Order Article Reprints

Hang C, Zhang H, Tian Y, Wang C, Huang Y, Zheng Z, Wang C. A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package. Applied Sciences. 2018; 8(11):2188. https://doi.org/10.3390/app8112188

Hang, Chunjin, He Zhang, Yanhong Tian, Chenxi Wang, Yuan Huang, Zhen Zheng, and Chunqing Wang. 2018. "A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package" Applied Sciences 8, no. 11: 2188. https://doi.org/10.3390/app8112188

Hang, C., Zhang, H., Tian, Y., Wang, C., Huang, Y., Zheng, Z., & Wang, C. (2018). A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package. Applied Sciences, 8(11), 2188. https://doi.org/10.3390/app8112188