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Journal: Coatings, 2026
Volume: 16
Number: 276
276
Article: Structural and Thermal Stability of TiN- and SiC-Based Multilayer Diffusion Barriers for Copper–Silicon Interfaces
Authors: by Symaiyl Keiinbay, Kair Kh. Nussupov, Assanali T. Sultanov, Ilya V. Zhirkov, Nurzhan B. Beisenkhanov and Alex A. Volinsky
Link: https://www.mdpi.com/2079-6412/16/3/276

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