Hasan, M.N.; Polom, T.; Holzmann, D.; Malagó, P.; Binder, A.; Roshanghias, A.
Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters. Electronics 2022, 11, 1373.
https://doi.org/10.3390/electronics11091373
AMA Style
Hasan MN, Polom T, Holzmann D, Malagó P, Binder A, Roshanghias A.
Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters. Electronics. 2022; 11(9):1373.
https://doi.org/10.3390/electronics11091373
Chicago/Turabian Style
Hasan, Md. Nazmul, Timothy Polom, Dominik Holzmann, Perla Malagó, Alfred Binder, and Ali Roshanghias.
2022. "Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters" Electronics 11, no. 9: 1373.
https://doi.org/10.3390/electronics11091373
APA Style
Hasan, M. N., Polom, T., Holzmann, D., Malagó, P., Binder, A., & Roshanghias, A.
(2022). Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters. Electronics, 11(9), 1373.
https://doi.org/10.3390/electronics11091373