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Journal: J. Manuf. Mater. Process., 2020
Volume: 4
Number: 26
26
Article: Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
Authors: by Romit Kulkarni, Mahdi Soltani, Peter Wappler, Thomas Guenther, Karl-Peter Fritz, Tobias Groezinger and André Zimmermann
Link: https://www.mdpi.com/2504-4494/4/1/26

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