Editorial for the Special Issue on MEMS Accelerometers
Electrical and Computer Engineering, Engineering Division, New York University Abu Dhabi, Abu Dhabi, UAE
Department of Electrical and Computer Engineering, Khalifa University, Abu Dhabi, UAE
Hochschule für Technik und Wirtschaft Berlin, University of Applied Sciences, Treskowallee 8, 10318 Berlin, Germany
Fraunhofer Institute for Reliability and Microintegration IZM, Department Wafer Level Integration, Group Leader Microsensors Technology, Gustav-Meyer-Allee 25, 13355 Berlin, Germany
Authors to whom correspondence should be addressed.
Received: 26 April 2019 / Accepted: 26 April 2019 / Published: 29 April 2019
PDF [160 KB, uploaded 29 April 2019]
Note: In lieu of an abstract, this is an excerpt from the first page.
Micro-Electro-Mechanical Systems (MEMS) devices are widely used for motion, pressure, light, and ultrasound sensing applications [...]
This is an open access article distributed under the Creative Commons Attribution License
which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
Share & Cite This Article
MDPI and ACS Style
Rasras, M.; Elfadel, I.A.M.; Ngo, H.D. Editorial for the Special Issue on MEMS Accelerometers. Micromachines 2019, 10, 290.
Rasras M, Elfadel IAM, Ngo HD. Editorial for the Special Issue on MEMS Accelerometers. Micromachines. 2019; 10(5):290.
Rasras, Mahmoud; Elfadel, Ibrahim A.M.; Ngo, Ha D. 2019. "Editorial for the Special Issue on MEMS Accelerometers." Micromachines 10, no. 5: 290.
Show more citation formats
Show less citations formats
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.
[Return to top]
For more information on the journal statistics, click here
Multiple requests from the same IP address are counted as one view.