Jiao, X.; Yang, Z.; Yan, J.; Zhang, J.; Chen, X.; Guan, R.
Electrodeposition and Corrosion Behavior of Cu-Sn Alloys in 3.5 wt.% NaCl and 0.1 M HNO3 Solutions. Metals 2025, 15, 426.
https://doi.org/10.3390/met15040426
AMA Style
Jiao X, Yang Z, Yan J, Zhang J, Chen X, Guan R.
Electrodeposition and Corrosion Behavior of Cu-Sn Alloys in 3.5 wt.% NaCl and 0.1 M HNO3 Solutions. Metals. 2025; 15(4):426.
https://doi.org/10.3390/met15040426
Chicago/Turabian Style
Jiao, Xiye, Zhou Yang, Jie Yan, Jin Zhang, Xiaolin Chen, and Renguo Guan.
2025. "Electrodeposition and Corrosion Behavior of Cu-Sn Alloys in 3.5 wt.% NaCl and 0.1 M HNO3 Solutions" Metals 15, no. 4: 426.
https://doi.org/10.3390/met15040426
APA Style
Jiao, X., Yang, Z., Yan, J., Zhang, J., Chen, X., & Guan, R.
(2025). Electrodeposition and Corrosion Behavior of Cu-Sn Alloys in 3.5 wt.% NaCl and 0.1 M HNO3 Solutions. Metals, 15(4), 426.
https://doi.org/10.3390/met15040426