Analysis of Microstructural Effects on the Thermal Conductivity of Alumina-Spinel Refractories Compared to Alumina Ceramics
Abstract
1. Introduction
2. Materials and Methods
2.1. Materials
2.2. Methods
3. Results and Discussions
3.1. Evolution of the Thermal Conductivity with the Temperature
3.2. Effect of the Porosity
3.3. Effect of the Grain Boundaries and Grain Size
3.4. Effect of Phase Mixture
4. Conclusions
- i.
- The pore phase using Landauer’s relation;
- ii.
- The grain boundary thermal resistance by assuming it acts in series with the thermal resistance of the grains;
- iii.
- A second solid phase using again Landauer’s relation for a mixture of two phases.
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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| Sample Designation | Materials | Total Porosity (%) | Average Grain Size or Range (μm) | Sintering Temperature (°C) |
|---|---|---|---|---|
| Alumina-Spinel | Refractories | 19 | - | - |
| Sapphire | Model materials | 0 | Single crystal | - |
| Alumina TM-DA | 3 | 0.15–0.5 | 1200 | |
| Alumina AKP30-1450 | 20 | 0.45 | 1450 | |
| Alumina AKP30-1300 | 38 | 0.30 | 1300 |
| Sample Designation | a (500 K–1000 K) | Average Grain Size or Range (μm) | n (m−1) | Rint (m2 K W−1) |
|---|---|---|---|---|
| Alumina-Spinel | 1.70 ± 0.04 × 10−4 | 1.0 | 1.0 × 106 | - |
| 3.0 × 103 | 3.3 × 102 | - | ||
| Sapphire | 1.05 ± 0.03 × 10−4 | - | - | - |
| Alumina TM-DA | 1.05 ± 0.03 × 10−4 | 0.30 | 3.3 × 106 | 4.5 × 10−9 |
| Alumina AKP30-1450 | 1.01 ± 0.009 × 10−4 | 0.45 | 2.2 × 106 | 4.5 × 10−9 |
| Alumina AKP30-1300 | 1.38 ± 0.03 × 10−4 | 0.30 | 3.3 × 106 | 1.2 × 10−8 |
| Thermal Conductivity Spinel λspinel (W m−1 K−1) | Parallel Model: Equation (13) λalumina (W m−1 K−1) | Landauer: Equation (16) λalumina (W m−1 K−1) | Maxwell–Eucken: Equation (15) λalumina (W m−1 K−1) | Series Model: Equation (14) λalumina (W m−1 K−1) |
|---|---|---|---|---|
| 20.2 | 29.2 | 29.4 | 29.5 | 30.0 |
| 15 | 30.4 | 31.1 | 31.5 | 34.2 |
| 11.4 | 31.3 | 32.5 | 33.7 | 41.1 |
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Vitiello, D.; Kieliba, I.; Honda, S.; Nait-Ali, B.; Tessier-Doyen, N.; Marschall, H.U.; Smith, D.S. Analysis of Microstructural Effects on the Thermal Conductivity of Alumina-Spinel Refractories Compared to Alumina Ceramics. Ceramics 2026, 9, 26. https://doi.org/10.3390/ceramics9020026
Vitiello D, Kieliba I, Honda S, Nait-Ali B, Tessier-Doyen N, Marschall HU, Smith DS. Analysis of Microstructural Effects on the Thermal Conductivity of Alumina-Spinel Refractories Compared to Alumina Ceramics. Ceramics. 2026; 9(2):26. https://doi.org/10.3390/ceramics9020026
Chicago/Turabian StyleVitiello, Diana, Ilona Kieliba, Sawao Honda, Benoit Nait-Ali, Nicolas Tessier-Doyen, Hans Ulrich Marschall, and David S. Smith. 2026. "Analysis of Microstructural Effects on the Thermal Conductivity of Alumina-Spinel Refractories Compared to Alumina Ceramics" Ceramics 9, no. 2: 26. https://doi.org/10.3390/ceramics9020026
APA StyleVitiello, D., Kieliba, I., Honda, S., Nait-Ali, B., Tessier-Doyen, N., Marschall, H. U., & Smith, D. S. (2026). Analysis of Microstructural Effects on the Thermal Conductivity of Alumina-Spinel Refractories Compared to Alumina Ceramics. Ceramics, 9(2), 26. https://doi.org/10.3390/ceramics9020026
