High-performance MEMS accelerometers usually use a pendulum structure with a larger mass. Although the performance of the device is guaranteed, the manufacturing cost is high. This paper proposes a method of fabricating high-performance MEMS accelero...
In order to enhance the sensitivity of wafer-level vacuum-packaged electric field sensors, this paper proposed a vertical-resonant MEMS electric field sensor based on TGV (Through Glass Via) technology. The microsensor is composed of the electric fie...
Electrohydrodynamic (EHD) printing offers mask-free, high-resolution deposition across a broad range of ink viscosities, yet combining void-free filling of high-aspect-ratio through-glass vias (TGVs) with ultrafine drop-on-demand (DOD) line printing...
Glass has emerged as a highly versatile substrate for various sensor and MEMS packaging applications, including electromechanical, thermal, optical, biomedical, and RF devices, due to its exceptional properties such as high geometrical tolerances, ou...
The development of 5G mobile communication created the need for high-frequency communication systems, which require vast quantities of radio frequency (RF) filters with a high-quality factor (Q) and low inband losses. In this study, the packaging of...
In order to effectively employ through-glass vias (TGVs) for high-frequency software package design, it is crucial to accurately characterize the S-parameters of vertical interconnection structures in 3D glass packaging. A methodology is proposed for...
A MEMS fabrication process with through-glass vias (TGVs) by laser drilling was presented, and reliability concerns about MEMS packaging with TGV, likes debris and via metallization, were overcome. The via drilling process on Pyrex 7740 glasses was s...
This paper presents a novel approach to fabricate substrate integrated waveguides (SIWs) on glass substrates with tin (Sn) through glass vias (TGVs) tailored for millimeter-wave applications. The fabrication process employs a custom-designed vacuum s...
Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when a...
A charge detector is a vital component in neutrino and dark matter detection. The integration of a charge collector in the form of flat pads and readout modules has been proposed as an optimization method as it can reduce noise and installation compl...
A millimeter-wave substrate integrated waveguide (SIW) has been demonstrated using micromachined tungsten-coated through glass silicon via (TGSV) structures. Two-step deep reactive ion etching (DRIE) of silicon vias and selective tungsten coating ont...
With the increasing demand for high-density integration, low power consumption and high bandwidth, creating more sophisticated interconnection technologies is becoming increasingly crucial. Three-dimensional (3D) integration technology is known as th...
We are interested in the restoration of noisy and blurry images where the texture mainly follows a single direction (i.e., directional images). Problems of this type arise, for example, in microscopy or computed tomography for carbon or glass fibres....
The rapid growth of artificial intelligence (AI), data centers, and high-performance computing (HPC) has increased the demand for large bandwidth, high energy efficiency, and high-density optical interconnects. Co-packaged optics (CPO) technology off...
Current research in the field of aviation considers actively controlled high-lift structures for future civil airplanes. Therefore, pressure data must be acquired from the airfoil surface without influencing the flow due to sensor application. For ex...
As an interposer, Through-Glass Vias (TGVs) play a critical role in advanced packaging such as Co-packaged optics (CPO). Currently, due to the complex influence of laser wet-etching process parameters, the precise bidirectional prediction of TGV para...
Three-dimensional (3D) interconnection technology based on glass through vias (TGVs) has been used to integrate passive devices, and optoelectronic devices due to its superior electrical qualities, outstanding mechanical stability, and lower cost. Ne...
A millimeter-wave substrate-integrated waveguide (SIW) was firstly demonstrated using the micromachining of photoetchable glass (PEG) for 5G applications. A PEG substrate was used as a dielectric material of the SIW, and its photoetchable properties...
(1) Background: To assess the treatment response of benign prostatic syndrome (BPS) following prostatic artery embolization (PAE) using a semi-automatic software analysis of magnetic resonance imaging (MRI) features and clinical indexes. (2) Methods:...
In glass interposer architecture and its assembly process, the mechanical responses of interposer structure under thermocompression process-induced thermal loading and generated shrinkage of molding material are regarded as a major reliability issue....
Electrical properties provide essential information for cancer detection and specific absorption rate (SAR) estimation. Magnetic resonance electrical properties tomography (MREPT) is an approach to retrieve the distribution of electrical properties....
The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fa...
Non-furnace boilers can improve the efficiency of industrial once-through boilers. However, temperature non-uniformity occurs in the economizer connected vertically to the boiler. Heat transfer performance is degraded by temperature non-uniformity. T...
The reconstruction problem in X-ray computed tomography (XCT) is notoriously difficult in the case where only a small number of measurements are made. Based on the recently discovered Compressed Sensing paradigm, many methods have been proposed in or...
This research focuses on the manufacturing of a glass interposer that has gone through glass via (TGV) connection holes. Glass has unique properties that make it suitable for 3D integrated circuit (IC) interposers, which include low permittivity, hig...
Migraine is a common neurological disease that affects about 11% of the adult population. The disease is divided into two main clinical subtypes: migraine with aura and migraine without aura. According to the neurovascular theory of migraine, the act...
Here, we describe the validation of a new phenotypic culture-based AtbFinder method for rapid selection of antibiotics in vitro using specimens with mono- and polybacterial infections. AtbFinder, which can be applied to any type of non-blood tissue,...
Image deblurring under the background of impulse noise is a typically ill-posed inverse problem which attracted great attention in the fields of image processing and computer vision. The fast total variation deconvolution (FTVd) algorithm proved to b...
Spectral computed tomography (CT)-reconstructed images often exhibit severe noise and artifacts, which compromise the practical application of spectral CT imaging technology. Methods that use tensor dictionary learning (TDL) have shown superior perfo...
Glass micromachining is currently becoming essential for the fabrication of micro-devices, including micro- optical-electro-mechanical-systems (MOEMS), miniaturized total analysis systems (μTAS) and microfluidic devices for biosensing. Moreover, glas...
Microchips have been designed and fabricated for the fast thermal characterization of samples by extension of the 3-omega method. Both solid and liquid samples can be measured by applying a small amount of material under investigation on the chip con...
In this article, electrical performance analysis of high-speed interconnection and power delivery network (PDN) in low-loss glass substrate-based interposers is conducted considering signal integrity (SI) and power integrity (PI). The low-loss glass...
In the simulation of compressible turbulent flows via a high-order flux reconstruction framework, the artificial viscosity model plays an important role to ensure robustness in the strongly compressible region. However, the impact of the artificial v...
Geometric surface information such as depth maps and surface normals can be acquired by various methods such as stereo light fields, shape from shading and photometric stereo techniques. We compare several algorithms which deal with the combination o...
Image deblurring is a fundamental image processing task, and research for efficient image deblurring methods is still a great challenge. Most of the currently existing methods are focused on TV-based models and regularization term construction; littl...
Image edge is the most indicative feature that forms a significant role in image analysis and image understanding, but edge-detail preservation is a difficult task in image restoration due to noise and blur during imaging. The balance between edge pr...
Congenital conotruncal heart defects (CCHD) are a subset of serious congenital heart defects (CHD) of the cardiac outflow tracts or great arteries. Its frequency is estimated in 1/1000 live births, accounting for approximately 10–30% of all CHD...
Teleoperated ground vehicles (TGVs) are widely applied in hazardous and dynamic environments, where communication delay and low transparency increase operator workload and reduce control performance. This study explores the cognitive and physiologica...
Crosswind action on a train poses a risk of vehicle overturning or derailment. To assess if new train designs fulfill the safety requirements, computational fluid dynamics is commonly used. This article presents a comprehensive wind flow analysis on...
The development of chip manufacturing and advanced packaging technologies has significantly changed redistribution layers (RDLs), leading to shrinking line width/spacing, increasing the number of build-up layers and package size, and introducing orga...
Single-image blind deblurring for imaging sensors in the Internet of Things (IoT) is a challenging ill-conditioned inverse problem, which requires regularization techniques to stabilize the image restoration process. The purpose is to recover the und...
Intelligent surface vehicles, including unmanned surface vehicles (USVs) and autonomous surface vehicles (ASVs), have gained significant attention from both academic and industrial communities. However, shipboard maritime images captured under hazy w...
The quantitative measure of dissipative properties of different numerical schemes is crucial to computational methods in the field of aerospace applications. Therefore, the objective of the present study is to examine the resolving power of Monotonic...
In this research work, two distinct types of three-dimensional (3D) capacitors were successfully fabricated, each with its own unique features and advantages. The first type of capacitor is centered around a 3D nanoporous structure. This structure is...
Background: Multiple studies have suggested that paralgesia (hyperalgesia and cutaneous allodynia) in migraine reflects the activation and sensitisation of the trigeminovascular system (TGVS). In particular, it reflects the second-order and higher ne...