Zhang, X.; Ma, J.; Lin, H.; Jiang, Q.; Wang, J.; Feng, J.
Microstructural Evolution and Failure Analysis for 8YSZ/(Y0.5Gd0.5)TaO4 Double-Ceramic-Layer Thermal Barrier Coatings on Copper Substrate. Coatings 2025, 15, 451.
https://doi.org/10.3390/coatings15040451
AMA Style
Zhang X, Ma J, Lin H, Jiang Q, Wang J, Feng J.
Microstructural Evolution and Failure Analysis for 8YSZ/(Y0.5Gd0.5)TaO4 Double-Ceramic-Layer Thermal Barrier Coatings on Copper Substrate. Coatings. 2025; 15(4):451.
https://doi.org/10.3390/coatings15040451
Chicago/Turabian Style
Zhang, Xiao, Jing Ma, Huizhi Lin, Qingwei Jiang, Jun Wang, and Jing Feng.
2025. "Microstructural Evolution and Failure Analysis for 8YSZ/(Y0.5Gd0.5)TaO4 Double-Ceramic-Layer Thermal Barrier Coatings on Copper Substrate" Coatings 15, no. 4: 451.
https://doi.org/10.3390/coatings15040451
APA Style
Zhang, X., Ma, J., Lin, H., Jiang, Q., Wang, J., & Feng, J.
(2025). Microstructural Evolution and Failure Analysis for 8YSZ/(Y0.5Gd0.5)TaO4 Double-Ceramic-Layer Thermal Barrier Coatings on Copper Substrate. Coatings, 15(4), 451.
https://doi.org/10.3390/coatings15040451