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Open AccessEditorial

Editorial for the Special Issue on MEMS Accelerometers

1
Electrical and Computer Engineering, Engineering Division, New York University Abu Dhabi, Abu Dhabi, UAE
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Department of Electrical and Computer Engineering, Khalifa University, Abu Dhabi, UAE
3
Hochschule für Technik und Wirtschaft Berlin, University of Applied Sciences, Treskowallee 8, 10318 Berlin, Germany
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Fraunhofer Institute for Reliability and Microintegration IZM, Department Wafer Level Integration, Group Leader Microsensors Technology, Gustav-Meyer-Allee 25, 13355 Berlin, Germany
*
Authors to whom correspondence should be addressed.
Micromachines 2019, 10(5), 290; https://doi.org/10.3390/mi10050290
Received: 26 April 2019 / Accepted: 26 April 2019 / Published: 29 April 2019
(This article belongs to the Special Issue MEMS Accelerometers)
Note: In lieu of an abstract, this is an excerpt from the first page.

Micro-Electro-Mechanical Systems (MEMS) devices are widely used for motion, pressure, light, and ultrasound sensing applications [...] View Full-Text
MDPI and ACS Style

Rasras, M.; Elfadel, I.A.M.; Ngo, H.D. Editorial for the Special Issue on MEMS Accelerometers. Micromachines 2019, 10, 290.

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