Werum, K.; Eberhardt, W.; Reenaers, D.; Mager, T.; Endl, M.; Zimmermann, A.; Deferme, W.
Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications. Micromachines 2025, 16, 980.
https://doi.org/10.3390/mi16090980
AMA Style
Werum K, Eberhardt W, Reenaers D, Mager T, Endl M, Zimmermann A, Deferme W.
Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications. Micromachines. 2025; 16(9):980.
https://doi.org/10.3390/mi16090980
Chicago/Turabian Style
Werum, Kai, Wolfgang Eberhardt, Dieter Reenaers, Thomas Mager, Mika Endl, André Zimmermann, and Wim Deferme.
2025. "Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications" Micromachines 16, no. 9: 980.
https://doi.org/10.3390/mi16090980
APA Style
Werum, K., Eberhardt, W., Reenaers, D., Mager, T., Endl, M., Zimmermann, A., & Deferme, W.
(2025). Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications. Micromachines, 16(9), 980.
https://doi.org/10.3390/mi16090980