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Appl. Sci. 2018, 8(11), 2188; https://doi.org/10.3390/app8112188

A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package

State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
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Received: 24 October 2018 / Revised: 4 November 2018 / Accepted: 4 November 2018 / Published: 8 November 2018
(This article belongs to the Special Issue Selected Papers from the NMJ2018)
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Abstract

Though copper nano-pillars (CNPs) filled in anodic aluminum oxide (AAO) film has been developed for many years, the high pore-filling percentage in AAO is still a bottleneck. We have demonstrated a new electrodeposition method to fill CNPs in AAO without the seed layer which is required in the traditional electrodeposition process. CNPs with uniform heights were obtained and the pore-filling percentage reached up to 97.5%. Low current density is beneficial for the high pore-filling percentage due to the uniform growing rate in different nanoscale pores. The high temperature increased the diffusion velocity of ions and enhanced the pore filling percentage but also corroded the AAO film simultaneously. Results showed that CNPs grains with <220> orientation were fabricated. Electrodeposition with low electric current could contribute to the forming of CNPs with (220) preferred orientation due to the promotion of dehydration reduction processes. The thermal conductivities of Cu-AAO interposers reaches 92.34 W/(m·K) and 3.19 W/(m·K) in vertical and horizontal directions, respectively. View Full-Text
Keywords: electrodeposition; electronic materials; interposer; electronic package electrodeposition; electronic materials; interposer; electronic package
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Hang, C.; Zhang, H.; Tian, Y.; Wang, C.; Huang, Y.; Zheng, Z.; Wang, C. A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package. Appl. Sci. 2018, 8, 2188.

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