Zhang, Z.; Wen, Z.; Shi, H.; Song, Q.; Xu, Z.; Li, M.; Hou, Y.; Zhang, Z.
Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer. Micromachines 2021, 12, 1331.
https://doi.org/10.3390/mi12111331
AMA Style
Zhang Z, Wen Z, Shi H, Song Q, Xu Z, Li M, Hou Y, Zhang Z.
Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer. Micromachines. 2021; 12(11):1331.
https://doi.org/10.3390/mi12111331
Chicago/Turabian Style
Zhang, Zhe, Zhidong Wen, Haiyan Shi, Qi Song, Ziye Xu, Man Li, Yu Hou, and Zichen Zhang.
2021. "Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer" Micromachines 12, no. 11: 1331.
https://doi.org/10.3390/mi12111331
APA Style
Zhang, Z., Wen, Z., Shi, H., Song, Q., Xu, Z., Li, M., Hou, Y., & Zhang, Z.
(2021). Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer. Micromachines, 12(11), 1331.
https://doi.org/10.3390/mi12111331