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Journal: Micromachines, 2024
Volume: 15
Number: 177
177
Article: An Investigation of Body Diode Reliability in Commercial 1.2 kV SiC Power MOSFETs with Planar and Trench Structures
Authors: by Jiashu Qian, Limeng Shi, Michael Jin, Monikuntala Bhattacharya, Atsushi Shimbori, Hengyu Yu, Shiva Houshmand, Marvin H. White and Anant K. Agarwal
Link: https://www.mdpi.com/2072-666X/15/2/177

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