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Effect of Conditioner Type and Downforce, and Pad Surface Micro-Texture on SiO2 Chemical Mechanical Planarization Performance

1
Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721, USA
2
Araca Incorporated, Tucson, AZ 85718, USA
3
Sandia National Laboratories, Albuquerque, NM 87116, USA
*
Author to whom correspondence should be addressed.
Micromachines 2019, 10(4), 258; https://doi.org/10.3390/mi10040258
Received: 20 March 2019 / Revised: 7 April 2019 / Accepted: 15 April 2019 / Published: 18 April 2019
(This article belongs to the Section D:Materials and Processing)
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Abstract

Based on a previous work where we investigated the effect of conditioner type and downforce on the evolution of pad surface micro-texture during break-in, we have chosen certain break-in conditions to carry out subsequent blanket SiO2 wafer polishing studies. Two different conditioner discs were used in conjunction with up to two different conditioning downforces. For each disc-downforce combination, mini-marathons were run using SiO2 wafers. Prior to polishing, each pad was broken-in for 30 min with one of the conditioner-downforce combinations. The goal of this study was to polish wafers after this break-in to see how the polishing process behaved immediately after break-in. One of the discs used in this study produced similar micro-texture results at both downforces, which echoed the results seen in the mini-marathon. When comparing the different polishing results obtained from breaking-in the pad with the different discs used in this study, the coefficient of friction (COF) and SiO2 removal rate (RR) were uncorrelated in all cases. However, the use of different discs resulted in different COF and RR trends. The uncorrelated COF and RR, as well as the differing trends, were explained by pad micro-texture results (i.e. the differing amount of fractured, poorly supported pad asperity summits). View Full-Text
Keywords: chemical mechanical planarization; SiO2; pad surface micro-texture; conditioner disc chemical mechanical planarization; SiO2; pad surface micro-texture; conditioner disc
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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McAllister, J.; Stuffle, C.; Sampurno, Y.; Hetherington, D.; Sierra Suarez, J.; Borucki, L.; Philipossian, A. Effect of Conditioner Type and Downforce, and Pad Surface Micro-Texture on SiO2 Chemical Mechanical Planarization Performance. Micromachines 2019, 10, 258.

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