855 Results Found

With the development of high-density integrated chips, low-k dielectric materials are used in the back end of line (BEOL) to reduce signal delay. However, due to the application of fine-pitch packages with high-hardness copper pillars, BEOL is suscep...

Gallium nitride (GaN) power devices have many benefits, including high power density, small footprint, high operating voltage, and excellent power gain capability. However, in contrast to silicon carbide (SiC), its performance and reliability can be...

New diamond chip resistors have been used in high-power devices widely due to excellent heat dissipation and high-frequency performance. However, systematic research about their solder joint reliability is rare. In this paper, a related study was con...

The Ring Oscillator Physical Unclonable Function (RO-PUF) is a hardware security innovation that creates a secure and distinct identifier by utilizing the special physical properties of ring oscillators. Their unique response, low hardware overhead,...

To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the...

Aggressive scaling in deep nanometer technology enables chip multiprocessor design facilitated by the communication-centric architecture provided by Network-on-Chip (NoC). At the same time, it brings considerable challenges in reliability because a f...

The ending of Moore’s Law calls for innovations in integrated circuit (IC) technologies and chip designs. Heterogeneous integration (HI) emerges as a pathway towards smart future chips for more Moore time and for beyond-Moore time, featuring sy...

For achieve sensitivity in lab-on-a-chip electrochemical detection, more reliable probing methods are required, especially for repeated measurements. Spring-probes are a promising candidate method which can replace needle-like probes and alligator cl...

The router plays an important role in communication among different processing cores in on-chip networks. Technology scaling on one hand has enabled the designers to integrate multiple processing components on a single chip; on the other hand, it bec...

The authors present the results of laboratory tests analysing the impact of selected cutting data and tool geometry on surface quality, chip type and cutting forces in the process of orthogonal turning of sintered cobalt. The selected cutting data ar...

In this paper, the reliability of a new online cutting edge radius estimator for micro end milling is evaluated. This estimator predicts the cutting edge radius by detecting the drop in the chip production rate as the cutting edge of a micro end mill...

The growing interest towards thinner and conformable electronic systems has attracted significant attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra-thin monocrystalline silicon integrated cir...

Recent research has shown interest in adopting the RISC-V processors for high-reliability electronics, such as aerospace applications. The openness of this architecture enables the implementation and customization of the processor features to increas...

The microbump (μ-bump) reliability of 3D integrated circuit (3D-IC) packaging must be enhanced, in consideration of the multi-chip assembly, during temperature cycling tests (TCT). This research proposes vehicle fabrications, experimental implements,...

The failure of different chips under working conditions is influenced by various stress states such as different voltages, temperatures, stress durations, and stress variations. Therefore, the failure time has a great degree of dispersion, and simila...

The Insulated Gate Bipolar Transistor (IGBT) is the component with the highest failure rate in power converters, and its reliability is a critical issue in power electronics. IGBT module failure is largely caused by solder layer fatigue or bond wires...

Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous integration packages, are widely used in high I/O (Input/Output) density and high-performance computing applications. The thermal dissipation efficiency of such packag...

Chip-based DNA quantification systems are widespread, and used in many point-of-care applications. However, instruments for such applications may not be maintained or calibrated regularly. Since machine reliability is a key issue for normal operation...

In the DC-6 GHz band, low-insertion-loss packaging materials were investigated to effectively reduce the heat generated during the working process of the attenuation chip. Based on the working principle of the attenuation chip, when the signal passes...

The era of 20 nm integrated circuits has arrived. There exist abundant heterogeneous micro/nano structures, with thicknesses ranging from hundreds of nanometers to sub-microns in the IC back end of the line stack, which put stringent demands on the r...

Recently, the press-pack insulated gate bipolar transistor (IGBT) has usually been used in direct current (DC) transmission. The press-pack IGBT (PPI) adopts a parallel layout of boss chips, and the currents of each chip will be uneven in the process...

With technology scaling, maintaining the reliability of dynamic random-access memory (DRAM) has become more challenging. Therefore, on-die error correction codes have been introduced to accommodate reliability issues in DDR5. However, the current sol...

In this review, some major aspects of the current underfill technologies for flip-chip (FC) and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), are addressed, with an emphasis on applications, such as aerospace electronics, f...

Optical networks-on-chip (NoCs) have emerged as a next-generation solution to overcome the limitations of electrical NoCs. In particular, wavelength-routed optical networks-on-chip (WRONoCs) are well known for their high bandwidth and ultra-low signa...

LED packaging miniaturization has raised more requirements for LED materials. As a material contacting the LED chip directly, the reliability of LED non-conductive adhesive has also garnered increasing attention. This study optimized the formula for...

Many recent studies have revealed that PoL (Point of Load) converters’ output capacitors are a paramount component from a reliability point of view. To receive the maximum degree of reliability in many applications, designers are often advised...

In the case of repeated loadings, the reliability of inertial microelectromechanical systems (MEMS) can be linked to failure processes occurring within the movable structure or at the anchors. In this work, possible debonding mechanisms taking place...

By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a...

As solder joints are being scaled down, intermetallic compounds (IMCs) are playing an increasingly critical role in the reliability of solder joints, and thereby an in-depth understanding of IMCs microstructure evolutions in micro-joints is of great...

Polycrystalline silicon is a brittle material, and its strength results are stochastically linked to microscale (or even nanoscale) defects, possibly dependent on the grain size and morphology. In this paper, we focus on the out-of-plane tensile stre...

This work presents a novel platform conceived as an interconnect box (ICB) that brings high-frequency signals from microwave instruments to consumable lab-on-a-chip devices. The ICB can be connected to instruments with a standard coaxial connector an...

Monolithically integrated emitters have been increasingly applied to microfluidic devices that are coupled to mass spectrometers (MS) as electrospray ionization sources (ESI). A new method was developed to fabricate a duplicable structure which integ...

Osteoarticular infections are major disabling diseases that can occur after orthopedic implant surgery in patients. The management of these infections is very complex and painful, requiring surgical intervention in combination with long-term antibiot...

This paper presents a new methodical procedure to monitor in real time the junction temperature of SiC Power MOSFET modules of parallel-connected chips utilized in machine drive systems to develop their reliability modelling and predict their lifetim...

Background/Objectives: Cell-free DNA (cfDNA) is a valuable biomarker for cancer diagnosis and therapy monitoring; however, its low abundance and fragmented nature present major challenges for reliable isolation, particularly from limited plasma volum...

The increasing integration and miniaturization of electronic devices place serious pressure on packaging technologies to ensure long-term reliability. Polymer underfill encapsulation is a key process for reducing thermomechanical stress in modern ass...

Test for Reliability is a test flow where an Integrated Circuit (IC) device is continuously stressed under several corner conditions that can be dynamically adapted based on the real-time observation of the critical signals of the device during the e...

Microwave core-chips are highly integrated MMICs that are in charge of all the beam-shaping functions of a transmit-receive module within a phased array system. Such chips include switches, amplifiers and attenuators, phase shifters, and possibly oth...

With the system interconnection and intelligence of application scenario equipment, the electromagnetic environment of chips is becoming more and more complex. Problems such as communication interruption and data loss caused by electromagnetic interf...

The reliability and durability of integrated circuits (ICs), present in almost every electronic system, from consumer electronics to the automotive or aerospace industries, have been and will continue to be critical concerns for IC chip makers, espec...

As stacking technologies, such as 2.5D and 3D packages, continue to accelerate in advanced semiconductor components, the singulation and thinning of Si wafers are becoming increasingly critical. Despite their importance in producing thinner and more...

This paper introduces a novel and efficient physical unclonable function (PUF) extraction method for SRAM. The proposed one-layer convolution scheme is based on a convolution operation, which significantly enhances the reliability of the PUF. To furt...

The connection of microfluidic devices to the outer world by tubes and wires is an underestimated issue. We present methods based on 3D printing to realize microfluidic chip holders with reliable fluidic and electric connections. The chip holders are...

To preserve the structural integrity of power semiconductor devices, ensuring a reliable connection between wide-bandgap (WBG) chips and their substrates at temperatures above 200 °C is crucial. Therefore, easily processable chip-attach materials wit...

The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as s...

Previous studies have reported significant differences in the Johnson-Cook (J-C) parameters of Ti6Al4V alloy. Thus, various serrated chip morphologies, cutting forces, and cutting temperatures are obtained when different constitutive parameters are u...

This review outlines the evolutionary journey from traditional two-dimensional (2D) cell culture to the revolutionary field of organ-on-a-chip technology. Organ-on-a-chip technology integrates microfluidic systems to mimic the complex physiological e...

With the wide application of flow sensors, their reliability under extreme conditions has become a concern in recent years. The reliability of a Micro Electro Mechanical Systems (MEMS) flow sensor under temperature ${(\mathrm{T}}_{\mathrm{s}})$ is researched in this paper. T...

Circumferential milling is used in wood processing, yet it generates vast quantities of dust and chips in a single pass, highlighting the need to predict chip dispersion and prevent associated hazards. This article presents findings from a theoretica...

A novel heat dissipation structure composed of square frustums thermal through silicon via array and embedded in P-type (100) silicon substrate is proposed to improve the heat dissipation capacity of power chips while reducing process difficulty. Bas...