A Temperature Prediction Model for Flexible Electronic Devices Based on GA-BP Neural Network and Experimental Verification

The problem that the thermal safety of flexible electronic devices is difficult to evaluate in real time is addressed in this study by establishing a BP neural network (GA-BPNN) temperature prediction model based on genetic algorithm optimisation. The model uses a BP neural network to fit the functional relationship between the input condition and the steady-state temperature of the equipment and uses a genetic algorithm to optimise the parameter initialisation problem of the BP neural network. To overcome the challenge of the high cost of obtaining experimental data, finite element analysis software is used to simulate the temperature results of the equipment under different working conditions. The prediction variance of the GA-BPNN model does not exceed 0.57 °C and has good robustness, as the model is trained according to the simulation data. The study conducted thermal validation experiments on the temperature prediction model for this flexible electronic device. The device reached steady state after 1200 s of operation at rated power. The error between the predicted and experimental results was less than 0.9 °C, verifying the validity of the model’s predictions. Compared with traditional thermal simulation and experimental methods, this model can quickly predict the temperature with a certain accuracy and has outstanding advantages in computational efficiency and integrated application of hardware and software.