Kluba, M.; Morana, B.; Savov, A.; Van Zeijl, H.; Pandraud, G.; Dekker, R.
Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization. Proceedings 2018, 2, 941.
https://doi.org/10.3390/proceedings2130941
AMA Style
Kluba M, Morana B, Savov A, Van Zeijl H, Pandraud G, Dekker R.
Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization. Proceedings. 2018; 2(13):941.
https://doi.org/10.3390/proceedings2130941
Chicago/Turabian Style
Kluba, Marta, Bruno Morana, Angel Savov, Henk Van Zeijl, Gregory Pandraud, and Ronald Dekker.
2018. "Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization" Proceedings 2, no. 13: 941.
https://doi.org/10.3390/proceedings2130941
APA Style
Kluba, M., Morana, B., Savov, A., Van Zeijl, H., Pandraud, G., & Dekker, R.
(2018). Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization. Proceedings, 2(13), 941.
https://doi.org/10.3390/proceedings2130941