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Study of Birefringence and Stress Distribution of SiO2 Film Optical Waveguide on Silicon Wafer

1
School of Science, Changchun University of Science and Technology, Changchun 130022, China
2
Jilin Sino Microelectronics, Ltd, Jilin 132021, China
3
National Key Laboratory on High Power Semiconductor Lasers, Changchun University of Science and Technology, Changchun 130022, China
*
Author to whom correspondence should be addressed.
Coatings 2019, 9(5), 316; https://doi.org/10.3390/coatings9050316
Received: 10 April 2019 / Revised: 5 May 2019 / Accepted: 8 May 2019 / Published: 10 May 2019
(This article belongs to the Special Issue Design, Manufacturing and Measurement of Optical Film Coatings)
PDF [708 KB, uploaded 13 May 2019]

Abstract

Silica waveguide planar lightwave circuit (PLC) technology is driving the broad applications of various functional components to meet the increasing demands of the industry due to its advanced performance in large-scale wafer mass production. Despite the intense research interests in understanding and relaxing the stress causing the optical birefringence, not much research has been devoted to investigating the stress distribution. In this article, the thermal stress, growth-caused stress, and structural stress are comparably studied. The birefringence distribution of a 6 m-thick SiO2 film from the center to the edge on a 6-inch silicon wafer was measured to be 0.0006 to 0.0038, leading to an equivalent stress distribution cross the wafer from −170 to −1000 MPa. This implies that the compressive stress of the thick SiO2 film on the wafer was nonuniformly distributed; however, it gradually increased from the center to the edge. Meanwhile, the measured stress of a SiO2 film decreased with the flow rate of the doped GeH4 gas. The algebraic sum of the above three stresses reached excellent agreement with the measurement results in both distribution form and amplitude. In both research and production, the agreeable optical property distributions between the theoretical calculations and experimental measurements are more sustainable to further improving the yields of SiO2 thick film PLC products.
Keywords: birefringence; stress; silicon dioxide film; silica waveguide; silicon wafer birefringence; stress; silicon dioxide film; silica waveguide; silicon wafer
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Sun, Q.; Sun, D.; Shang, H.; Yu, T.; Chang, L.; Sun, Z.; Xing, W.; Dong, M. Study of Birefringence and Stress Distribution of SiO2 Film Optical Waveguide on Silicon Wafer. Coatings 2019, 9, 316.

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