Article Versions Notes

Dirdal CA, Milenko K, Summanwar A, Dullo FT, Thrane PCV, Rasoga O, Avram AM, Dinescu A, Baracu AM. UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability. Nanomaterials. 2023; 13(3):436. https://doi.org/10.3390/nano13030436

Dirdal, Christopher A., Karolina Milenko, Anand Summanwar, Firehun T. Dullo, Paul C. V. Thrane, Oana Rasoga, Andrei M. Avram, Adrian Dinescu, and Angela M. Baracu. 2023. "UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability" Nanomaterials 13, no. 3: 436. https://doi.org/10.3390/nano13030436

Dirdal, C. A., Milenko, K., Summanwar, A., Dullo, F. T., Thrane, P. C. V., Rasoga, O., Avram, A. M., Dinescu, A., & Baracu, A. M. (2023). UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability. Nanomaterials, 13(3), 436. https://doi.org/10.3390/nano13030436