Utsch, D.; Turowski, T.; Hecht, C.; Thielen, N.; Ockel, M.; Franke, J.; Risch, F.
Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications. Ceramics 2025, 8, 105.
https://doi.org/10.3390/ceramics8030105
AMA Style
Utsch D, Turowski T, Hecht C, Thielen N, Ockel M, Franke J, Risch F.
Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications. Ceramics. 2025; 8(3):105.
https://doi.org/10.3390/ceramics8030105
Chicago/Turabian Style
Utsch, Daniel, Timo Turowski, Christoph Hecht, Nils Thielen, Manuela Ockel, Jörg Franke, and Florian Risch.
2025. "Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications" Ceramics 8, no. 3: 105.
https://doi.org/10.3390/ceramics8030105
APA Style
Utsch, D., Turowski, T., Hecht, C., Thielen, N., Ockel, M., Franke, J., & Risch, F.
(2025). Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications. Ceramics, 8(3), 105.
https://doi.org/10.3390/ceramics8030105
