Kim, D.; Yamamoto, Y.; Nagao, S.; Wakasugi, N.; Chen, C.; Suganuma, K.
Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining. Micromachines 2019, 10, 745.
https://doi.org/10.3390/mi10110745
AMA Style
Kim D, Yamamoto Y, Nagao S, Wakasugi N, Chen C, Suganuma K.
Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining. Micromachines. 2019; 10(11):745.
https://doi.org/10.3390/mi10110745
Chicago/Turabian Style
Kim, Dongjin, Yasuyuki Yamamoto, Shijo Nagao, Naoki Wakasugi, Chuantong Chen, and Katsuaki Suganuma.
2019. "Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining" Micromachines 10, no. 11: 745.
https://doi.org/10.3390/mi10110745
APA Style
Kim, D., Yamamoto, Y., Nagao, S., Wakasugi, N., Chen, C., & Suganuma, K.
(2019). Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining. Micromachines, 10(11), 745.
https://doi.org/10.3390/mi10110745