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Journal: Coatings, 2024
Volume: 14
Number: 68
68
Article: Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect
Authors: by Lei Wang, Xu Guo, Songtao Dong, Yanxin Qiao, Jian Chen, Zhen Yan, Rong Shu and Lei Jin
Link: https://www.mdpi.com/2079-6412/14/1/68

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