Microelectronic Engineering: Devices, Materials, and Technologies
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".
Deadline for manuscript submissions: 25 August 2025 | Viewed by 417
Special Issue Editor
Special Issue Information
Dear Colleagues,
The field of microelectronic engineering has been crucial in shaping modern technology, driving advancements in communication, computation, healthcare, and beyond. As we navigate an era of unprecedented technological progress, the integration of innovative devices, advanced materials, and cutting-edge technologies has become essential to meet the increasing demands for higher performance, energy efficiency, and miniaturization.
This Special Issue, entitled ‘Microelectronic Engineering: Devices, Materials, and Technologies’, aims to provide a platform for the dissemination of innovative research and developments in this dynamic domain. The scope encompasses a wide range of topics, including, but not limited to, novel device architectures, fabrication techniques, material innovations, and their applications in emerging technologies. Contributions addressing challenges in scaling, reliability, and sustainability are encouraged
We invite original research articles, comprehensive reviews, and insightful perspectives that explore the synthesis, characterization, and application of advanced materials such as 2D materials, wide-bandgap semiconductors, and nanostructured materials. Studies on device engineering, including transistor technologies, memory devices, and optoelectronics, as well as innovations in process technologies like lithography, etching, cleaning, and advanced packaging technology, are highly welcomed. Additionally, we encourage submissions focused on semiconductor equipment technology, microelectronic reliability, and the applications of artificial intelligence (AI) in microelectronics.
This Special Issue aims to promote collaboration and exchange among researchers, engineers, and industry professionals, contributing to the collective advancement of microelectronic engineering. By bridging the gap between fundamental research and practical applications, this Special Issue seeks to inspire the next wave of technological breakthroughs.
Dr. Hu He
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- microelectronic engineering
- transistor technologies
- lithography
- optoelectronics
- process technologies
- advanced packaging
- semiconductor equipment
- microelectronic reliability
- artificial intelligence for microelectronics
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