Méndez-González, L.C.; RodrÃguez-Picón, L.A.; González-Hernández, I.J.; Pérez-OlguÃn, I.J.C.; GarcÃa, V.
Flexible Reliability Assessment of Electronic Components Under Complex Failure-Mode Scenarios. Appl. Sci. 2026, 16, 6588.
https://doi.org/10.3390/app16136588
AMA Style
Méndez-González LC, RodrÃguez-Picón LA, González-Hernández IJ, Pérez-OlguÃn IJC, GarcÃa V.
Flexible Reliability Assessment of Electronic Components Under Complex Failure-Mode Scenarios. Applied Sciences. 2026; 16(13):6588.
https://doi.org/10.3390/app16136588
Chicago/Turabian Style
Méndez-González, Luis Carlos, Luis Alberto RodrÃguez-Picón, Isidro Jesús González-Hernández, Iván Juan Carlos Pérez-OlguÃn, and Vicente GarcÃa.
2026. "Flexible Reliability Assessment of Electronic Components Under Complex Failure-Mode Scenarios" Applied Sciences 16, no. 13: 6588.
https://doi.org/10.3390/app16136588
APA Style
Méndez-González, L. C., RodrÃguez-Picón, L. A., González-Hernández, I. J., Pérez-OlguÃn, I. J. C., & GarcÃa, V.
(2026). Flexible Reliability Assessment of Electronic Components Under Complex Failure-Mode Scenarios. Applied Sciences, 16(13), 6588.
https://doi.org/10.3390/app16136588