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Open AccessEditorial

Editorial for the Special Issue on MEMS Accelerometers

Electrical and Computer Engineering, Engineering Division, New York University Abu Dhabi, Abu Dhabi, UAE
Department of Electrical and Computer Engineering, Khalifa University, Abu Dhabi, UAE
Hochschule für Technik und Wirtschaft Berlin, University of Applied Sciences, Treskowallee 8, 10318 Berlin, Germany
Fraunhofer Institute for Reliability and Microintegration IZM, Department Wafer Level Integration, Group Leader Microsensors Technology, Gustav-Meyer-Allee 25, 13355 Berlin, Germany
Authors to whom correspondence should be addressed.
Micromachines 2019, 10(5), 290;
Received: 26 April 2019 / Accepted: 26 April 2019 / Published: 29 April 2019
(This article belongs to the Special Issue MEMS Accelerometers)
Note: In lieu of an abstract, this is an excerpt from the first page.

Micro-Electro-Mechanical Systems (MEMS) devices are widely used for motion, pressure, light, and ultrasound sensing applications [...] View Full-Text
MDPI and ACS Style

Rasras, M.; Elfadel, I.A.M.; Ngo, H.D. Editorial for the Special Issue on MEMS Accelerometers. Micromachines 2019, 10, 290.

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