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Metasurfaces: Innovations in Design, Fabrication, and Applications

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".

Deadline for manuscript submissions: 20 May 2026 | Viewed by 7

Special Issue Editors


E-Mail Website
Guest Editor
School of Information and Communication Engineering, Dalian University of Technology, Dalian 116024, China
Interests: filter antenna; metasurface; multiband antenna
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
School of Mechanical, Electrical and Information Engineering, Shandong University (Weihai), Weihai 264209, China
Interests: antennas; electromagnetic metamaterials; reflectarray; integrated micro nano optoelectronic devices

Special Issue Information

Dear Colleagues,

This Special Issue delves into the latest advancements in metasurfaces, focusing on their innovations and diverse applications. Metasurfaces, artificial materials composed of subwavelength structures, have revolutionized our ability to manipulate electromagnetic waves across diverse spectra (microwave, terahertz, infrared, optical). Their unique capabilities in controlling wavefront, polarization, amplitude, and phase with ultra-compact form factors offer unprecedented opportunities for next-generation electromagnetic and photonic devices. This Special Issue will capture the cutting-edge research and emerging trends driving the field forward, highlighting significant advancements in design methodologies, novel materials, fabrication techniques, and transformative applications.

We invite the submission of original research articles that present novel insights, significant experimental or theoretical results, and critical perspectives on the development and application of metasurfaces. High-quality contributions addressing fundamental challenges and showcasing innovative solutions are particularly encouraged.

Potential topics include, but are not limited to, the following:

  • Advanced Design and Modeling: Inverse design, topology optimization, multi-functional/dynamic metasurfaces, non-local/metagrating concepts, digital/coding metasurfaces, AI/ML-driven design automation, and multi-physics modeling.
  • Novel Materials & Active Control: Reconfigurable and tunable metasurfaces (electro-optic, thermo-optic, opto-mechanical, phase-change, microfluidics), nonlinear metasurfaces, time-varying metasurfaces, integration with 2D materials (graphene, TMDCs), and chiral metasurfaces.
  • Fabrication and Characterization Innovations: High-throughput, scalable, and cost-effective nanofabrication techniques (nanoimprint, self-assembly, roll-to-roll), monolithic integration with CMOS/Si-photonics, advanced characterization methods (near-field, ultrafast), and tolerance analysis and robustness.
  • Emerging Applications:
    • Imaging and Displays: Ultra-compact metalenses (achromatic, broadband), computational imaging, holography (static/dynamic), augmented/virtual reality (AR/VR) near-eye displays, light-field displays, and endoscopic imaging.
    • Sensing and Spectroscopy: Ultrasensitive bio/chemical sensors, label-free detection, miniaturized spectrometers, LiDAR, environmental monitoring, hyperspectral imaging, and THz sensing.
    • Communications & Beam Control: Next-generation antennas (beamforming, MIMO, OAM), intelligent reflecting surfaces (IRS/RIS), satellite communications, wireless power transfer, cloaking, and radar cross-section reduction.
    • Quantum Technologies: Quantum metasurfaces, single-photon sources/detectors, quantum state manipulation, entanglement generation.
    • Energy & Sustainability: Perfect absorbers, thermophotovoltaics, radiative cooling surfaces, and solar energy harvesting/concentration.
    • Computing & Signal Processing: Optical analog computing, neuromorphic photonics, edge detection, convolution operations, and microwave signal processing.
  • System Integration and Packaging: Hybrid metasurface–conventional electronic/optics systems, integration with electronic circuits or photonic integrated circuits (PICs), and packaging challenges and thermal management.

Dr. Changfei Zhou
Dr. Xingliang Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • metasurfaces
  • electromagnetic metamaterials
  • next-generation antennas
  • wireless power transfer
  • photonic integrated circuits

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Published Papers

This special issue is now open for submission.
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