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Recent Advances in Microelectromechanical Systems for Sensing Applications

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (20 October 2022) | Viewed by 280

Special Issue Editor


E-Mail Website
Guest Editor
Biomedical Acoustic Laboratory, Department of Mechanical Engineering; Hanyang University, Seoul 04793, Korea
Interests: ultrasound imaging; photoacoustic imaging; chemical/bio sensors based on micromechanical resonators; multi-resonator systems; ultrasonic transducers; RF MEMS

Special Issue Information

Dear Colleagues,

In the last two decades, micromachined sensors have been widely adopted in various sectors, including mobile electronics, automotive, etc. Where traditional micromachined sensors have achieved a successful commercialization in inertial sensing and microphone applications, various microelectromechanical systems have been investigated for the next killer applications. This Special Issue is focused on the recent advances in the development of MEMS for various sensing applications.

A novel sensing mechanism has been developed based on new fabrication techniques, such as nanomaterial and nanostructure, flexible and stretchable material, and 3-D fabrication. The low-cost sensors based on soft lithographies such as printing, molding, and embossing are another example. The fabrication and characterization of this new sensor structure will be covered.

Novel sensing techniques can be implemented using existing micromachined sensor technology, including physical (gyroscope, accelerometer, force and tactile sensor) electrical (conductivity, permittivity), and acoustic sensors (microphone, SAW, CMUT, PMUT).

Recently, there has been wide development in the new applications. Implantable sensors have recently been investigated for in vivo monitoring and flexible/attachable sensors for continuous monitoring. The signal from an array of MEMS sensors can be used for biometric identification. Low-power or zero-power human monitoring sensors have been implemented using energy harvesting structures such as triboelectric nanogenerators. Acoustic MEMS transducers and sensors have been used for medical imaging applications. Environment sensors for gas composition and microparticles in the air are still under investigation.

This Special Issue will cover recent prominent studies on MEMS sensors in various aspects, such as the fabrication process, new materials, sensing techniques, and novel applications.

Prof. Dr. Kwan Kyu Park
Guest Editor

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Nanomaterial and nanostructure for MEMS sensors
  • Flexible device for sensing
  • Soft lithography (printing, molding and embossing)
  • 3D fabrication technique for sensors
  • Implantable sensing for in vivo monitoring
  • Flexible/attachable sensors for continuous monitoring
  • Biometric identification
  • Low-power or zero-power sensors
  • Sensors based on triboelectric nanogenerators
  • Medical imaging applications
  • Gas and environment sensors (microparticle, gas composition)

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Published Papers

There is no accepted submissions to this special issue at this moment.
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