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Journal: Micromachines, 2019
Volume: 10
Number: 227
227
Article: Design, Fabrication, and Testing of a Monolithically Integrated Tri-Axis High-Shock Accelerometer in Single (111)-Silicon Wafer
Authors: by Shengran Cai, Wei Li, Hongshuo Zou, Haifei Bao, Kun Zhang, Jiachou Wang, Zhaohui Song and Xinxin Li
Link: https://www.mdpi.com/2072-666X/10/4/227

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