Search Results (66)

Ultrasonic applications such as non-destructive testing, biomedical imaging or range measurements are currently based on piezoelectric bulk transducers. Yet, these kinds of transducers with their mm to cm dimensions are rather impractical in fields in which both frequencies in the kHz region and small-feature sizes are required. This fact mainly relates to the inverse relationship between the resonance frequency constant and the transducers’ dimension, yielding a higher frequency and attenuation with a decreasing size. Piezoelectric micromachined ultrasonic transducers (PMUTs), in comparison, incorporate a small-scale µm design while preserving the operating frequency in the desired kHz range. This contribution presents the detailed manufacturing of such a PMUT with a multiple ring electrode‑based structure to additionally adjust the sound pressure fields. The PMUT will be characterized by its deflection in air along with the characterization of the piezoelectric material lead zirconate titanate (PZT) itself. The measurements showed a maximum polarization of 21.8 µC/cm² at 50 kV/cm, the PMUT’s displacement of 30.50 nm/V in air when all electrodes are driven, and an adjustable deflection via different electrode excitations without the need for additional hardware. The ring design also offered the possibility to emit two distinct frequencies simultaneously. These results demonstrate the potential of the designs for small-feature-size applications as they are in high demand for implantable devices, miniaturized ultrasonic-based communication or drug delivery. Full article

Optical fiber Raman and surface-enhanced Raman scattering (SERS) probes hold great promise for in vivo biosensing and in situ monitoring of hostile environments. However, the silica Raman scattering background generated within the optical fiber increases in proportion to the length of the fiber, and it can swamp the signal from the target analyte. While filtering can be applied at the distal end of the fiber, the use of bulk optical elements has limited probe miniaturization to a diameter of 600 µm, which in turn limits the potential applications. To overcome this limitation, femtosecond laser micromachining was used to fabricate a prototype micro-optical filter, which was directly integrated on the tip of a 125 µm diameter double-clad fiber (DCF) probe. The outer surface of the microfilter was further modified with a nanostructured, SERS-active, plasmonic film that was used to demonstrate proof-of-concept performance with thiophenol as a test analyte. With further optimization of the associated spectroscopic system, this ultra-compact microprobe shows great promise for Raman and SERS optical fiber sensing. Full article

Lateral flow membrane microdevices are widely used for chromatographic separation processes and diagnostics. The separation performance of microfluidic lateral membrane devices is determined by mass transfer limitations in the membrane, and in the liquid phase, mass transfer resistance is dependent on the channel dimensions and transport properties of the species separated by the membrane. We present a novel approach based on an active bulk acoustic wave (BAW) mixing method to enhance lateral transport in micromachined silicon devices. BAWs have been previously applied in channels for mixing and trapping cells and particles in single channels, but this is, to the best of our knowledge, the first instance of their application in membrane devices. Our findings demonstrate that optimal resonance is achieved with minimal influence of the pore configuration on the average lateral flow. This has practical implications for the design of microfluidic devices, as the channels connected through porous walls under the acoustic streaming act as 760 µm-wide channels rather than two 375 µm-wide channels in the context of matching the standing pressure wave criteria of the piezoelectric transducer. However, the roughness of the microchannel walls does seem to play a significant role in mixing. A roughened (black silicon) wall results in a threefold increase in average streaming flow in BAW mode, suggesting potential avenues for further optimization. Full article

Hydrophobic surfaces have attracted great attention due to their ability to repel water, and metallic surfaces are particularly significant as they have several benefits, for example they self-clean and do not corrode in marine environments, but also have several applications in the aircraft, building and automobile industries. Tungsten is an ideal material for metallic surfaces due to its remarkable mechanical properties. However, conventional micromachining methods of micro- or nanostructures, including mechanical fabrication and laser and wet etching are incapable of balancing functionality, consistency and cost. Inspired by the etching process of silicon, deep etching of bulk tungsten has been developed to achieve versatile microstructures with the advantages of high efficiency, large scale and low cost. In this article, fabrication methods of tungsten-based hydrophobic surfaces using an ICP deep etching process were proposed. Micro- or hierarchical structure arrays with controllable sidewall profiles were fabricated by optimizing etching parameters, which then exhibited hydrophobicity with contact angles of up to 131.8°. Full article

Piezoelectric micromachined ultrasound transducers (PMUTs) have gained significant popularity in the field of ultrasound ranging and medical imaging owing to their small size, low power consumption, and affordability. The scar-free “MIS” (micro-hole inter-etch and sealing) process, a novel bulk-silicon manufacturing technique, has been successfully developed for the fabrication of pressure sensors, flow sensors, and accelerometers. In this study, we utilize the MIS process to fabricate cavity diaphragm structures for PMUTs, resulting in the formation of a flat cavity diaphragm structure through anisotropic etching of (111) wafers in a 70 °C tetramethylammonium hydroxide (TMAH) solution. This study investigates the corrosion characteristics of the MIS technology on (111) silicon wafers, arranges micro-pores etched on bulk silicon around the desired cavity structure in a regular pattern, and takes into consideration the distance compensation for lateral corrosion, resulting in a fully connected cavity structure closely approximating an ortho-hexagonal shape. By utilizing a sputtering process to deposit metallic molybdenum as upper and lower electrodes, as well as piezoelectric materials above the cavity structure, we have successfully fabricated aluminum nitride (AlN) piezoelectric ultrasonic transducer arrays of various sizes and structures. The final hexagonal PMUT cells of various sizes that were fabricated achieved a maximum quality factor (Q) of 251 and a displacement sensitivity of 18.49 nm/V across a range of resonant frequencies from 6.28 MHz to 11.99 MHz. This fabrication design facilitates the achievement of IC-compatible and cost-effective mass production of PMUT array devices with high resonance frequencies. Full article

Bulk piezoelectric ultrasound transducers on integrated circuits offer unique properties for therapeutic applications of ultrasound neuromodulation. However, current implementations of such transducers are not optimized for the high transmit efficiency required to stimulate neurons. This is mainly due to the challenge of implementing a metal layer on top of the piezoelectric film using microfabrication techniques. Here, we propose a micromachined capping structure providing an electrical connection on top of the piezoelectric film with minimal acoustic losses. The structure can potentially be used as a common ground connection in phased-array ultrasound transducers. Full article

Ultrasonic nondestructive testing (NDT) usually utilizes conventional bulk piezoelectric transducers as transceivers. However, the complicated preparation and assembly process of bulk piezoelectric ceramics limits the development of NDT probes toward miniaturization and high frequency. In this paper, a 4.4 mm × 4.4 mm aluminum nitride (AlN) piezoelectric micromachined ultrasonic transducer (PMUT) array is designed, fabricated, characterized, and packaged for ultrasonic pulse–echo NDT of solids for the first time. The PMUT array is prepared based on the cavity silicon-on-insulator (CSOI) process and packaged using polyurethane (PU) material with acoustic properties similar to water. The fabricated PMUT array resonates at 2.183 MHz in air and at around 1.25 MHz after PU encapsulation. The bandwidth of the packaged PMUT receiver (244 kHz) is wider than that of a bulk piezoelectric transducer (179 kHz), which is good for axis resolution improvement. In this work, a hybrid ultrasonic NDT probe is designed using two packaged PMUT receivers and one 1.25 MHz bulk transmitter. The bulk transmitter radiates an ultrasonic wave into the sample, and the defect echo is received by two PMUT receivers. The 2D position of the defect could be figured out by time-of-flight (TOF) difference, and a 30 mm × 65 mm detection area is acquired. This work demonstrates the feasibility of applying AlN PMUTs to ultrasonic NDT of solids and paves the way toward a miniaturized NDT probe using AlN PMUT technology. Full article

Custom electronics tailored for ultrasonic applications with four ultrasonic transmit-receive channels and a nominal 25 MHz single channel frequency were developed for ultrasound BAW and SAW biosensor uses. The designed integrated microcontroller, supported by Python with a SciPy library, and the developed system measured the time of flight (TOF) and other wave properties to characterize the acoustic properties of a bulk of the liquid in a microchannel or acoustic properties of biological species attached to an analytic surface in real time. The system can utilize both piezoelectric and capacitive micromachined ultrasound transducers. The device demonstrated a linear response to changes in water salinity. This response was primarily attributed to the time-of-flight (TOF) changes related to the varying solution density. Furthermore, real-time DNA oligonucleotide-based interactions between oligonucleotides immobilized on the device’s analytical area and oligonucleotides attached to gold nanoparticles (Au NPs) in the solution were demonstrated. The biological interaction led to an exponential decrease in the acoustic interfacial wave propagating across the interface between the solution and the solid surface of the sensor, the TOF signal. This decrease was attributed to the increase in the effective density of the solution in the vicinity of the sensor’s analytical area, as Au NPs modified by oligonucleotides were binding to the analytical area. The utilization of Au NPs in oligonucleotide surface binding yields a considerably stronger sensor signal than previously observed in earlier CMUT-based TOF biosensor prototypes. Full article

Ultrasonic flowmeter is one of the most widely used devices in flow measurement. Traditional bulk piezoelectric ceramic transducers restrict their application to small pipe diameters. In this paper, we propose an ultrasonic gas flowmeter based on a PZT piezoelectric micromachined ultrasonic transducer (PMUT) array. Two PMUT arrays with a resonant frequency of 125 kHz are used as the sensitive elements of the ultrasonic gas flowmeter to realize alternate transmission and reception of ultrasonic signals. The sensor contains 5 × 5 circular elements with a size of 3.7 × 3.7 mm². An FPGA with a resolution of ns is used to process the received signal, and a flow system with overlapping acoustic paths and flow paths is designed. Compared with traditional measurement methods, the sensitivity is greatly improved. The flow system achieves high-precision measurement of gas flow in a 20 mm pipe diameter. The flow measurement range is 0.5–7 m/s and the relative error of correction is within 4%. Full article

With the emergence of 5G and satellite communication applications, where millimeter-wave (mm-wave) active phased arrays play an important role, the demand for a highly integrated and cost-effective method to achieve mm-wave antennas is an inevitable trend. Antenna-in-package (AiP) design is therefore becoming a hotspot. This paper presents the design procedure for a broadband silicon-based stacked patch antenna in Ka-band, which realizes a practical AiP structure for phased-array module integration requirements. A stacked-patch antenna on a high-resistivity silicon (HRSi) substrate is demonstrated to effectively extend the bandwidth with the guidance of characteristic mode analysis (CMA).The proposed antenna element and its 2 × 2 array were designed and fabricated using silicon bulk micromachining and wafer-level bonding technology. The measured results from the fabricated antenna prototypes showed that (1) the antenna element had an impedance bandwidth of 13.8% from 26.2 to 30.1 GHz, and the peak gain was 6.1 dBi at 28.9 GHz; (2) the 2 × 2 array realized an impedance bandwidth of 11.4% from 27.2 to 30.5 GHz, and the peak gain was 9.3 dBi at 28.5 GHz. Full article

Half-bridge silicon strain gauges are widely used in the fabrication of diaphragm-type high-pressure sensors, but in some applications, they suffer from low output sensitivity because of mounting position constraints. Through a special design and fabrication approach, a new half-bridge silicon strain gauge comprising one arc gauge responding to tangential strain and another linear gauge measuring radial strain was developed using Silicon-on-Glass (SiOG) substrate technology. The tangential gauge consists of grid patterns, such as the reciprocating arc of silicon piezoresistors on a thin glass substrate. When two half-bridges are connected to form a full bridge with arc-shaped gauges that respond to tangential strain, they have the advantage of providing much higher output sensitivity than a conventional half-bridge. Pressure sensors tested under pressure ranging from 0 to 50 bar at five different temperatures indicate a linear output with a typical sensitivity of approximately 16 mV/V/bar, a maximum zero shift of 0.05% FS, and a span shift of 0.03% FS. The higher output level of pressure sensing gauges will provide greater signal strength, thus maintaining a better signal-to-noise ratio than conventional pressure sensors. The offset and span shift curves are quite linear across the operating temperature range, giving the end user the advantage of using very simple algorithms for temperature compensation of offset and span shift. Full article

This paper presents a SOI piezoresistive pressure sensor with the crossbeam membrane. The roots of the crossbeam were widened, which solved the problem of the poor dynamic performance of small-range pressure sensors working at a high temperature of 200 °C. A theoretical model was established to optimize the proposed structure, which combined the finite element and the curve fitting. Using the theoretical model, the structural dimensions were optimized to obtain the optimal sensitivity. During optimization, the sensor nonlinearity was also taken into consideration. The sensor chip was fabricated by MEMS bulk-micromachining technology, and Ti/Pt/Au metal leads were prepared to improve the sensor ability of high-temperature resistance over a long time. The sensor chip was packaged and tested, and the experimental results show the sensor achieved an accuracy of 0.241% FS, nonlinearity of 0.180% FS, hysteresis of 0.086% FS and repeatability of 0.137% FS at the high temperature. Given the good reliability and performance at the high temperature, the proposed sensor provides a suitable alternative for the measurement of pressure at high temperatures. Full article

The effect of microchannel height on acoustic streaming velocity and capacitive micromachined ultrasound transducer (CMUT) cell damping was investigated. Microchannels with heights ranging from 0.15 to 1.75 mm were used in experiments, and computational microchannel models with heights varying from 10 to 1800 micrometers were simulated. Both simulated and measured data show local minima and maxima of acoustic streaming efficiency associated with the wavelength of the `bulk acoustic wave excited at 5 MHz frequency. Local minima occur at microchannel heights that are multiples of half the wavelength (150 μm), which are caused by destructive interference between excited and reflected acoustic waves. Therefore, microchannel heights that are not multiples of 150 μm are more favorable for higher acoustic streaming effectiveness since destructive interference decreases the acoustic streaming effectiveness by more than 4 times. On average, the experimental data show slightly higher velocities for smaller microchannels than the simulated data, but the overall observation of higher streaming velocities in larger microchannels is not altered. In additional simulation, at small microchannel heights (10–350 μm), local minima at microchannel heights that are multiples of 150 μm were observed, indicating the interference between excited and reflected waves and causing acoustic damping of comparatively compliant CMUT membranes. Increasing the microchannel height to over 100 μm tends to eliminate the acoustic damping effect as the local minima of the CMUT membrane swing amplitude approach the maximum value of 42 nm, which is the calculated amplitude of the freely swinging membrane under the described conditions. At optimum conditions, an acoustic streaming velocity of over 2 mm/s in a 1.8 mm-high microchannel was achieved. Full article

This paper proposes a piezoresistive high-temperature absolute pressure sensor based on (100)/(111) hybrid SOI (silicon-on-insulator) silicon wafers, where the active layer is (100) silicon and the handle layer is (111) silicon. The 1.5 MPa ranged sensor chips are designed with the size as tiny as 0.5 × 0.5 mm, and the chips are fabricated only from the front side of the wafer for simple, high-yield and low-cost batch production. Herein, the (100) active layer is specifically used to form high-performance piezoresistors for high-temperature pressure sensing, while the (111) handle layer is used to single-side construct the pressure-sensing diaphragm and the pressure-reference cavity beneath the diaphragm. Benefitting from front-sided shallow dry etching and self-stop lateral wet etching inside the (111)-silicon substrate, the thickness of the pressure-sensing diaphragm is uniform and controllable, and the pressure-reference cavity is embedded into the handle layer of (111) silicon. Without the conventionally used double-sided etching, wafer bonding and cavity-SOI manufacturing, a very small sensor chip size of 0.5 × 0.5 mm is achieved. The measured performance of the 1.5 MPa ranged pressure sensor exhibits a full-scale output of approximately 59.55 mV/1500 kPa/3.3 VDC in room temperature and a high overall accuracy (combined with hysteresis, non-linearity and repeatability) of 0.17%FS within the temperature range of −55 °C to 350 °C. In addition, the thermal hysteresis is also evaluated as approximately 0.15%FS at 350 °C. The tiny-sized high temperature pressure sensors are promising in various industrial automatic control applications and wind tunnel testing systems. Full article

In this article, based on the developed methodology, the stages of designing the sensitive element of a microelectromechanical gyroscope with an open-loop structure are considered. This structure is intended for use in control units for mobile objects such as robots, mobile trolleys, etc. To quickly obtain a ready-made gyroscope, a specialized integrated circuit (SW6111) was selected, for the use of which the electronic part of the sensitive element of the microelectromechanical gyroscope was developed. The mechanical structure was also taken from a simple design. The simulation of the mathematical model was carried out in the MATLAB/Simulink software environment. The mechanical elements and the entire structure were calculated using finite element modeling with ANSYS MultiPhysics CAD tools. The developed sensitive element of the micromechanical gyroscope was manufactured using bulk micromachining technology−silicon-on-insulator−with a structural layer thickness equal to 50 $\mathsf{\mu }$m. Experimental studies were carried out using a scanning electron microscope and a contact profilometer. Dynamic characteristics were measured using a Polytec MSA-500 microsystem analyzer. The manufactured structure has low topological deviations. Calculations and experiments showed fairly accurate results for the dynamic characteristics, with an error of less than 3% for the first iteration of the design. Full article