Next Article in Journal
Micromechanical Simulation of Thermal Cyclic Behavior of ZrO2/Ti Functionally Graded Thermal Barrier Coatings
Previous Article in Journal
Halogen-Free Phosphonate Ionic Liquids as Precursors of Abrasion Resistant Surface Layers on AZ31B Magnesium Alloy
Open AccessArticle

Role of Cl on Diffusion of Cu in In2S3 Layers Prepared by Ion Layer Gas Reaction Method

Physics Department, Masinde Muliro University of Science and Technology, Kakamega-50100, Kenya
Department of Physics, University of Nairobi, Nairobi-30197, Kenya
Helmholtz-Zentrum Berlin für Materialien und Energie GmbH, Hahn-Meitner-Platz 1, 14109 Berlin, Germany
Author to whom correspondence should be addressed.
Academic Editor: Alessandro Lavacchi
Coatings 2015, 5(1), 54-62;
Received: 27 December 2014 / Revised: 7 February 2015 / Accepted: 11 February 2015 / Published: 16 February 2015
Ion layer gas reaction (ILGAR) method allows for deposition of Cl-containing and Cl-free In2S3 layers from InCl3 and In(OCCH3CHOCCH3)3 precursor salts, respectively. A comparative study was performed to investigate the role of Cl on the diffusion of Cu from CuSCN source layer into ILGAR deposited In2S3 layers. The Cl concentration was varied between 7 and 14 at.% by varying deposition parameters. The activation energies and exponential pre-factors for Cu diffusion in Cl-containing samples were between 0.70 to 0.78 eV and between 6.0 × 10−6 and 3.2 × 10−5 cm2/s. The activation energy in Cl-free ILGAR In2S3 layers was about three times less compared to the Cl-containing In2S3, and the pre-exponential constant six orders of magnitude lower. These values were comparable to those obtained from thermally evaporated In2S3 layers. The residual Cl-occupies S sites in the In2S3 structure leading to non-stoichiometry and hence different diffusion mechanism for Cu compared to stoichiometric Cl-free layers. View Full-Text
Keywords: diffusion; ILGAR; In2S3; CuSCN diffusion; ILGAR; In2S3; CuSCN
Show Figures

Figure 1

MDPI and ACS Style

Wafula, H.; Robinson, M.; Juma, A.; Sakwa, T.; Kitui, M.; Araoz, R.; Fischer, C.-H. Role of Cl on Diffusion of Cu in In2S3 Layers Prepared by Ion Layer Gas Reaction Method. Coatings 2015, 5, 54-62.

Show more citation formats Show less citations formats

Article Access Map

Only visits after 24 November 2015 are recorded.
Coatings, EISSN 2079-6412, Published by MDPI AG
Back to TopTop