Next Article in Journal
A Novel Low-Power Bipolar DC–DC Converter with Voltage Self-Balancing
Previous Article in Journal
Low-Voltage Ride Through Capability Analysis of a Reduced-Size DFIG Excitation Utilized in Split-Shaft Wind Turbines
 
 
Font Type:
Arial Georgia Verdana
Font Size:
Aa Aa Aa
Line Spacing:
Column Width:
Background:
Article

Microstrip Line Modeling Taking into Account Dispersion Using a General-Purpose SPICE Simulator

by
Vadim Kuznetsov
Electronic Engineering, Moscow Bauman State Technical University, 105005 Moscow, Russia
J. Low Power Electron. Appl. 2025, 15(3), 42; https://doi.org/10.3390/jlpea15030042
Submission received: 13 June 2025 / Revised: 16 July 2025 / Accepted: 17 July 2025 / Published: 22 July 2025

Abstract

XSPICE models for a generic transmission line, a microstrip line, and coupled microstrips are presented. The developed models extend general-purpose circuit simulation tools using RF circuits design features. The models could be used for circuit simulation in frequency, DC, and time domains for any active or passive RF or microwave schematic (including microwave monolithic integrated circuits—MMICs) involving transmission lines. The presented models could be used with any circuit simulation backend supporting XSPICE extensions and could be integrated without patching the core simulator code. The presented XSPICE models for microstrip lines take into account the frequency dependency of characteristic impedance and dispersion. The models were designed using open-source circuit simulation software. This study provides a practical example of the low-noise RF amplifier (LNA) design with Ngspice simulation backend using the proposed models.
Keywords: RF circuits; MMIC; microstrip; transmission line; SPICE; compact modeling; circuit simulation RF circuits; MMIC; microstrip; transmission line; SPICE; compact modeling; circuit simulation

Share and Cite

MDPI and ACS Style

Kuznetsov, V. Microstrip Line Modeling Taking into Account Dispersion Using a General-Purpose SPICE Simulator. J. Low Power Electron. Appl. 2025, 15, 42. https://doi.org/10.3390/jlpea15030042

AMA Style

Kuznetsov V. Microstrip Line Modeling Taking into Account Dispersion Using a General-Purpose SPICE Simulator. Journal of Low Power Electronics and Applications. 2025; 15(3):42. https://doi.org/10.3390/jlpea15030042

Chicago/Turabian Style

Kuznetsov, Vadim. 2025. "Microstrip Line Modeling Taking into Account Dispersion Using a General-Purpose SPICE Simulator" Journal of Low Power Electronics and Applications 15, no. 3: 42. https://doi.org/10.3390/jlpea15030042

APA Style

Kuznetsov, V. (2025). Microstrip Line Modeling Taking into Account Dispersion Using a General-Purpose SPICE Simulator. Journal of Low Power Electronics and Applications, 15(3), 42. https://doi.org/10.3390/jlpea15030042

Note that from the first issue of 2016, this journal uses article numbers instead of page numbers. See further details here.

Article Metrics

Back to TopTop