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Journal: J. Manuf. Mater. Process., 2020
Article: Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
Authors: by Romit Kulkarni, Mahdi Soltani, Peter Wappler, Thomas Guenther, Karl-Peter Fritz, Tobias Groezinger and André Zimmermann
MDPI provides article reprints in high quality with convenient shipping to destinations worldwide. The articles are printed in on premium paper with high-resolution figures. Our covers are customized to your article and designed to be complimentary to the journal. These reprints are ideal additions to your portfolio. Copy details: 135g/m2 paper, 2x stitched, full colour and glossy finish, orderable in quantities from 10 to 1000.
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