Search Results (59)

Sintered nano-silver is widely investigated as a die-attach material for next-generation power electronic modules due to its high thermal conductivity, favorable electrical performance, and stability at elevated temperatures. However, how bonding pressure and joint thickness jointly affect densification, interfacial diffusion, and mechanical reliability has not been systematically clarified, especially under the low-pressure conditions required for large-area SiC and GaN devices. In this work, nano-silver lap-shear joints with three bond-line thicknesses (50, 70, and 100 μm) were fabricated under two applied pressures (1.0 and 1.5 MPa) using a controlled sintering fixture. Shear testing and cross-sectional SEM were employed to evaluate the relationships between microstructural evolution and joint integrity. When the bonding pressure was increased from 1.0 to 1.5 MPa, more effective particle rearrangement and reduced pore connectivity were observed, together with improved metallurgical bonding at the Ag–Au interface, leading to a strength increase from 15.3 to 28.2 MPa. Although thicker joints exhibited slightly higher bulk relative density due to greater heat retention and accelerated local sintering, this densification advantage did not lead to improved mechanical performance. Instead, the lower strength of thicker joints is attributed to a narrower Ag–Au interdiffusion region, which limited the formation of continuous load-bearing paths at the interface. Fractographic analyses confirmed that failure occurred predominantly by interfacial delamination rather than cohesive fracture, indicating that the reliability of the joints under low-pressure sintering is governed by the quality of interfacial bonding rather than by overall densification. The experimental results show that, under low-pressure sintering conditions (1.0–1.5 MPa), variations in bonding pressure and bond-line thickness lead to distinct effects on joint performance, with the extent of Ag–Au interfacial interaction playing a key role in determining the mechanical robustness of the joints. Full article

We have fabricated amorphous tin oxide (a-SnO_x) thin-film transistors (TFTs) with Al₂O₃ gate insulator from deep eutectic solvents (DESs). DESs were formed using the chloride derivates of each precursor (SnCl₂, or AlCl₃) mixed with urea. The DESs were then used as precursors for the semiconductor and dielectric. Our target was to form extremely thin semiconductor film, and a sufficient high capacitance insulator. We characterized the physical and chemical properties of the DES-derived thin films by X-ray diffraction (XRD), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). We could evaluate that the highest content of metal–oxygen bonds was from the DES condition SnCl₂–urea = 1:3. At a low 300 °C budget temperature, we could fabricate a 3.2 nm thick a-SnO_x layer and 30 nm thick Al₂O₃, from which the TFT demonstrated a mobility of 80 ± 17 cm²/Vs, threshold voltage of −0.29 ± 0.06 V, and subthreshold swing of 88 ± 11 mV/dec. The proposed process is adequate with the back-end of the line (BEOL) process, but it is also eco-friendly because of the use of DESs. Full article

This article presents the results of research on the possibility of extruding oxygen-free copper pipes in bridge dies. The possibility of continuous production of a finished product of any length with a uniformly deformed wall was analysed. One of the most important elements of the work was to determine the shape of the tool (die and bridge) that would allow durable connection of the material. Numerical studies conducted using the commercial computer programme FORGE^®NxT 2.1, including analysis of the distribution of material temperature and hydrostatic pressure in the welding zone of the bridge die affecting the copper joint during the manufacture of tubular profiles, confirmed the validity of the research issue. The results of the numerical studies were supplemented by laboratory tests, confirming the accuracy of the selected variant of the finished product manufacturing process. The process of bonding under conditions of two-part material compression was used for physical modelling of copper welding. The tests were conducted using the Gleeble 3800 metallurgical process simulator with the PocketJaw module. Based on the analysis of the obtained results, it was found that for tubes with a wall-thickness-to-inner-diameter ratio of 0.5, it is justified to use tools with a longer sizing section and welding chamber, as well as a larger mandrel generating-line angle within the welding chamber. Full article

The presented research delivers a comprehensive evaluation of anticorrosive cathodic electrodeposition (CED) coatings through an integrated performance and process capability analysis—an approach that remains extremely limited in the literature, particularly in the context of statistically designed experiments (DoEs) applied to CED systems. This study therefore addresses a notable gap by focusing on the role of polymerization variables in determining coating quality through DoE to quantify the influence on coating thickness uniformity, adhesion integrity and impact resistance, while all other deposition parameters were rigorously controlled. Prior to coating application, all specimens were prepared and conditioned in accordance with ISO 1513:2010. Coating thickness was determined in compliance with ISO 2808:2019, adhesion was characterized by cross-cut methodology according to ISO 2409:2020 and dynamic mechanical resistance was evaluated using a falling-weight apparatus in accordance with ISO 6272-1:2011. The obtained datasets were subjected to statistical capability analysis within the PalstatCAQ environment, providing Cp, Cpk, Pp and Ppk indices in line with ISO 22514-7:2021 and IATF 16949:2016 requirements. Results evidenced non-linear dependencies of thickness formation on curing parameters, with potential capability indices (Cp > 1.8; Pp ≈ 1.4) indicating favorable process dispersion, while performance indices (Cpk < 0.5; Ppk < 0.4) revealed systematic mean shifts and deviations from normality confirmed by Shapiro–Wilk and Anderson–Darling tests. Adhesion testing demonstrated a direct correlation between curing conditions and interfacial bonding, reaching ISO Grade 0 classification. Complementary impact resistance assessments corroborated these findings, showing that insufficient curing induced extensive cracking and delamination. Furthermore, SEM–EDX analysis performed on Sample n.3 of X₂ variable confirmed the chemical integrity and multilayered structure of the CED coating. Full article

A new and transformative era in semiconductor packaging is underway, wherein, there is a shift from transistor scaling to system scaling and integration through advanced packaging. For advanced packaging, interconnect scaling is a key driver, with interconnect density requirements for chip-to-substrate microbump pitch below 5 μm and half-line pitch below 1 μm for Cu redistribution layer (RDL). Here, we present a comprehensive theoretical comparison of thermal cycling behavior in accordance with JESD22-A104D standard, intermetallic thickness evolution, and steady-state thermal analysis of Cu-microbump assembly for different bonding materials and substrates. Bonding materials studied include solder caps such as SAC105 (Sn98.5Ag1.0Cu0.5), eutectic Sn-Pb (Sn63Pb37), eutectic Sn-Bi (Sn42Bi58), Pb95Sn5, Indium, and Cu-Cu TCB structure. Effect of substrates including Si, glass and FR-4 is evaluated for various microbump structures with varying pitches (85 µm, 40 µm, 10 µm, and 5 µm) on their fatigue life. Results indicate that for Cu-microbump assemblies at an 85 µm pitch. The Pb95Sn5 exhibits the longest predicted fatigue life (3267 cycles by Engelmaier and 452 cycles by Darveaux), while SAC105 shows the shortest (320 and 103 cycles). Additionally, the Cu-Cu TCB structure achieves an estimated lifetime of approximately 7800 cycles, which is significantly higher than all solder-based Cu-microbump assemblies. The findings contribute to advanced packaging applications by providing valuable theoretical references for optimizing solder materials and structural configurations. Full article

Adhesive bonding has emerged as a transformative joining method across multiple industries, offering lightweight, durable, and versatile alternatives to traditional fastening techniques. This review provides a comprehensive exploration of adhesive bonding, from fundamental adhesion mechanisms, mechanical and molecular, to application-specific criteria and the characteristics of common adhesive types. Emphasis is placed on challenges affecting bond quality and longevity, including defects such as kissing bonds, porosity, voids, poor cure, and substrate failures. Critical aspects of surface preparation, bond line thickness, and adhesive ageing under environmental stressors are analysed. Furthermore, this paper highlights the pressing need for sustainable solutions, including the disassembly and recyclability of bonded joints, particularly within the automotive and aerospace sectors. A key insight from this review is the lack of a unified framework to assess defect interaction, stochastic variability, and failure prediction, which is mainly due complexity of multi-defect interactions, the compositional expense of digital simulations, or the difficulty in obtaining sufficient statistical data needed for the stochastic models. This study underscores the necessity for multi-method detection approaches, advanced modelling techniques (i.e., debond-on-demand and bio-based formulations), and future research into defect correlation and sustainable adhesive technologies to improve reliability and support a circular materials economy. Full article

In recent years, the building insulation layer peeling caused by quality problems has brought about safety hazards to human life. Existing means of non-destructive testing of building insulation layers, including laser scanning, infrared thermal imaging, ultrasonic testing, acoustic emission, ground-penetrating radar, etc., are unable to simultaneously guarantee the detection depth and resolution of the insulation layer defects, not to mention high-precision imaging of the insulation layer structure. A new type of high-precision imaging radar is specifically designed for the quantitative quality inspection of external building insulation layers in this paper. The center frequency of the radar is 8800 MHz and the −10 dB bandwidth is 3100 MHz, which means it can penetrate the insulated panel not less than 48.4 mm thick and catch the reflected wave from the upper surface of the bonding mortar. When the bonding mortar is 120 mm away from the radar, the radar can achieve a lateral resolution of about 45 mm (capable of distinguishing two parties of bonding mortar with a 45 mm gap). Furthermore, an ultra-wideband high-bunching antenna is designed in this paper combining the lens and the sinusoidal antenna, taking into account the advantages of high directivity and ultra-wideband. Finally, the high-precision imaging of data collected from multiple survey lines can visually reveal the distribution of bonded mortar and the bonding area. This helps determine whether the bonding area meets construction standards and provides data support for evaluating the quality of the insulation layer. Full article

Despite the significant economic and environmental advantages of friction stir spot welding (FSSW) and its amazing results in welding similar and dissimilar metals and alloys, some of which were known as unweldable, it has some structural and characteristic defects such as keyhole formation, hook defects, and bond line oxidation. This has prompted researchers to focus on these defects and propose and investigate techniques to treat or compensate for their deteriorating effects on microstructural and mechanical properties under different loading conditions. In this experimental study, sheets of AA6061-T6 aluminum alloy with a thickness of 1.8 mm were employed to investigate the influence of reinforcement by graphene nanoplatelets (GNPs) with lateral sizes of 1–10 µm and thicknesses of 3–9 nm on the static and fatigue behavior of FSSW lap joints. The welding process was carried out with constant, predetermined welding parameters and a constant amount of nanofiller throughout the experiment. Cross-sections of as-welded specimens were tested by optical microscope (OM) and energy-dispersive spectroscopy (EDS) to ensure the incorporation of the nanographene into the matrix of the base alloy by measuring the weight percentage (wt.%) of carbon. Microhardness and tensile tests revealed a significant improvement in both tensile shear strength and micro-Vickers hardness due to the reinforcement process. The fatigue behavior of the GNP-reinforced FSSW specimens was evaluated under low and high cycle fatigue conditions. The reinforcement process had a detrimental effect on the fatigue life of the joints under cyclic loading conditions. The microstructural analysis and examinations conducted during this study revealed that this reduction in fatigue strength is attributed to the agglomeration of GNPs at the grain boundaries of the aluminum matrix, leading to porosity in the stir zone (SZ), the formation of continuous brittle phases, and a transition in the fracture mechanism from ductile to brittle. The experimental results, including fracture modes, are presented and thoroughly discussed. Full article

The interfacial bonding properties of stainless steel clad (SSC) rebars determine whether they can be widely used. In the industrial production of SSC rebars, the process of intermediate and finish rolling of the microstructure evolution, element diffusion behavior, and interfacial bonding properties of bimetallic interfaces are investigated. In this paper, 316L seamless stainless steel (SS) tube and HRB400E carbon steel (CS) bar were prepared by a vacuum oxidation-free composite round billet, and the industrial emergency stopping of SSC rebars’ hot rolling was carried out. The metallographic results showed that the thicknesses of the carburized austenite zone (CAZ) varied greatly (832–238 μm) and showed a parabolic downward trend, while the thicknesses of the decarburized ferrite zone (DFZ) varied little (85–99 μm). The elemental line scans showed that Fe and Cr had the same parabolic downward trend. The intermediate-rolling had a great influence on element diffusion, and, in S6–9, the diffusion distance of Fe and Cr decreased significantly. The diffusion distances of the elements in the intermediate-rolling back stage and finishing-rolling front stage (S9–12) were basically balanced. The elemental diffusion distances and interfacial bonding strength were not consistent. Among them, the shear strength (τ) of S13 was 410.7 MPa. Compared with ordinary rebars, the yield strength (Re) and tensile strength (Rm) of finished SSC rebars were increased by 7.05% (30.9 MPa) and 7.10% (43.0 MPa), respectively. The tensile properties exceed those of mixture effects. The paper provides a theoretical basis for the improvement of the interfacial bonding strength and optimization of the rolling process system for the industrial production of SSC rebars. Full article

The effective and comprehensive utilization of forest resources has become the theme of the global “dual-carbon strategy”. Forestry restructured wood is a kind of wood-based panel made of wood-based fiber composite material by high-temperature and high-pressure restructuring–molding, and has become an important material in the field of construction, furniture manufacturing, as well as derivative processing for its excellent physical and mechanical properties, decorative properties, and processing performance. Taking Medium Density Fiberboard (MDF) as the recombinant material as the research object, an event-triggered synergetic control mechanism based on interventional three-way decision making is proposed for the viscoelastic multi-field coupling-distributed agile control of the “fixed thickness section” in the MDF continuous flat-pressing process, where some typical quality control problems of complex plate shape deviations including thickness, slope, depression, and bump tend to occur. Firstly, the idea of constructing the industrial event information of continuous hot pressing based on information granulation is proposed, and the information granulation model of the viscoelastic plate shape process mechanism is established by combining the multi-field coupling effect. Secondly, an FMEA-based cyber granular method for diagnosing and controlling the plate thickness diagnosis and control failure information expression of continuous flat pressing is proposed for the problems of plate thickness control failure and plate thickness deviation defect elimination that are prone to occur in the continuous flat-pressing process. The precise control of the plate thickness in the production process is realized based on event-triggered control to achieve the intelligent identification and processing of the various types of faults. The application test is conducted in the international mainstream production line of a certain type of continuous hot-pressing equipment for the production of 18 mm plate thickness; the synergistic effect is basically synchronized after 3 s, the control accuracy reaches 30%, and the average value of the internal bond strength is 1.40, which ensures the integrity of the slab. Practical tests show that the method in the actual production is feasible and effective, with detection and control accuracy of up to ±0.05 mm, indicating that in the production of E0- and E1-level products, the rate of superior products can reach more than 95%. Full article

The steel plate reinforcement method is widely used for strengthening damaged linings. Nevertheless, low durability is one of the disadvantages of the steel plate reinforcement method, which uses epoxy resin as the interface binder. To enhance the load-bearing performance and strengthening effect of steel-plate-reinforced structures, this study introduced ultra-high performance concrete (UHPC) as the reinforcing bonding layer and proposed a novel method for steel plate–UHPC reinforcement of cracked linings. A mechanical performance model test was conducted on a 1/5 scale lining model using a loading test device to evaluate the load-bearing performance and stress deformation of both conventional steel plate and steel plate–UHPC reinforced cracked linings. The characteristics, mechanisms of failure, and impacts of strengthening of the steel plate reinforcement method and steel plate–UHPC reinforcement method for cracked linings were compared. A numerical simulation model was developed to investigate the reinforcement effect of cracked linings using steel plate–UHPC reinforcement. The analysis included examining the influence of steel plate thickness, UHPC bonding layer thickness, and reinforcement timing. Model test results show that the overall damage mode of the steel plate–UHPC-reinforced structure had good elastic–plastic behaviour, and the deformation and damage process under the vertical concentrated load can be divided into four typical phases. Compared with the traditional steel plate reinforcement, the ultimate load-carrying capacity and ductility of the steel plate–UHPC-reinforced structure were increased by 53% and 366%, respectively, showing significantly better load-carrying capacity and deformation performance. Numerical simulation results show that the reinforced structure’s load-carrying capacity and stiffness enhancement rate increased non-linearly with the increase in UHPC layer thickness and steel plate thickness. However, reasonable reinforcement timing exists for steel plate-UHPC reinforcement, and too late reinforcement timing leads to a decrease in structural load-carrying capacity and stiffness enhancement rate. Full article

High-resolution imaging of buried metal interconnect structures in advanced microelectronic products with full-field X-ray microscopy is demonstrated in the hard X-ray regime, i.e., at photon energies > 10 keV. The combination of two multilayer optics—a side-by-side Montel (or nested Kirkpatrick–Baez) condenser optic and a high aspect-ratio multilayer Laue lens—results in an asymmetric optical path in the transmission X-ray microscope. This optics arrangement allows the imaging of 3D nanostructures in opaque objects at a photon energy of 24.2 keV (In-Kα X-ray line). Using a Siemens star test pattern with a minimal feature size of 150 nm, it was proven that features < 150 nm can be resolved. In-Kα radiation is generated from a Ga-In alloy target using a laboratory X-ray source that employs the liquid-metal-jet technology. Since the penetration depth of X-rays into the samples is significantly larger compared to 8 keV photons used in state-of-the-art laboratory X-ray microscopes (Cu-Kα radiation), 3D-nanopattered materials and structures can be imaged nondestructively in mm to cm thick samples. This means that destructive de-processing, thinning or cross-sectioning of the samples are not needed for the visualization of interconnect structures in microelectronic products manufactured using advanced packaging technologies. The application of laboratory transmission X-ray microscopy in the hard X-ray regime is demonstrated for Cu/Cu₆Sn₅/Cu microbump interconnects fabricated using solid–liquid interdiffusion (SLID) bonding. Full article

Nanoparticles (e.g., graphene oxide, graphene oxide-Fe₃O₄ nanocomposite or hexagonal boron nitride) loaded with anti-cancer drugs and targeted at cancerous cells allowed researchers to determine the most effective in vitro conditions for anticancer treatment. For this reason, the main propose of the present study was to determine the effect of graphene oxide (GO) with iron oxide (Fe₃O₄) nanoparticles (GO-Fe₃O₄) covalently (c-GO-Fe₃O₄-HCPT) and non-covalently (nc-GO-Fe₃O₄-HCPT) conjugated with hydroxycamptothecin (HCPT) in the presence of a rotating magnetic field (RMF) on relative cell viability using the MCF-7 breast cancer cell line. The obtained GO-Fe₃O₄ nanocomposites demonstrated the uniform coverage of the graphene flakes with the nanospheres, with the thickness of the flakes estimated as ca. 1.2 nm. The XRD pattern of GO–Fe₃O₄ indicates that the crystal structure of the magnetite remained stable during the functionalization with HCPT that was confirmed with FTIR spectra. After 24 h, approx. 49% and 34% of the anti-cancer drug was released from nc-GO-Fe₃O₄-HCPT and c-GO-Fe₃O₄-HCPT, respectively. The stronger bonds in the c-GO-Fe₃O₄-HCPT resulted in a slower release of a smaller drug amount from the nanocomposite. The combined impact of the novel nanocomposites and a rotating magnetic field on MCF-7 cells was revealed and the efficiency of this novel approach has been confirmed. However, MCF-7 cells were more significantly affected by nc-GO-Fe₃O₄-HCPT. In the present study, it was found that the concentration of nc-GO-Fe₃O₄-HCPT and a RMF has the highest statistically significant influence on MCF-7 cell viability. The obtained novel nanocomposites and rotating magnetic field were found to affect the MCF-7 cells in a dose-dependent manner. The presented results may have potential clinical applications, but still, more in-depth analyses need to be performed. Full article

The material extrusion 3D printing process known as fused deposition modeling (FDM) has recently gained relevance in the additive manufacturing industry for large-scale part production. However, improving the real-time monitoring of the process in terms of its mechanical properties remains important to extend the lifespan of numerous critical applications. To enhance the monitoring of mechanical properties during printing, it is necessary to understand the relationship between temperature profiles and ultimate tensile strength (UTS). This study uses a cyber–physical production system (CPPS) to analyze the impact of four key thermal parameters on the tensile properties of polylactic acid (PLA). Layer thickness, printing speed, and extrusion temperature are the most influential factors, while bed temperature has less impact. The Taguchi L-9 array and the full factorial design of experiments were implemented along with the deposited line’s local fused temperature profile analysis. Furthermore, correlations between temperature profiles with the bonding strength during layer adhesion and part solidification can be stated. The results showed that layer thickness is the most important factor, followed by printing speed and extrusion temperature, with very close influence between each other. The lowest impact is attributed to bed temperature. In the experiments, the UTS values varied from 46.38 MPa to 56.19 MPa. This represents an increase in the UTS of around 17% from the same material and printing design conditions but different temperature profiles. Additionally, it was possible to observe that the influence of the parameter variations was not linear in terms of the UTS value or temperature profiles. For example, the increase in the UTS at the 0.6 mm layer thickness was around four times greater than the increase at 0.4 mm. Finally, even when it was found that an increase in the layer temperature led to an increase in the value of the UTS, for some of the parameters, it could be observed that it was not the main factor that caused the UTS to increase. From the monitoring conditions analyzed, it was concluded that the material requires an optimal thermal transition between deposition, adhesion, and layer solidification in order to result in part components with good mechanical properties. A tracking or monitoring system, such as the one designed, can serve as a potential tool for reducing the anisotropy in part production in 3D printing systems. Full article

Appraising and protecting forests requires a management plan and the creation of innovative products for the market. The development of the green gluing technique could add value to native timber. However, there is a lack of knowledge concerning the response and the productive process of Nothofagus species using this technique. This work investigated the viability of implementing the green gluing method using three types of Nothofagus. Wood pieces were made using a one-component polyurethane adhesive. Delamination, shear tests, morphological characterization, and bond line thickness analysis tested their capacity. The results showed a variable response depending on the Nothofagus type, where the surface treatment could improve the green gluing performance. The findings highlight the relevance of increasing knowledge about the essayed species and their preparation to maintain their natural moisture condition. Full article