Silva, V.; Colmiais, I.; Dinis, H.; Borme, J.; Alpuim, P.; Mendes, P.M.
Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration. Nanomaterials 2025, 15, 1119.
https://doi.org/10.3390/nano15141119
AMA Style
Silva V, Colmiais I, Dinis H, Borme J, Alpuim P, Mendes PM.
Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration. Nanomaterials. 2025; 15(14):1119.
https://doi.org/10.3390/nano15141119
Chicago/Turabian Style
Silva, Vitor, Ivo Colmiais, Hugo Dinis, Jérôme Borme, Pedro Alpuim, and Paulo M. Mendes.
2025. "Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration" Nanomaterials 15, no. 14: 1119.
https://doi.org/10.3390/nano15141119
APA Style
Silva, V., Colmiais, I., Dinis, H., Borme, J., Alpuim, P., & Mendes, P. M.
(2025). Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration. Nanomaterials, 15(14), 1119.
https://doi.org/10.3390/nano15141119