Hang, C.; Zhang, H.; Tian, Y.; Wang, C.; Huang, Y.; Zheng, Z.; Wang, C.
A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package. Appl. Sci. 2018, 8, 2188.
https://doi.org/10.3390/app8112188
AMA Style
Hang C, Zhang H, Tian Y, Wang C, Huang Y, Zheng Z, Wang C.
A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package. Applied Sciences. 2018; 8(11):2188.
https://doi.org/10.3390/app8112188
Chicago/Turabian Style
Hang, Chunjin, He Zhang, Yanhong Tian, Chenxi Wang, Yuan Huang, Zhen Zheng, and Chunqing Wang.
2018. "A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package" Applied Sciences 8, no. 11: 2188.
https://doi.org/10.3390/app8112188
APA Style
Hang, C., Zhang, H., Tian, Y., Wang, C., Huang, Y., Zheng, Z., & Wang, C.
(2018). A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package. Applied Sciences, 8(11), 2188.
https://doi.org/10.3390/app8112188