Technology for the Monitoring and Control of Laser Powder Bed Fusion

Special Issue Editor


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Guest Editor
ArGEnCo Department, MSM Team, University of Liège, Quartier Polytech 1, Allée de la Découverte 9 (B52), 4000 Liège, Belgium
Interests: additive manufacturing (AM); thermal–mechanical modeling; residual stress and distortion; machine learning (CNN, GPR, QR); microstructure evolution; creep modeling; finite element method (FEM); computational fluid dynamics (CFD); material characterization; process optimization; advanced manufacturing; metal forming; digital twins; heat transfer analysis; numerical simulation; physics-informed AI

Special Issue Information

Dear Colleagues,

We are pleased to invite you to contribute to this Special Issue of the Journal of Manufacturing and Materials Processing titled “Technology for the Monitoring and Control of Laser Powder Bed Fusion”. As LPBF continues to mature as a leading additive manufacturing (AM) technology for fabricating complex, high-performance metal components, the demand for robust in situ monitoring and intelligent control systems becomes more critical than ever. Key challenges such as melt pool instability, porosity, residual stress, and geometric inaccuracies remain persistent, often limiting part quality and repeatability.

This Special Issue aims to bring together recent advances in sensor-based monitoring, real-time data analytics, closed-loop control, machine learning integration, and multi-physics modeling for LPBF. We welcome both experimental and theoretical studies, as well as numerical simulations and hybrid approaches, that advance our understanding of process behavior, defect mitigation, and process optimization.

We encourage contributions in the following areas:

  • In situ monitoring technologies (optical, acoustic, thermal, etc.);
  • Defect detection and quality assurance in LPBF;
  • Closed-loop and adaptive control strategies;
  • Sensor fusion and data interpretation;
  • Machine learning and AI for LPBF process prediction;
  • Real-time data processing and digital twins;
  • Melt pool dynamics and modeling;
  • Process stability, repeatability, and reliability;
  • Multiscale simulations and feedback models.

We look forward to your high-quality submissions that contribute to advancing the state of the art in LPBF manufacturing.

Dr. Fan Chen
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Manufacturing and Materials Processing is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • laser powder bed fusion (LPBF)
  • additive manufacturing
  • process monitoring
  • closed-loop control
  • defect detection
  • sensor fusion
  • in situ monitoring
  • machine learning

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Published Papers

This special issue is now open for submission.
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