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Journal: Nanomaterials, 2021
Volume: 11
Number: 1901

Article: Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line Thickness
Authors: by Jielin Guo, Yu-Chou Shih, Roozbeh Sheikhi, Jiun-Pyng You and Frank G. Shi
Link: https://www.mdpi.com/2079-4991/11/8/1901

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