Search Results (10)

Multifunctional nanosurfaces receive growing attention due to their versatile properties. Capillary force lithography (CFL) has emerged as a simple and economical method for fabricating these surfaces. In recent works, the authors proposed to leverage the evolution strategies (ES) to modify nanosurface characteristics with CFL to achieve specific functionalities such as frictional, optical, and bactericidal properties. For artificial intelligence (AI)-driven inverse design, earlier research integrates basic multiphysics principles such as dynamic viscosity, air diffusivity, surface tension, and electric potential with backward deep learning (DL) on the framework of ES. As a successful alternative to reinforcement learning, ES performed well for the AI-driven inverse design. However, the computational limitations of ES pose a critical technical challenge to achieving fast and efficient design. This paper addresses the challenges by proposing a parallel-computing-based ES (named parallel ES). The parallel ES demonstrated the desired speed and scalability, accelerating the AI-driven inverse design of multifunctional nanopatterned surfaces. Detailed parallel ES algorithms and cost models are presented, showing its potential as a promising tool for advancing AI-driven nanomanufacturing. Full article

The use of organic semiconductors in electronic devices, including transistors, sensors, and memories, unlocks innovative possibilities such as streamlined fabrication processes, enhanced mechanical flexibility, and potential new applications. Nevertheless, the increasing technical demand for patterning organic semiconductors requires greater integration and functional implementation. This paper overviews recent efforts to pattern organic semiconductors compatible with electronic devices. The review categorizes the contributions of organic semiconductor patterning approaches, such as surface-grafting polymers, capillary force lithography, wettability, evaporation, and diffusion in organic semiconductor-based transistors and sensors, offering a timely perspective on unconventional approaches to enable the patterning of organic semiconductors with a strong focus on the advantages of organic semiconductor utilization. In addition, this review explores the opportunities and challenges of organic semiconductor-based integration, emphasizing the issues related to patterning and interconnection. Full article

The scientific community has been looking for novel approaches to develop nanostructures inspired by nature. However, due to the complicated processes involved, controlling the height of these nanostructures is challenging. Nanoscale capillary force lithography (CFL) is one way to use a photopolymer and alter its properties by exposing it to ultraviolet radiation. Nonetheless, the working mechanism of CFL is not fully understood due to a lack of enough information and first principles. One of these obscure behaviors is the sudden jump phenomenon—the sudden change in the height of the photopolymer depending on the UV exposure time and height of nano-grating (based on experimental data). This paper uses known physical principles alongside artificial intelligence to uncover the unknown physical principles responsible for the sudden jump phenomenon. The results showed promising results in identifying air diffusivity, dynamic viscosity, surface tension, and electric potential as the previously unknown physical principles that collectively explain the sudden jump phenomenon. Full article

Structural anti-reflective coating and bactericidal surfaces, as well as many other effects, rely on high-aspect-ratio (HAR) micro- and nanostructures, and thus, are of great interest for a wide range of applications. To date, there is no widespread fabrication of dense or isolated HAR nanopillars based on UV nanoimprint lithography (UV-NIL). In addition, little research on fabricating isolated HAR nanopillars via UV-NIL exists. In this work, we investigated the mastering and replication of HAR nanopillars with the smallest possible diameters for dense and isolated arrangements. For this purpose, a UV-based nanoimprint lithography process was developed. Stability investigations with capillary forces were performed and compared with simulations. Finally, strategies were developed in order to increase the stability of imprinted nanopillars or to convert them into nanoelectrodes. We present UV-NIL replication of pillars with aspect ratios reaching up to 15 with tip diameters down to 35 nm for the first time. We show that the stability could be increased by a factor of 58 when coating them with a 20 nm gold layer and by a factor of 164 when adding an additional 20 nm thick layer of SiN. The coating of the imprints significantly improved the stability of the nanopillars, thus making them interesting for a wide range of applications. Full article

Ultraviolet (UV) Nanoimprint Lithography (NIL) is a replication method that is well known for its capability to address a wide range of pattern sizes and shapes. It has proven to be an efficient production method for patterning resist layers with features ranging from a few hundred micrometers and down to the nanometer range. Best results can be achieved if the fundamental behavior of the imprint resist and the pattern filling are considered by the equipment and process parameters. In particular, the material properties and pattern size and shape play a crucial role. For capillary force-driven filling behavior it is important to understand the influencing parameters and respective failure modes in order to optimize the processes for reliable full wafer manufacturing. In this work, the nanoimprint results obtained for different pattern geometries are compared with respect to pattern quality and residual layer thickness: The comprehensive overview of the relevant process parameters is helpful for setting up NIL processes for different nanostructures with minimum layer thickness. Full article

Metallic nanoparticle ensemble, with narrow inter-particle distance, is a useful element for diverse optical devices due to highly enhanced electric field intensity at the gap. Self-assembly of block copolymer (BCP) can provide the versatile solution to fabricate precise nanostructures, but this methodology has the intrinsic limitation to realize optically coupled metallic multimer geometry with narrow inter-particle distance. This is because BCP-based nanotemplate possesses a minimum size limit for interparticle distance imposed by its thermodynamic restriction. Herein, we investigate the facile formation of metallic multimer with scalability and area-selectivity through the collapse of self-assembled BCP nanopattern. The capillary-force-induced collapse phenomenon enables a spatial transformation of lateral regular ordering in metallic nanoparticle array and enhances electric field intensity. The fabrication of this metallic nanoparticle ensemble from BCP lithography is successfully utilized for surface enhanced Raman scattering (SERS). The enhancement factor of metal nanoparticle multimer is calculated as ~6.74 × 10⁵ at 1000 cm⁻¹, 2.04 × 10⁶ at 1022 cm⁻¹, and 6.11 × 10⁶ at 1580 cm⁻¹, respectively. Full article

In this research, a Ni-Fe mold insert for the efficient replication of high aspect-ratio microstructure arrays was fabricated via hard X-ray lithography and an electroforming process. For the X-ray exposure on a photoresist, a gold-based X-ray mask was prepared with conventional UV photolithography. The gold thickness was designed to be over 15 μm to prevent development underneath the absorber and to enhance the adhesion strength between the photoresist and substrate. By using the X-ray mask, a positive-type photoresist was selectively exposed to X-ray under an exposure energy of 4 kJ/cm³. Thereafter, the exposed region was developed in a downward direction to effectively remove the residual photoresist from the substrate. During the evaporation process, deionized water mixed with a surface additive prevented the bending and clustering of the photoresist microstructure arrays by lowering the capillary force, resulting in a defect-free mother structure for electroforming. Lastly, the mother structure was uniformly Ni-Fe electroformed on a conductive substrate without the formation of any pores or detachment from the substrate. Based on the proposed microfabrication process, a Ni-Fe mold insert with a 183 μm pattern size, 68 μm gap size, 550 μm height, 2116 microcavities and a hardness of 585 Hv was precisely manufactured. It can be utilized for the mass production of high aspect ratio metal and ceramic microstructure arrays in micro molding technologies. Full article

In this study, a fabrication method of tapered microstructures with high aspect ratio was proposed by deep X-ray lithography. Tapered microstructures with several hundred micrometers and high aspect ratio are demanded owing to the high applicability in the fields of various microelectromechanical systems (MEMS) such as optical components and microfluidic channels. However, as the pattern and gap size were downsized to smaller micro-scale with higher aspect ratio over 5, microstructures were easily deformed or clustered together due to capillary force during the drying process. Here, we describe a novel manufacturing process of tapered microstructures with high aspect ratio. To selectively block the deep X-ray irradiation, an X-ray mask was prepared via conventional ultraviolet (UV) lithography. A double X-ray exposure process with and without X-ray mask was applied to impose a two-step dose distribution on a photoresist. For the clear removal of the exposed region, the product was developed in the downward direction, which encourages a gravity-induced pulling force as well as a convective transport of the developer. After a drying process with the surface additive, tapered microstructures were successfully fabricated with a pattern size of 130 μm, gap size of 40 μm, and aspect ratio over 7. Full article

In this study, we reported continuous partial curing and tip-shaped modification methods for continuous production of dry adhesive with microscale mushroom-shaped structures. Typical fabrication methods of dry adhesive with mushroom-shaped structures are less productive due to the failure of large tips on pillar during demolding. To solve this problem, a typical pillar structure was fabricated through partial curing, and tip widening was realized through applying the proper pressure. Polyurethane acrylate was used in making the mushroom structure using two-step UV-assisted capillary force lithography (CFL). To make the mushroom structure, partial curing was performed on the micropillar, followed by tip widening. Dry adhesives with properties similar to those of typical mushroom-shaped dry adhesives were fabricated with reasonable adhesion force using the two-step UV-assisted CFL. This production technology was applied to the roll-to-roll process to improve productivity, thereby realizing continuous production without any defects. Such a technology is expected to be applied to various fields by achieving the productivity improvement of dry adhesives, which is essential for various applications. Full article

The design and fabrication of a Micro-electromechanical Systems (MEMS)-based tilted microcoil on a polyimide capillary are reported in this paper, proposed for an electromagnetically-driven single-fiber endoscope scanner application. The parameters of the tilted microcoil were optimized by simulation. It is proved that the largest driving force could be achieved when the tilt-angle, the pitch and the coil turns of the designed microcoil were 60°, 80 µm and 20, respectively. The modal simulation of the designed fiber scanner was carried out. The prototypes of the tilted microcoils were fabricated on the surface of polyimide capillary with 1 mm-diameter using our developed cylindrical projection lithography system. The dimensions of the two tilted microcoils were as follows: one was tilt-angle 45°, line width 10 ± 0.2 µm, coil pitch 78.5 ± 0.5 µm, and the other was tilt-angle 60°, line width 10 ± 0.2 µm, coil pitch 81.5 ± 0.5 µm. Finally, a direct mask-less electroplating process was employed to fabricate the copper microcoil with 15 µm thickness on the gold (Au) seed-layer, and the corresponding line width was expanded to 40 µm. Full article