Next Article in Journal
High-Accuracy Bandgap Reference of <20 ppm/°C: A Review
Next Article in Special Issue
Optimised Extension of an Ultra-Low-Power RISC-V Processor to Support Lightweight Neural Network Models
Previous Article in Journal
Weak Physycally Unclonable Functions in CMOS Technology: A Review
Previous Article in Special Issue
A Prediction about Radio Frequency Envelope Detectors for Implementing a 2.4 GHz Rectenna for IEEE 802.15.4 with MOS Transistors
 
 
Font Type:
Arial Georgia Verdana
Font Size:
Aa Aa Aa
Line Spacing:
Column Width:
Background:
Communication

Low-Power, High-Speed Adder Circuit Utilizing Current-Starved Inverters in 22 nm FDSOI

Department of Electrical Engineering and Computer Science, University of Arkansas, Fayetteville, AR 72701, USA
Submission received: 22 November 2024 / Revised: 16 December 2024 / Accepted: 30 December 2024 / Published: 3 January 2025
(This article belongs to the Special Issue IC Design Techniques for Power/Energy-Constrained Applications)

Abstract

:
A low-power, high-speed adder circuit topology based on current-starved inverters is presented to provide a basic arithmetic function for low-power, high-frequency signal processing systems. The adder is designed in 22 nm FDSOI (Fully-Depleted Silicon-on-Insulator) technology and is suitable for operation up to 5 GHz (Giga-Hertz). The proposed adder utilizes current-starved inverters to implement low-power operation while still maintaining signal integrity for high-frequency sine signals. The circuit uses a differential input and output structure to mitigate potential noise coupling onto any high-frequency signal pathways. The proposed solution differs from standard adder architectures by utilizing a fully analog signal processing design, accepting analog inputs while outputting an analog signal, and offering suitable functionality at Giga-Hertz level signals as compared to other relevant works. The simulated experimental results show the power consumption to be approximately 150 nW at 0.8 V supply with an input-referred noise of 6.091 nV/Hz at 5 GHz.

1. Introduction

Basic arithmetic functions are the basis for complex computational systems such as addition, subtraction, and multiplication that are required within a fast Fourier transform [1] or addition operations needed within a multiplier [2]. The development of these basic arithmetic functions (addition, subtraction, multiplication, division) becomes non-trivial when creating the operations within a circuit environment, especially as technology continually progresses to higher operating speeds while striving to decrease power consumption. With the further development of 5G/6G technologies, these basic arithmetic operations require the additional capability of maintaining signal integrity while introducing as little noise as possible for small input signals. Therefore, it can be challenging to design and implement a low-power, high-speed arithmetic function while simultaneously considering how much noise is generated within the circuit topology.
A typical implementation of an adder circuit topology is within Field Programmable Gate Arrays (FPGAs) utilizing fully digital constructs [3]. However, FPGA implementation can be extremely power-intensive while also over-utilizing resources that may be unnecessary for the arithmetic operation. On the other hand, purely analog adder topologies offer extremely low power consumption at the cost of higher speed operation and slightly more complex circuit architectures to accommodate analog signal pathways [4]. Additionally, there has been work on creating an adder circuit topology utilizing newly implemented devices [5]. These newly developed devices are not widely available and would be cost prohibitive to utilize in mass-produced integrated circuit designs.
Mixed-signal design methodologies offer the best approach with low power consumption and high-speed operation with the added bonus of low noise capability [6]. In [7], a hybrid analog/mixed-signal adder topology is presented that achieves low delay and low power consumption suitable for a variety of applications. In [8], another hybrid approach is presented that is capable of achieving adder operation at 8 GHz at a lower supply rail of 0.9 V. Likewise, Refs. [9,10] implement mixed-signal adder circuits that demonstrate higher speed operation while maintaining a desired low power consumption. However, all these circuit designs do not consider the impact of noise on their systems as they stick to a purely digital output signal rather than a sine signal that would be seen in communication systems.
Delving deeper into the relevant literature, the adder presented in [11] is a part of a system that can produce sine wave outputs for a specific modulation pattern. The adder within the given architecture demonstrates a digital methodology using a ripple carry adder topology for the design. The adder functions effectively at 5 GHz, but the overall system design is conducted within a SiGe (Silicon Germanium) technology node, which has improved high-frequency characteristics as compared to standard Silicon CMOS (Complementary Metal-Oxide-Semiconductor) technology nodes. The specialized technology node offers substantial performance metrics for the signal processing time of the adder at higher frequencies. Likewise, the analog adder design presented in [5] utilizes a specialized Indium–Gallium–Zinc-Oxide think-film transistor technology to produce a low-power system. Like the proposed design, this low-power adder architecture uses only analog signal processing techniques to accept a sine signal at the inputs and output a sine signal as well. While this specialized technology offers significant low-power operation at 78 μW (micro-Watt), the system is not capable of operating above around the 100 kHz range, which significantly hampers its capability for inclusion in high-frequency communication systems.
While many digital systems use FPGA-designed adders, building a custom adder design such as shown in [8] enables significant customization capabilities like those seen in the proposed design. The presented adder circuit can operate at a maximum frequency of 8 GHz within a 16 nm technology node while detailing improved power consumption results of 1 μW at these high frequencies with a load capacitor of 1 fF (femto-Farad). While this work details a promising full adder circuit design, the adder cannot be utilized directly for the combination of sine signals without additional circuit constructs converting the analog signal into a digital one for standard bit addition. Similarly, the adder topology presented in [12] details a digital bit adder design in a 45 nm technology node that has low power consumption (in the low nano-Watt range) while operating at a 100 MHz (Mega-Hertz) frequency. Again, the presented design shows significant improvements in transistor count and power consumption but does not offer any capabilities for insertion into a signal processing system that requires analog input/output structures. Therefore, these standard adder design architectures lack the suitability for implementation within a purely analog signal processing architecture that is desirable for high-frequency communication systems.
This paper presents the design of a low-power, high-speed adder circuit topology that utilizes current-starved inverters to decrease power consumption while maintaining a low input-referred noise suitable for communication systems. Current-starved inverters offer unique benefits over the previously discussed systems. Their circuit structure and design provide the capability for the end-user to control the amount of power consumption within the system while simultaneously being easy to utilize and integrate into signal processing systems since they are inherently digital constructs (inverter base structure) that many designers already have a high familiarity with these circuits. These advantages coupled with the fact that they do not require specialized processes outside of CMOS structures to be implemented lead to their advantages over other signal processing constructs that may be included within a system. The proposed design addresses the gaps of analog/mixed-signal design in high-frequency communications systems for high-speed and low-noise application environments by detailing a small and robust circuit design that can be easily recreated for inclusion into larger systems without requiring excessive power or adding much noise to the signal pathways. The paper is organized as follows: Section 2.1 details the adder structure and basic operation; Section 2.2 describes the circuit implementation of the adder architecture; Section 3 shows the experimental simulation results obtained within the 22 nm FDSOI technology; Section 4 delves deeper into the results with a comparison to other instances of the literature; and Section 5 summarizes the results and discusses any future work.

2. Materials and Methods

Utilizing the discussed methods in the previous section, the method for the design and construction of the current-starved inverter-based adder is presented in the following sections.

2.1. Adder Structure and Operation

The proposed adder circuit structure is shown in Figure 1 and is based upon the concepts in [13]. This adder implementation focuses on the use of differential signaling and decreased power consumption through the utilization of fewer component structures within the signal pathway. Fewer components in the system also has the additional benefit of reducing the number of noise contributors to any signal processing system that would implement this adder topology. Further discussion of the individual inverter characteristics and structure are contained within Section 2.2.
The overall adder topology consists of six current-starved inverters (detailed in Section 2.2). The circuit topology is broken down into two sections that comprise the positive signals and negative signals. Each circuit section is composed of three current-starved inverters. Two of the inverters receive the input signals and convert them to current signals (as demonstrated in [13]) via drain current square approximation assuming that the transistors are consistently operating within the saturation region. The current signals add together using Kirchhoff’s Current Law. The added signals enter in the third current-starved inverter that shorts the input and output of the inverter such that both the NMOS N-type Metal-Oxide-Semiconductor) and PMOS (P-type Metal-Oxide-Semiconductor) devices of the inverter are diode-connected. The diode-connected inverter converts the signals back to an output voltage for utilization in further signal processing constructs downstream. Thus, the four current-starved inverters on the left of Figure 1 receive voltage input signals and convert them to current signals to be added together at their respective output nodes prior to when the two right current-starved inverters convert them back into a voltage signal via the diode-connection.
The simplified nature of the adder structure offers a unique capability to add two high-frequency sine signals together with minimal noise introduction. Additionally, the differential operation leads any local noise from outside the adder topology that couples onto the signal pathways to be rejected. This operation is similar to what would be seen within a low-voltage differential signal (LVDS) amplifier used within other analog/mixed-signal applications. Furthermore, the reduced number of inverter structures offers decreased power consumption and noise introduction.

2.2. Circuit Implementation

The circuit implementation of the adder topology is described in the following sections and details the circuit structure needed to fully operate the differential adder topology with only a few input signals.

2.2.1. Current-Starved Inverter

The current-starved inverter comprises the majority of the circuit implementation and is detailed in Figure 2. The behavior of the current-starved inverter is exactly the same as a standard inverter except that the edges of the output signal are smoothed due to the limited current from the cascode bias transistors.
The current-starved inverter consists of six transistors. The core inverter transistors are surrounded by four cascode transistors (two PMOS and two NMOS devices) that limit the current to the inverter via the four biasing signals Bias_c, Bias_p, Bias_n, and Bias. The four biasing transistors are minimum-sized for the technology node (width = 80 nm [nanometer], length = 20 nm) since these cascode devices only exist to limit the current and should be minimized to limit their impact on the size of the physical layout of the circuit. The inverter transistors are sized at a width of 4 μm (micro-meter) and a length of 100 nm. The increased size for the inverter transistors improves the linearity and gain of the current-starved inverter at higher frequencies while also limiting the noise introduction to the system. The basic operation of the current-starved inverter follows the same logic as a standard inverter cell with slower edge transitions due to the current limiting transistors and biasing signals. The transistor sizing was kept at minimum values except for the core inverter devices to maintain correct biasing levels without too much variation from the biasing circuit (discussed in the next section). The inverter core devices are sized larger to contend with the signal attenuation created by utilizing weak inversion devices such that some gain is achieved by the inverter core leading to slightly larger power consumption with the benefit of increasing the signal pathway gain that leads to overall decreased circuit noise.

2.2.2. Biasing Circuit

Each adder cell contains a single biasing cell that provides the four biasing signals to every current-starved inverter within the individual adder topology. The biasing cell provides the four biasing signals required for the operation of each inverter and is seen in Figure 3. The bias signals shown are DC (Direct Current) signals and do not have any logic or frequency signal associated with them and are only present to provide DC voltage levels to the current-starved inverter circuit. These DC voltage levels provide the current limiting that slows down the edge transitions within the current-starved inverter core circuit shown in the previous section.
All transistors within the biasing cell are minimum-sized (W = 80 nm, L = 20 nm) to limit any potential impact they may have on the operation of the adder cell as well as reduce physical layout size. The cell generates the “ B i a s c ” and “ B i a s p ” signals through the use of a Minch cascode current mirror [14] with diode-connected devices present to represent the inverter core transistors. The diode-connected devices are the same width and length on the inverter core transistors from Section 2.2.1 and help maintain the biasing signals’ DC levels with respect to the voltage rail as well as voltage headroom through the stacked devices. “ B i a s ” and “ B i a s n ” are direct inputs from either off-chip or are generated elsewhere on-chip (a beta multiplier or similar circuit, for example). Minimum-sized devices were utilized for all transistors such that high-frequency operation could be achieved with little impact on signal pathways due to capacitive loads from larger transistors. Input bias levels are chosen to maintain sufficient operation for the current-starved inverters while also keeping transistors within a weak inversion state to lower power consumption.

3. Results

The current-starved circuit topology was implemented within the 22 nm FDSOI (Fully-Depleted Silicon-on-Insulator) technology and within the Cadence Virtuoso design suite using transistor models provided by the commercially available integrated circuit foundry. The transistor models provide simulation characteristics across process, voltage, temperature, and frequency to account for the functional variability that the transistor devices exhibit due to varying design parameters. The commercially available models combined with the Cadence Design Suite offer extensive simulation capabilities that detail the capacitive and inductive characteristics of the transistors up to the transition frequency of the devices via detailed transfer functions that are provided by the foundry to the university. Therefore, any variance in capacitance or inductance is already taken into account by the Cadence simulator. The Cadence Design Suite was utilized as it is the leading integrated circuit design software for both industry and academia and has extensive useful software modules that generate meaningful integrated circuit design results through a variety of simulators. The Analog Design Environment spectre simulator used in these circuit designs offers a variety of functionalities from transient simulations to noise analysis that lead to a more detailed characterization of the design.
The power supply was set to be 0.8 V with the “ B i a s ” and “ B i a s n ” signals being set to 10 nA and 100 nA, respectively. A third condition was used to determine the power and noise parameters for the circuit via a 5 GHz signal passing through the adder with either in-phase signals, signals 90° out of sync, and signals 180° out of sync. All results in the figures are taken from the Cadence Virtuoso design simulator for further analysis. Additionally, the output differential signal in each figure is attenuated as compared to the input differential signals due to current-starved inverters’ gain response at high frequencies. The sine signal was chosen to determine the best response for the adder topology if it was inserted into a telecommunications system where sine waves comprise the input and output signals from and to antennas, respectively. The goal of only utilizing the sine wave is to show the circuit performance characteristics if analog signal processing was undertaken rather than the normally power and time intensive digital conversion and analysis. The utilization of the sine wave is to input signal types that would be highly present in communications systems. The sine wave is the base structure that most communication systems use to modulate important information with varying higher frequency sine signals based upon the type of communication protocol. Showing the results with sine waves demonstrates the proposed design’s capability to be effectively inserted into a signal processing system for communication applications.
Figure 4 details the two differential input signals (top two signals) with the differential output signal (bottom signal) while the two input signals are in-phase with each other. The current draw for this experiment is 184.6 nA leading to a power consumption of 147.7 nW. The output differential signal experiences attenuation from the current-starved inverters and system design with an attenuation value of 4.082 dB. The in-phase experimental results are the least strenuous on the circuit and result in lower current and power consumption for the design.
Figure 5 depicts the two differential input signals (top two signals) with the differential output signal (bottom signal) while the two input signals are 90° out of phase with each other. The current draw for this experiment is 187.2 nA leading to a power consumption of 149.8 nW. Again, the output differential experiences an attenuation of 6.02 dB due to the circuit design and structure. The 90° out of phase test results are the middle ground experiment for the adder circuit topology and represent a more common current draw and power consumption that would be seen in a typical system operation with this circuit.
Figure 6 shows the two differential input signals (top two signals) with the differential output signal (bottom signal) while the two input signals are 180° out of phase with each other. The current draw for this experiment is 190.5 nA, leading to a power consumption of 152.4 nW. The output differential signal shows full attenuation due to the two signals canceling each other out completely. The 180° out of phase experimental results are the most strenuous on the circuit and result in the highest current and power consumption for the design as the differential signals are constantly on within the circuit and canceling each other out at the outputs of the adder. The three results detail how the current-starved inverter structure operates effectively given various input signal conditions while maintaining a design with low-power, low-noise, and high-frequency operation. Additionally, it is highly pertinent that the signal integrity of the input signal be maintained such that no degradation (noise) is introduced by the design, which can be seen in the clean output sine signal obtained in the above figures. Practically, these results line up with current applications in real-world systems as to what one would expect from the different phase alignments. Also, the low-power and low-noise results would align well with what system designers would aim for within practical communications systems for a circuit that adds two sine waves. The minimal noise insertion while maintaining low-power operation are key benefits to any communication systems within the ever-growing application space.

4. Discussion

Utilizing the results from Section 3, the input-referred noise for the adder circuit for all three experiments is 6.091 nV/ Hz . This noise level extrapolates to a noise floor for the circuit at or above 0.4307 mV amplitude for the input signal prior to noise washing out the signal pathways. The noise results are obtained from the same simulator as the transient signals but do not produce any graphical results besides the input-referred noise number. The noise level depends solely on the number of transistors in the design and their connectivity rather than signal propagating throughout the design, which can be seen in all three signals having the same noise level. The results for all three experiments are summarized in Table 1 below. The major limitation and drawback of the proposed adder topology is the attenuation of the current-starved inverters at higher frequencies. This limitation can be countered by increasing the current draw and thus by the power consumption reducing the novelty of the design, as well as by analog/mixed-signal implementation. Additionally, changing the biasing settings for the simulations from the provided numbers in Section 1 would only change the amplitude of the sine signals via varying the gain of the core inverter transistors as well as either speeding up or slowing down the edge transitions depending on whether the current is raised or lowered, respectively. The noise levels would also change based upon the varying gain due to the gain’s effect on the inverter core’s transistor functionality.
Table 2 compares the results of this work with adder topologies that are close in structure to this design. The comparisons are skewed since standard adder designs are created for digital systems and very little work was found for analog/mixed-signal adders for communications applications. The proposed design shows significant improvement in frequency, although it is in the middle in terms of power consumption and largest for transistor count (single-sided only) for reported values. Table 2 shows the middle ground simulation results from the proposed adder with 90° out of phase signals to the best results from the compared works. The proposed adder topology significantly outperforms its counterparts via increased frequency with similar or less power consumption (even though typical circuit operation at higher frequencies requires higher power). Additionally, the proposed design achieves this novelty with a higher transistor count as well as decreasing noise contributions to the high-frequency signal pathway. The main exception is from [12], which shows a markedly improved power consumption, but the design utilizes only 100 MHz signals and remains in the digital domain as compared to the proposed adder’s design for analog communication systems. While the digital designs may not have accounted explicitly for noise contributions due to utilizing digital signaling, analog signal processing requires limited noise contributions to maintain signal integrity during the processing tasks (such as addition). Using the transistor count metric instead of area is meant to detail the relative size of each circuit design through the varying technology nodes as direct comparison would result in smaller technology nodes appearing better than larger nodes. The main aspect is to show that while the technology node for the proposed design is smaller than all but one compared design, the work shows higher frequency operation at a low power consumption. Noise comparison is not considered within this table since not every circuit was explicitly designed for this criterion. The idea to design a circuit with lower noise contributions is extremely beneficial to analog/mixed-signal communication systems and their designs. Therefore, the proposed work focused on achieving good signal integrity, lower power consumption, and improved noise contributions to an analog signal pathway.
While the proposed design is effective at low-noise and low-power operation at the higher frequency domain, the main drawback is the attenuation that occurs within the current-starved inverters. To combat this effect, some design considerations that could be changed would include larger transistor devices throughout the circuit. Larger device sizing would have an impact on the power consumption of the circuit but would offer increased gain attributes and potentially equal or smaller noise contributions depending on which devices are changed. Additionally, different combinations of the current-starved inverters instead of the configuration shown in Figure 1 could increase the gain of the overall design while maintaining the low-power and low-noise operations.
Within communication systems, low-noise attributes are highly desirable and useful for maintaining signal integrity and propagation. At higher frequencies, the modulation amplitude and signal amplitude will be increasingly affected by small perturbations that noise injection might cause within a given system. This effect is especially true within lower SNR (signal-to-noise ratio) systems where the gain is slight, leading to smaller signal amplitudes overall. Outside of the realm of communications, the proposed design has the capability for utilization within any signal processing system that requires adder circuitry as well as low-noise and low-power operation such as standalone IoT (Internet-of-Things) or implantable biomedical devices that require simple pre-processing of sensor information. The circuit’s suitability for these diverse applications increases its likelihood for inclusion in future wireless signal processing systems.

5. Conclusions

A low-power, high-speed adder circuit topology is presented that utilizes current-starved inverters to demonstrate an addition operation for 5 GHz sine signals for communications applications. The proposed design consumes approximately 150 nW of power with a supply voltage of 0.8 V within a 22 nm FDSOI technology node in addition to outperforming comparable works frequency and power metrics, which are highly useful in communications applications. As discussed in previous sections, the adder circuit topology targets telecommunication systems that aim to remove power- and time-intensive data conversion circuitry by focusing on purely analog signal processing techniques. This implementation requires utilizing sine signals at both the input and output terminals to avoid any digital constructs. Since the adder is focused on analog processing from potential communications antennas, it primarily centers around reducing any noise contribution the design would add, as well as maintaining a low power consumption to keep the overall communication system available power for information transmission rather than signal processing. With the majority of signal processing techniques using digital constructs, the proposed work details the continued importance of how utilizing analog design techniques will achieve similar or better operating conditions than digital counterparts (power, noise, speed) within what is primarily seen as a digital application (wireless signal processing). Future work includes optimization of the adder topology to further decrease power consumption while also pushing for higher frequencies with a lower number of transistors. The proposed adder design is slated for a future tapeout this year to compare measured experimental results to the presented simulated results. Additionally, the development of a current-starved multiplier with the adder topology as its core is in process. These planned future activities will offer the ability to validate the proposed design through experimental verification from fabricated microchips and further utilization of the current-starved inverter core within other signal processing circuitry.

Funding

This research received no external funding.

Institutional Review Board Statement

Not applicable.

Informed Consent Statement

Not applicable.

Data Availability Statement

Data are contained within the article.

Acknowledgments

The author would like to thank the University of Arkansas for its facilities and Global Foundries for its University Partnership Program, which made the acquisition of these results possible.

Conflicts of Interest

The author declares no conflicts of interest.

References

  1. Dvorak, V.; Fujcik, L.; Pristach, M. Area efficient implementation of fast fourier transform for ASIC. In Proceedings of the 2015 38th International Conference on Telecommunications and Signal Processing (TSP), Prague, Czech Republic, 9–11 July 2015; pp. 753–755. [Google Scholar] [CrossRef]
  2. Rao, K.D.; Gangadhar, C.; Korrai, P.K. FPGA implementation of complex multiplier using minimum delay Vedic real multiplier architecture. In Proceedings of the 2016 IEEE Uttar Pradesh Section International Conference on Electrical, Computer and Electronics Engineering (UPCON), Varanasi, India, 9–11 December 2016; pp. 580–584. [Google Scholar] [CrossRef]
  3. Ajit, A.; Arathi, P.V.; Haridas, K.; Nambiar, N.M.; Devi, S. FPGA Based Performance Comparison of Different Basic Adder Topologies with Parallel Processing Adder. In Proceedings of the 2019 3rd International Conference on Electronics, Communication and Aerospace Technology (ICECA), Coimbatore, India, 12–14 June 2019; pp. 87–92. [Google Scholar] [CrossRef]
  4. Qiu, H.; Liang, J.; Bai, W.; Lam, H.M.; An, J.; Liao, C.; Zhang, M.; Jiao, H.; Zhang, S. A Compensation System using Analog Voltage Adder with Continuous Output for AMOLED Display Drivers. In Proceedings of the 2020 IEEE International Symposium on Circuits and Systems (ISCAS), Seville, Spain, 12–14 October 2020; pp. 1–5. [Google Scholar] [CrossRef]
  5. Bahubalindruni, P.G.; Tavares, V.G.; Fortunato, E.; Martins, R.; Barquinha, P. Novel linear analog-adder using a-IGZO TFTs. In Proceedings of the 2016 IEEE International Symposium on Circuits and Systems (ISCAS), Montreal, QC, Canada, 22–25 May 2016; pp. 2098–2101. [Google Scholar] [CrossRef]
  6. Novak, A.; Mirhassani, M. Mixed-signal low-noise adder with constant power for side-channel attack immunity. In Proceedings of the 2015 International Symposium on Signals, Circuits and Systems (ISSCS), Iasi, Romania, 9–10 July 2015; pp. 1–4. [Google Scholar] [CrossRef]
  7. Taherinejad, N.; Abrishamifar, A. A new high speed, low power adder; using hybrid analog-digital circuits. In Proceedings of the 2009 European Conference on Circuit Theory and Design, Antalya, Turkey, 23–27 August 2009; pp. 623–626. [Google Scholar] [CrossRef]
  8. Lueangsongchai, S.; Tooprakai, S. Design high speed and low power hybrid full adder circuit. In Proceedings of the 2018 18th International Symposium on Communications and Information Technologies (ISCIT), Bangkok, Thailand, 26–29 September 2018; pp. 22–25. [Google Scholar] [CrossRef]
  9. Roberts, M.K.; Anguraj, P.; Krishnan, T. Design and Analysis of Improved Low Power and High-Speed N-Bit Adder. In Proceedings of the 2021 International Conference on Decision Aid Sciences and Application (DASA), Sakheer, Bahrain, 7–8 December 2021; pp. 858–863. [Google Scholar] [CrossRef]
  10. Agrawal, P.; Raghuvanshi, D.K.; Gupta, M.K. A low-power high-speed 16T 1-Bit hybrid full adder. In Proceedings of the 2017 International Conference on Recent Innovations in Signal Processing and Embedded Systems (RISE), Bhopal, India, 27–29 October 2017; pp. 348–352. [Google Scholar] [CrossRef]
  11. Geng, X.; Dai, F.F.; Irwin, J.D.; Jaeger, R.C. A 5 GHz direct digital synthesizer MMIC with direct modulation and spur randomization. In Proceedings of the 2009 IEEE Radio Frequency Integrated Circuits Symposium, Boston, MA, USA, 7–9 June 2009; pp. 419–422. [Google Scholar] [CrossRef]
  12. Yadav, A.K.; Shrivatava, B.P.; Dadoriya, A.K. Low power high speed 1-bit full adder circuit design at 45 nm CMOS technology. In Proceedings of the 2017 International Conference on Recent Innovations in Signal Processing and Embedded Systems (RISE), Bhopal, India, 27–29 October 2017; pp. 427–432. [Google Scholar] [CrossRef]
  13. Machowski, W.; Jasielski, J. Low voltage, low power analog multipliers based on CMOS inverters. In Proceedings of the 18th International Conference Mixed Design of Integrated Circuits and Systems—MIXDES 2011, Gliwice, Poland, 16–18 June 2011; pp. 352–357. Available online: https://ieeexplore.ieee.org/abstract/document/6015941 (accessed on 1 November 2024).
  14. Minch, B.A. A low-voltage MOS cascode current mirror for all current levels. In Proceedings of the 2002 45th Midwest Symposium on Circuits and Systems, 2002—MWSCAS-2002, Tulsa, OK, USA, 4–7 August 2002; Volume 2, p. II-53. [Google Scholar]
Figure 1. Differential adder circuit topology.
Figure 1. Differential adder circuit topology.
Chips 04 00004 g001
Figure 2. Current-starved inverter circuit diagram.
Figure 2. Current-starved inverter circuit diagram.
Chips 04 00004 g002
Figure 3. Biasing Circuit diagram for Current-starved inverter circuit.
Figure 3. Biasing Circuit diagram for Current-starved inverter circuit.
Chips 04 00004 g003
Figure 4. In-phase differential input signals (top two waveforms) and the differential output signal (bottom waveform) simulations results.
Figure 4. In-phase differential input signals (top two waveforms) and the differential output signal (bottom waveform) simulations results.
Chips 04 00004 g004
Figure 5. 90° out of phase differential input signals (top two waveforms) and the differential output signal (bottom waveform) simulations results.
Figure 5. 90° out of phase differential input signals (top two waveforms) and the differential output signal (bottom waveform) simulations results.
Chips 04 00004 g005
Figure 6. 180° out of phase differential input signals (top two waveforms) and the differential output signal (bottom waveform) simulations results.
Figure 6. 180° out of phase differential input signals (top two waveforms) and the differential output signal (bottom waveform) simulations results.
Chips 04 00004 g006
Table 1. Experimental results for adder circuit topology detailing how the current, power, noise, and attenuation change depending upon the input sine waves.
Table 1. Experimental results for adder circuit topology detailing how the current, power, noise, and attenuation change depending upon the input sine waves.
Signal
Type
Results
Current (nA)Power (nW)Noise (nV/ Hz )Attenuation (dB)
In-Phase184.6147.76.0914.082
90°187.2149.86.0916.02
180°190.5152.46.091Full
Table 2. Summary of performance comparison to relevant works that aim at analog/mixed-signal adder design with this work performing near or better than all others even with more transistors.
Table 2. Summary of performance comparison to relevant works that aim at analog/mixed-signal adder design with this work performing near or better than all others even with more transistors.
This Work[9][10][8][12]
Supply Voltage (V)0.81.00.80.91.0
Frequency (GHz)5.00.10.21.00.1
Power (nW)149.8260.0145.0900.04.989
Technology22 nm90 nm65 nm16 nm45 nm
Transistor Count181416-10
Disclaimer/Publisher’s Note: The statements, opinions and data contained in all publications are solely those of the individual author(s) and contributor(s) and not of MDPI and/or the editor(s). MDPI and/or the editor(s) disclaim responsibility for any injury to people or property resulting from any ideas, methods, instructions or products referred to in the content.

Share and Cite

MDPI and ACS Style

Dix, J. Low-Power, High-Speed Adder Circuit Utilizing Current-Starved Inverters in 22 nm FDSOI. Chips 2025, 4, 4. https://doi.org/10.3390/chips4010004

AMA Style

Dix J. Low-Power, High-Speed Adder Circuit Utilizing Current-Starved Inverters in 22 nm FDSOI. Chips. 2025; 4(1):4. https://doi.org/10.3390/chips4010004

Chicago/Turabian Style

Dix, Jeff. 2025. "Low-Power, High-Speed Adder Circuit Utilizing Current-Starved Inverters in 22 nm FDSOI" Chips 4, no. 1: 4. https://doi.org/10.3390/chips4010004

APA Style

Dix, J. (2025). Low-Power, High-Speed Adder Circuit Utilizing Current-Starved Inverters in 22 nm FDSOI. Chips, 4(1), 4. https://doi.org/10.3390/chips4010004

Article Metrics

Back to TopTop