Multi-Response Optimization of Thermal Conductivity and Rheological Behavior in Nanoparticle-Enhanced Vegetable Oil Emulsions
Abstract
1. Introduction
2. Methodology
3. Results
3.1. Thermal Conductivity
3.2. Viscosity
4. Discussion
5. Conclusions
- Among the evaluated formulations, Pongamia pinnata cutting fluid incorporated with 0.5 (Vol.%) SiO2 nanoparticles consistently exhibited the highest thermal conductivity (0.637), clearly outperforming coconut and sunflower oil cutting fluids under identical operating conditions. This superior performance is primarily attributed to the inherently better thermal transport properties of Pongamia pinnata oil and its stronger interaction with nanoparticles, which together facilitate more efficient heat transfer.
- Across all cutting fluids, nanoparticle effectiveness followed the order SiO2 > hBN > CuO, highlighting the dominant role of nanoparticle dispersion stability and the ability to form continuous thermal conduction networks. SiO2 nanoparticles provided the maximum enhancement due to their excellent dispersion and effective heat transfer pathways, whereas CuO showed the least improvement, owing to comparatively lower dispersion efficiency.
- The viscosity analysis clearly indicates that the base cutting fluid plays a dominant role in governing the rheological behavior of the developed nanofluids, while nanoparticle type and concentration exert a comparatively secondary influence.
- Among all cutting fluids, Pongamia pinnata and the emulsion ratio consistently exhibits the highest viscosity, irrespective of nanoparticle type and nanoparticles (Vol.%). This behavior is primarily attributed to its higher molecular weight, unique fatty acid composition, and stronger intermolecular interactions, which collectively increase resistance to flow.
- Additionally, the emulsion ratio plays a crucial role in governing viscosity; an increase in oil concentration (1:13) results in a notable rise in viscosity, reaching approximately 1.33.
- Overall, the results confirm that Pongamia pinnata cutting fluids offer superior thermal conductivity and viscosity characteristics, making them highly suitable for machining applications requiring enhanced lubrication performance, reduced tool wear, and improved tribological efficiency.
- ANOVA results for thermal conductivity and viscosity indicate that the cutting fluid type is the most influential factor, contributing 90.58% of the total variance in thermal conductivity and 70.47% in viscosity, both with highly significant p-values of 0.00, emphasizing its significant role in determining the stability of these properties.
- The current study utilized ultrasonication for short-term dispersion. Future work should investigate long-term sedimentation rates (Zeta potential analysis) and the potential need for surfactant optimization to ensure shelf-life stability.
- Although thermal and rheological properties suggest superior lubrication, direct tribological testing (e.g., Pin-on-Disk or Four-Ball tests) is required to quantify the wear scar diameter and coefficient of friction reduction under varying loads.
- In situ machining trials (turning or milling) are necessary to correlate these static properties with dynamic outputs such as tool flank wear, surface roughness and cutting forces.
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
Abbreviations
| PP | Pongamia pinnata |
| CC | coconut |
| SF | sunflower |
| hBN | Hexagonal Boron Nitride |
| SiO2 | Silicon Dioxide |
| Cuo | Cupric Oxide |
| TDOE | Taguchi’s Design of Experiments |
| ANOVA | Analysis of Variance |
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| Parameters | Levels | ||
|---|---|---|---|
| 1 | 2 | 3 | |
| Cutting Fluids | PP | CC | SF |
| Nanoparticles | SiO2 | hBN | CuO |
| Emulsion Ratio | 1:7 | 1:10 | 1:13 |
| NanopParticle (Vol.%) | 0 | 0.5 | 1.0 |
| Sl. No. | Cutting Fluids | Nanoparticles | Emulsion Ratio | Nanoparticle (Vol.%) | Thermal Conductivity (W/mK) | Viscosity (mPa·S) |
|---|---|---|---|---|---|---|
| 1 | PP | SiO2 | 1:7 | 0.0 | 0.622 | 0.89 |
| 2 | PP | SiO2 | 1:7 | 0.5 | 0.637 | 0.91 |
| 3 | PP | SiO2 | 1:7 | 1.0 | 0.629 | 0.96 |
| 4 | PP | hBN | 1:10 | 0.0 | 0.604 | 1.05 |
| 5 | PP | hBN | 1:10 | 0.5 | 0.621 | 1.10 |
| 6 | PP | hBN | 1:10 | 1.0 | 0.615 | 1.15 |
| 7 | PP | CuO | 1:13 | 0.0 | 0.601 | 1.20 |
| 8 | PP | CuO | 1:13 | 0.5 | 0.612 | 1.28 |
| 9 | PP | CuO | 1:13 | 1.0 | 0.608 | 1.33 |
| 10 | CC | SiO2 | 1:10 | 0.0 | 0.581 | 0.73 |
| 11 | CC | SiO2 | 1:10 | 0.5 | 0.603 | 0.77 |
| 12 | CC | SiO2 | 1:10 | 1.0 | 0.591 | 0.79 |
| 13 | CC | hBN | 1:13 | 0.0 | 0.567 | 0.84 |
| 14 | CC | hBN | 1:13 | 0.5 | 0.579 | 0.86 |
| 15 | CC | hBN | 1:13 | 1.0 | 0.572 | 0.89 |
| 16 | CC | CuO | 1:7 | 0.0 | 0.541 | 0.62 |
| 17 | CC | CuO | 1:7 | 0.5 | 0.558 | 0.66 |
| 18 | CC | CuO | 1:7 | 1.0 | 0.549 | 0.69 |
| 19 | SF | SiO2 | 1:13 | 0.0 | 0.518 | 0.77 |
| 20 | SF | SiO2 | 1:13 | 0.5 | 0.529 | 0.80 |
| 21 | SF | SiO2 | 1:13 | 1.0 | 0.524 | 0.83 |
| 22 | SF | hBN | 1:7 | 0.0 | 0.511 | 0.54 |
| 23 | SF | hBN | 1:7 | 0.5 | 0.522 | 0.57 |
| 24 | SF | hBN | 1:7 | 1.0 | 0.517 | 0.59 |
| 25 | SF | CuO | 1:10 | 0.0 | 0.501 | 0.63 |
| 26 | SF | CuO | 1:10 | 0.5 | 0.512 | 0.65 |
| 27 | SF | CuO | 1:10 | 1.0 | 0.505 | 0.69 |
| Source | DF | Seq SS | Adj SS | Adj MS | F | P | P% |
|---|---|---|---|---|---|---|---|
| A | 2 | 10.96 | 0.78 | 0.39 | 23.44 | 0.00 | 90.58 |
| B | 2 | 0.78 | 10.9 | 5.48 | 325.5 | 0.00 | 6.52 |
| C | 2 | 0.03 | 0.03 | 0.01 | 0.89 | 0.45 | 0.24 |
| D | 2 | 0.208 | 0.208 | 0.10 | 6.18 | 0.03 | 1.71 |
| A × D | 4 | 0.001 | 0.001 | 0.00 | 0.02 | 0.99 | 0.01 |
| B × D | 4 | 0.005 | 0.005 | 0.001 | 0.08 | 0.98 | 0.04 |
| C × D | 4 | 0.004 | 0.004 | 0.001 | 0.07 | 0.98 | 0.037 |
| RSE | 6 | 0.10 | 0.10 | 0.01 | 0.83 | ||
| Total | 26 | 12.1 |
| Source | DF | Seq SS | Adj SS | Adj MS | F | P | P% |
|---|---|---|---|---|---|---|---|
| A | 87.085 | 87.08 | 43.542 | 51.64 | 0.000 | 70.47 | 87.085 |
| B | 2.903 | 2.903 | 1.4516 | 1.72 | 0.257 | 2.34 | 2.903 |
| C | 26.007 | 26.00 | 13.003 | 15.42 | 0.004 | 21.04 | 26.007 |
| D | 2.472 | 2.472 | 1.2361 | 1.47 | 0.303 | 2.00 | 2.472 |
| A × D | 0.009 | 0.009 | 0.0022 | 0.00 | 1.000 | 0.007 | 0.009 |
| B × D | 0.011 | 0.011 | 0.0027 | 0.00 | 1.000 | 0.008 | 0.011 |
| C × D | 0.023 | 0.023 | 0.0056 | 0.01 | 1.000 | 0.018 | 0.023 |
| RSE | 5.059 | 5.059 | 0.8432 | 4.094 | 5.059 | ||
| Total | 123.56 | 123.56 |
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Shenoy P, V.; Kini M, V.; Pai B, R.; Shenoy Heckadka, S.; Shetty, R.; P, S.J.; Hegde, A. Multi-Response Optimization of Thermal Conductivity and Rheological Behavior in Nanoparticle-Enhanced Vegetable Oil Emulsions. J. Compos. Sci. 2026, 10, 63. https://doi.org/10.3390/jcs10020063
Shenoy P V, Kini M V, Pai B R, Shenoy Heckadka S, Shetty R, P SJ, Hegde A. Multi-Response Optimization of Thermal Conductivity and Rheological Behavior in Nanoparticle-Enhanced Vegetable Oil Emulsions. Journal of Composites Science. 2026; 10(2):63. https://doi.org/10.3390/jcs10020063
Chicago/Turabian StyleShenoy P, Vishal, Vijay Kini M, Raghuvir Pai B, Srinivas Shenoy Heckadka, Raviraj Shetty, Supriya J. P, and Adithya Hegde. 2026. "Multi-Response Optimization of Thermal Conductivity and Rheological Behavior in Nanoparticle-Enhanced Vegetable Oil Emulsions" Journal of Composites Science 10, no. 2: 63. https://doi.org/10.3390/jcs10020063
APA StyleShenoy P, V., Kini M, V., Pai B, R., Shenoy Heckadka, S., Shetty, R., P, S. J., & Hegde, A. (2026). Multi-Response Optimization of Thermal Conductivity and Rheological Behavior in Nanoparticle-Enhanced Vegetable Oil Emulsions. Journal of Composites Science, 10(2), 63. https://doi.org/10.3390/jcs10020063

