Estimation of the Young&rsquo;s Modulus of Nanometer-Thick Films Using Residual Stress-Driven Bilayer Cantilevers

Velosa-Moncada, Luis A.; Raskin, Jean-Pierre; Aguilera-Cortés, Luz Antonio; López-Huerta, Francisco; Herrera-May, Agustín L.

doi:10.3390/nano12020265

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Estimation of the Young’s Modulus of Nanometer-Thick Films Using Residual Stress-Driven Bilayer Cantilevers

Luis A. Velosa-Moncada

Jean-Pierre Raskin

²,

Luz Antonio Aguilera-Cortés

³,

Francisco López-Huerta

⁴

and

Agustín L. Herrera-May

^1,5,*

Micro and Nanotechnology Research Center, Universidad Veracruzana, Boca del Rio 94294, Mexico

Institute of Information and Communication Technologies, Electronics and Applied Mathematics (ICTEAM), Université Catholique de Louvain (UCL), 1348 Louvain-la-Neuve, Belgium

Departamento de Ingeniería Mecánica, DICIS, Universidad de Guanajuato, Salamanca 36885, Mexico

⁴

Facultad de Ingeniería Eléctrica y Electrónica, Universidad Veracruzana, Boca del Rio 94294, Mexico

⁵

Maestría en Ingeniería Aplicada, Facultad de Ingeniería de la Construcción y el Hábitat, Universidad Veracruzana, Boca del Rio 94294, Mexico

Author to whom correspondence should be addressed.

Academic Editor: Victor A. Eremeyev

Nanomaterials 2022, 12(2), 265; https://doi.org/10.3390/nano12020265

Received: 30 November 2021 / Revised: 8 January 2022 / Accepted: 11 January 2022 / Published: 14 January 2022

(This article belongs to the Special Issue Advances in Micro- and Nanomechanics)

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Abstract

Precise prediction of mechanical behavior of thin films at the nanoscale requires techniques that consider size effects and fabrication-related issues. Here, we propose a test methodology to estimate the Young’s modulus of nanometer-thick films using micromachined bilayer cantilevers. The bilayer cantilevers which comprise a well-known reference layer and a tested film deflect due to the relief of the residual stresses generated during the fabrication process. The mechanical relationship between the measured residual stresses and the corresponding deflections was used to characterize the tested film. Residual stresses and deflections were related using analytical and finite element models that consider intrinsic stress gradients and the use of adherence layers. The proposed methodology was applied to low pressure chemical vapor deposited silicon nitride tested films with thicknesses ranging from 46 nm to 288 nm. The estimated Young’s modulus values varying between 213.9 GPa and 288.3 GPa were consistent with nanoindentation and alternative residual stress-driven techniques. In addition, the dependence of the results on the thickness and the intrinsic stress gradient of the materials was confirmed. The proposed methodology is simple and can be used to characterize diverse materials deposited under different fabrication conditions. View Full-Text

Keywords: bilayer cantilever; deflections; thin films; residual stresses; young’s modulus

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MDPI and ACS Style

Velosa-Moncada, L.A.; Raskin, J.-P.; Aguilera-Cortés, L.A.; López-Huerta, F.; Herrera-May, A.L. Estimation of the Young’s Modulus of Nanometer-Thick Films Using Residual Stress-Driven Bilayer Cantilevers. Nanomaterials 2022, 12, 265. https://doi.org/10.3390/nano12020265

AMA Style

Velosa-Moncada LA, Raskin J-P, Aguilera-Cortés LA, López-Huerta F, Herrera-May AL. Estimation of the Young’s Modulus of Nanometer-Thick Films Using Residual Stress-Driven Bilayer Cantilevers. Nanomaterials. 2022; 12(2):265. https://doi.org/10.3390/nano12020265

Chicago/Turabian Style

Velosa-Moncada, Luis A., Jean-Pierre Raskin, Luz A. Aguilera-Cortés, Francisco López-Huerta, and Agustín L. Herrera-May. 2022. "Estimation of the Young’s Modulus of Nanometer-Thick Films Using Residual Stress-Driven Bilayer Cantilevers" Nanomaterials 12, no. 2: 265. https://doi.org/10.3390/nano12020265

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Estimation of the Young’s Modulus of Nanometer-Thick Films Using Residual Stress-Driven Bilayer Cantilevers

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