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Analysis of Orthogonal Coupling Structure Based on Double Three-Contact Vertical Hall Device

College of Physics and Information Engineering, Fuzhou University, Fuzhou 350116, Fujian, China
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Micromachines 2019, 10(9), 610; https://doi.org/10.3390/mi10090610
Received: 24 August 2019 / Revised: 11 September 2019 / Accepted: 12 September 2019 / Published: 14 September 2019
(This article belongs to the Section A:Physics)
A vertical Hall device is an important component of 3D Hall sensors, used for detecting magnetic fields parallel to the sensor surface. The Hall devices described in existing research still have problems, such as large offset voltage and low sensitivity. Aiming to solve these problems, this study proposes a double three-contact vertical Hall device with low offset voltage, and a conformal mapping analysis method to improve the sensitivity of the device. Secondly, an orthogonal coupling structure composed of two sets of double three-contact vertical Hall devices is proposed, which further reduces the offset voltage of the device. Finally, the TCAD simulation software was used to analyze the performance of the devices, and an existing vertical Hall device was compared to ours. The results show that the orthogonal coupling structure in this study exhibits better performance, reaching an average voltage sensitivity of 17.5222 mV/VT and an average offset voltage of about 0.075 mV. In addition, the structure has the same magnitude of offset voltage in the four phases of the rotating current method. This characteristic enables the back-end circuit to more accurately filter out the offset voltage and acquire the Hall signal. View Full-Text
Keywords: orthogonal coupling; offset voltage; vertical Hall device; conformal mapping orthogonal coupling; offset voltage; vertical Hall device; conformal mapping
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MDPI and ACS Style

Wei, R.; Du, Y. Analysis of Orthogonal Coupling Structure Based on Double Three-Contact Vertical Hall Device. Micromachines 2019, 10, 610.

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