Article Versions Notes

Park DB, Jo J, Kim S, Lee D-Y, Chae S, Park S, Park S-H, Lee T-Y, Kim K-M, Park NS, et al. Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review. Micromachines. 2026; 17(6):720. https://doi.org/10.3390/mi17060720

Park, Dong Bae, Jinho Jo, Seonwoo Kim, Da-Yeong Lee, Suin Chae, Soobin Park, Se-Hoon Park, Tae-Young Lee, Kyoung-Min Kim, Nam Son Park, and et al. 2026. "Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review" Micromachines 17, no. 6: 720. https://doi.org/10.3390/mi17060720

Park, D. B., Jo, J., Kim, S., Lee, D.-Y., Chae, S., Park, S., Park, S.-H., Lee, T.-Y., Kim, K.-M., Park, N. S., Lee, S.-E., Kim, S. O., & Nam, H. (2026). Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review. Micromachines, 17(6), 720. https://doi.org/10.3390/mi17060720