Lin, C.-C.; Yeh, S.-Y.; Huang, W.-L.; Xu, Y.-X.; Huang, Y.-S.; Yeh, T.-H.; Tien, C.-H.; Chen, L.-C.; Tseng, Z.-L.
Using Thermally Crosslinkable Hole Transporting Layer to Improve Interface Characteristics for Perovskite CsPbBr3 Quantum-Dot Light-Emitting Diodes. Polymers 2020, 12, 2243.
https://doi.org/10.3390/polym12102243
AMA Style
Lin C-C, Yeh S-Y, Huang W-L, Xu Y-X, Huang Y-S, Yeh T-H, Tien C-H, Chen L-C, Tseng Z-L.
Using Thermally Crosslinkable Hole Transporting Layer to Improve Interface Characteristics for Perovskite CsPbBr3 Quantum-Dot Light-Emitting Diodes. Polymers. 2020; 12(10):2243.
https://doi.org/10.3390/polym12102243
Chicago/Turabian Style
Lin, Chun-Cheng, Shao-Yang Yeh, Wei-Lun Huang, You-Xun Xu, Yan-Siang Huang, Tzu-Hung Yeh, Ching-Ho Tien, Lung-Chien Chen, and Zong-Liang Tseng.
2020. "Using Thermally Crosslinkable Hole Transporting Layer to Improve Interface Characteristics for Perovskite CsPbBr3 Quantum-Dot Light-Emitting Diodes" Polymers 12, no. 10: 2243.
https://doi.org/10.3390/polym12102243
APA Style
Lin, C.-C., Yeh, S.-Y., Huang, W.-L., Xu, Y.-X., Huang, Y.-S., Yeh, T.-H., Tien, C.-H., Chen, L.-C., & Tseng, Z.-L.
(2020). Using Thermally Crosslinkable Hole Transporting Layer to Improve Interface Characteristics for Perovskite CsPbBr3 Quantum-Dot Light-Emitting Diodes. Polymers, 12(10), 2243.
https://doi.org/10.3390/polym12102243