The Effect of Low-Temperature Plasma Treatment on the Adhesive Bonding Performance of CF/PEKK Surfaces

Polyaryletherketone (PAEK) polymers inherently exhibit low surface activity, leading to poor adhesive bonding performance when using epoxy-based adhesives. In this study, low-temperature plasma surface modification was conducted on carbon fiber-reinforced polyetherketone ketone (CF/PEKK) composites to investigate the influence of plasma treatment parameters on their lap shear strength. Surface characterization was systematically performed using scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and contact angle analysis to evaluate morphological, chemical, and wettability changes induced via plasma treatment. The results demonstrated a significant enhancement in lap shear strength after plasma treatment. Optimal bonding performance was achieved at a treatment speed of 10 mm/s and a nozzle-to-substrate distance of 5 mm, yielding a maximum shear strength of 28.28 MPa, a 238% improvement compared to the untreated control. Notably, the failure mode transitioned from interfacial fracture in the untreated sample to a mixed-mode failure dominated by cohesive failure of the adhesive and substrate. Plasma treatment substantially reduced the contact angle of CF/PEKK, indicating improved surface wettability. SEM micrographs revealed an increased micro-porous texture on the treated surface, which enhanced mechanical interlocking between the composite and adhesive. XPS analysis confirmed compositional alterations, specifically elevated oxygen-containing functional groups on the plasma-treated surface. These modifications facilitated stronger chemical bonding between CF/PEKK and the epoxy resin, thereby validating the efficacy of plasma treatment in optimizing surface chemical activity and adhesion performance.