scalable and adaptable for applications in transparent electronics, fan-out packaging, and high-density interconnects. Full article

Bone grafting is one of the most used surgical techniques to favor bone regeneration and repair in orthopedic procedures. Despite autografting continuing to be considered the gold standard, allogeneic bone tissues remain a viable alternative albeit in the last decades, only a few studies have been carried out to translate enhanced allogeneic bone grafts into clinical solutions. In this in vitro study, cortical allogeneic bone samples were coated with copper-doped bioactive glass 45S5 (Cu-BG) by means of the pulsed-laser deposition technique to combine the mechanical support and osteoconductive properties of human bone with the osteogenic and pro-angiogenic features of the bioactive material. Contact angle (CA), scanning electron microscopy (SEM), and atomic force microscopy (AFM) measurements were carried out to quantitatively compare the impact on the bone surface properties of the morphological changes induced by the presence of the coating. Specifically, the obtained results have shown a total absorption of the drop on the coated samples. The coating on the bone tissue surface consisted of a homogeneous Cu-BG background layer with micrometric grain-like aggregates on it—a morphological feature that can facilitate osteoblast adhesion and proliferation. Cytotoxicity and cell viability were carried out on Saos-2 osteoblast-like cells, demonstrating the biocompatibility of the novel composite bone tissue and the absence of cytotoxic residuals. Moreover, human bone marrow-derived mesenchymal stem cells (hBMSCs) were seeded on Cu-BG and not-coated (NC) samples to evaluate the bioactivity and their differentiation toward the osteogenic phenotype. Our findings showed the pro-osteogenic and pro-angiogenic potential of Cu-BG coatings, although dynamic changes were observed over time. At seven days, the Cu-BG samples exhibited significantly higher expressions of SP7, SPP1, and BGLAP genes, indicating an enhanced early osteogenic commitment. Moreover, VEGF expression was significantly increased in Cu-BG compared to the control. These results pave the way for the development of an innovative class of bone-based products distributed by tissue banks. Full article

This research, which involved a comprehensive methodology, including depositing electroplated copper on a copper seed layer and Al-doped ZnO (AZO) thin films on textured silicon substrates using DC magnetron sputtering with varying substrate heating, has yielded significant findings. The study thoroughly investigated the effects of substrate temperature (Ts) on copper adhesion strength and morphology using the peel force test and electron microscopy. The peel force test was conducted at angles of 90°, 135°, and 180°. The average adhesion strength was about 0.2 N/mm for the samples without substrate heating. For the samples with substrate heating at 100 °C, the average peeling force of the electroplated copper film was about 1 N/mm. The average peeling force increased to 1.5 N/mm as the substrate heating temperature increased to 200 °C. The surface roughness increases as the annealing temperature of the Cu/AZO/Si sample increases. These findings not only provide a reliable and robust method for applying AZO transparent conductive films onto silicon solar cells but also underscore its potential to significantly enhance the efficiency and durability of solar cells significantly, thereby instilling confidence in the field of solar cell technology. Full article

Copper metal catalyst seeds have recently triggered much research interest for the development of low-cost and high-performance metallic catalysts with industrial applications. Herein, we present metallic Cu catalyst seeds deposited by an atomic layer deposition method on polymer substrates. The atomic layer deposited Cu (ALD-Cu) can ideally substitute noble metals Ag, Au, and Pd to catalyze Cu electroless deposition. The optimized deposition temperature and growth cycles of an ALD-Cu catalyzed seed layer have been obtained to achieve a flexible printed circuit (FPC) with a high performance electroless plating deposited Cu (ELD-Cu) film. The ELD-Cu films on the ALD-Cu catalyst seeds grown display a uniform and dense deposition with a low resistivity of 1.74 μΩ·cm, even in the through via and trench of substates. Furthermore, the ALD-Cu-catalyzed ELD-Cu circuits and LED devices fabricated on treated PI also demonstrate excellent conductive and mechanical features. The remarkable conductive and mechanical characteristics of the ALD-Cu seed catalyzed ELD-Cu process demonstrate its tremendous potential in high-density integrated FPC applications. Full article

With increasing interest in the rapid development of lattice structures, hybrid additive manufacturing (HAM) technology has become a competent alternative to traditional solutions such as water jet cutting and investment casting. Herein, a HAM technology that combines vat photopolymerization (VPP) and electroless/electroplating processes is developed for the fabrication of multifunctional polymer-metal lattice composites. A VPP 3D printing process is used to deliver complex lattice frameworks, and afterward, electroless plating is employed to deposit a thin layer of nickel-phosphorus (Ni-P) conductive seed layer. With the subsequent electroplating process, the thickness of the copper layer can reach 40 μm within 1 h and the resistivity is around $1.9\times {10}^{-8} \mathsf{\Omega }\cdot \mathrm{m}$, which is quite close to pure copper ($1.7 \times {10}^{-8} \mathsf{\Omega }\cdot \mathrm{m}$). The thick metal shell can largely enhance the mechanical performance of lattice structures, including structural strength, ductility, and stiffness, and meanwhile provide current supply capability for electrical applications. With this technology, the frame arms of unmanned aerial vehicles (UAV) are developed to demonstrate the application potential of this HAM technology for fabricating multifunctional polymer-metal lattice composites. Full article

In this work, 3D periodic “grid-type” CuO/Cu₂O layers were fabricated on a copper sheet using laser processing techniques, and the laser processing parameters were optimized for favorable ZnO nanowire growth. It was found that ZnO nanowires could be successfully prepared to form a CuO-Cu₂O-ZnO heterojunction structure without an extra catalyst or seed layer coating, which could be attributed to the copper oxide active sites induced via laser texturing. ZnO nanowires on laser textured “grid-type” copper substrates demonstrated an effective piezocatalytic performance with different morphologies and the generation of abundant reactive oxygen species in the CuO-Cu₂O-ZnO catalytic system, providing a fundamental mechanism for the degradation of organic dye in water. This simple and low-cost method could provide a useful guide for the large-scale efficient and versatile synthesis of immobilized piezoelectric catalysts. Full article

Anode-less batteries are a promising innovation in energy storage technology, eliminating the need for traditional anodes and offering potential improvements in efficiency and capacity. Here, we have fabricated and tested two types of anode-less pouch cells, the first using solely a copper negative current collector and the other the same current collector but coated with a nucleation seed ZnO layer. Both types of cells used the same all-solid-state electrolyte, Li_2.99Ba_0.005ClO composite, in a cellulose matrix and a LiFePO₄ cathode. Direct and indirect methods confirmed Li metal anode plating after charging the cells. The direct methods are X-ray photoelectron spectroscopy (XPS) and laser-induced breakdown spectroscopy (LIBS), a technique not divulged in the battery world but friendly to study the surface of the negative current collector, as it detects lithium. The indirect methods used were electrochemical cycling and impedance and scanning electron microscopy (SEM). It became evident the presence of plated Li on the surface of the current collector in contact with the electrolyte upon charging, both directly and indirectly. A maximum average lithium plating thickness of 2.9 µm was charged, and 0.13 µm was discharged. The discharge initiates from a maximum potential of 3.2 V, solely possible if an anode-like high chemical potential phase, such as Li, would form while plating. Although the ratings and energy densities are minor in this study, it was concluded that a layer of ZnO, even at 25 °C, allows for higher discharge power for more hours than plain Cu. It was observed that where Li plates on ZnO, Zn is not detected or barely detected by XPS. The present anode-less cells discharge quickly initially at higher potentials but may hold a discharge potential for many hours, likely due to the ferroelectric character of the electrolyte. Full article

This study investigated the use of a pure copper seed layer to improve the adhesion strength and reduce the residual stress of electroplated copper films for heterojunction technology in crystalline solar cells. The experiment involved depositing a copper seed layer and an indium tin oxide (ITO) layer on textured silicon using sputtering. This resulted in the formation of a Cu(s)/ITO/Si structure. Following this step, a 10 µm thick copper layer was electroplated onto the Cu(s)/ITO/Si structure. Various characterization techniques were employed to evaluate the electroplated copper films’ microstructures, residual stress, and adhesion strength. The microstructures of the films were examined using a scanning transmission electron microscope (STEM), revealing a twin structure with a grain size of approximately 1 µm. The residual stresses of the as-deposited and annealed samples were measured using an X-ray diffractometer (XRD), yielding values of 76.4 MPa and 49.1 MPa, respectively. The as-deposited sample exhibited higher tension compared to the annealed sample. To assess the adhesion strength of the electroplated copper films, peel-off tests were conducted at a 90° angle with a constant speed of 30 mm/min. The peel force, measured in units of N/mm, was similar for both the as-deposited and annealed samples. Specifically, the peel force for electroplating copper on the copper seed layer on the ITO was determined to be 2.6 N/mm for the maximum value and 2.25 N/mm for the average value. This study demonstrated that using a pure copper seed layer during electroplating can improve adhesion strength and reduce residual stress in copper films for heterojunction technology in crystalline solar cells. These findings contribute to the development of more reliable and efficient solar-cell-manufacturing processes. Full article

In our work, we studied thin nickel films deposited by electroless plating for use as a barrier and seed layer in the through-silicon vias (TSV) technology. El-Ni coatings were deposited on a copper substrate from the original electrolyte and with the use of various concentrations of organic additives in the composition of the electrolyte. The surface morphology, crystal state, and phase composition of the deposited coatings were studied by SEM, AFM, and XRD methods. The El-Ni coating deposited without the use of an organic additive has an irregular topography with rare phenocrysts of globular formations of hemispherical shape and a root mean square roughness value of 13.62 nm. The phosphorus concentration in the coating is 9.78 wt.%. According to the results of the X-ray diffraction studies of El-Ni, the coating deposited without the use of an organic additive has a nanocrystalline structure with an average nickel crystallite size of 2.76 nm. The influence of the organic additive is seen in the smoothening of the samples surface. The root mean square roughness values of the El-Ni sample coatings vary within 2.09–2.70 nm. According to microanalysis data the phosphorus concentration in the developed coatings is ~4.7–6.2 wt.%. The study of the crystalline state of the deposited coatings by X-ray diffraction made it possible to detect two arrays of nanocrystallites in their structure, with average sizes of 4.8–10.3 nm and 1.3–2.6 nm. Full article

The demand for transparent conductive coatings has increased over recent years, leading to the development of various technical solutions. One of the approaches is to use metallic coatings very close to their coalescence thickness, so that a good compromise between transparency and conductivity is obtained. In this contribution, a combination of two elements with high potential in this field is used, namely silver and copper. The continuity of silver films on a dielectric transparent substrate is significantly improved by the addition of a copper seed layer that promotes the formation of a continuous layer at smaller effective thicknesses. Two distinct deposition processes are used for the deposition of the two materials, namely HiPIMS (High Power Impulse magnetron sputtering) for copper and DC sputtering for silver. The use of HiPIMS enables a better control of the structure and quantity of deposited material, allowing us to deposit a very small amount of material. The mono-element coatings are characterized from the optical and electrical point of view, and then mixed to form a structure with better transparency, up to 80% in the visible spectrum, good electrical properties, resistivity of ~2 × 10⁻⁵ (Ω × cm), and significantly lower surface roughness, down to 0.2 nm. Full article

The back-end-of-line (BEOL) copper interconnect structure has been subjected to downscaling for the last two decades, while the materials used for conforming and assuring its physical integrity during processing have faced significant obstacles as the single-digit nanometer process node is implemented. In particular, the diffusion barrier layer system comprised of Ta/TaN has faced major constraints when it comes to the electrical performance of the smaller Cu lines, and thus alternative formulations have been investigated in recent years, such as Ru-Ta or Co-W alloys. In this work, we assess how PVD (physical vapor deposition) deposited equimolar Co-W films perform when exposed to different vacuum annealing temperatures and how these films compare with the Ta adhesion layer used for Cu seeding in terms of dewetting resistance. The stacks were characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) coupled with energy dispersive X-ray spectroscopy (EDX) mapping. The Cu film at the surface of the Cu/Co-W system exhibited grain growth starting at 300 °C, with the formation of abnormally large Cu grains starting at 450 °C. Sheet resistance reached a minimum value of 7.07 × 10⁻⁶ Ω/sq for the Cu/Co-W stack and 6.03 × 10⁻⁶ Ω/sq for the Cu/Ta stack, both for the samples annealed at 450 °C. Full article

Embedded copper mesh coatings with low sheet resistance and high transparency were formed using a low-cost Cu seed mesh obtained with a magnetron sputtering on a cracked template, and subsequent operations electroplating and embedding in a photocurable resin layer. The influence of the mesh size on the optoelectric characteristics and the electromagnetic shielding efficiency in a wide frequency range is considered. In optimizing the coating properties, a shielding efficiency of 49.38 dB at a frequency of 1 GHz, with integral optical transparency in the visible range of 84.3%, was obtained. Embedded Cu meshes have been shown to be highly bending stable and have excellent adhesion strength. The combination of properties and economic costs for the formation of coatings indicates their high prospects for practical use in shielding transparent objects, such as windows and computer monitors. Full article

Herein, we report an approach to prepare Cu/Cu_2−xS core/shell nanorods by in situ sulfidation of copper nanorods. Firstly, copper nanorods with tunable longitudinal surface plasmon resonances were synthesized by a seed-mediated method using Au nanoparticles as seeds. A convenient in situ sulfidation method was then applied to convert the outermost layer of Cu nanorods into Cu_2−xS, to increase their stability and surface activity in photocatalytic applications. The thickness of Cu_2−xS layer can be adjusted by controlling the amount of S source. The Cu/Cu_2−xS core/shell nanorods exhibits two characteristic surface plasmon resonances located in visible and near-infrared regions, respectively. The photocatalytic performances of Cu nanorods and their derivatives were evaluated by measuring the degradation rate of methyl orange dyes. Compared with Cu nanorods, the Cu/Cu_2−xS core/shell nanorods demonstrate more than a 13.6-fold enhancement in the degradation rate at 40 min. This work suggests a new direction for constructing derivative nanostructures of copper nanorods and exploring their applications. Full article

Atomic layer deposition (ALD) of high-κ dielectrics on two-dimensional (2D) materials (including graphene and transition metal dichalcogenides) still represents a challenge due to the lack of out-of-plane bonds on the pristine surfaces of 2D materials, thus making the nucleation process highly disadvantaged. The typical methods to promote the nucleation (i.e., the predeposition of seed layers or the surface activation via chemical treatments) certainly improve the ALD growth but can affect, to some extent, the electronic properties of 2D materials and the interface with high-κ dielectrics. Hence, direct ALD on 2D materials without seed and functionalization layers remains highly desirable. In this context, a crucial role can be played by the interaction with the substrate supporting the 2D membrane. In particular, metallic substrates such as copper or gold have been found to enhance the ALD nucleation of Al₂O₃ and HfO₂ both on monolayer (1 L) graphene and MoS₂. Similarly, uniform ALD growth of Al₂O₃ on the surface of 1 L epitaxial graphene (EG) on SiC (0001) has been ascribed to the peculiar EG/SiC interface properties. This review provides a detailed discussion of the substrate-driven ALD growth of high-κ dielectrics on 2D materials, mainly on graphene and MoS₂. The nucleation mechanism and the influence of the ALD parameters (namely the ALD temperature and cycle number) on the coverage as well as the structural and electrical properties of the deposited high-κ thin films are described. Finally, the open challenges for applications are discussed. Full article