Yang, F.; Han, G.; Yang, J.; Zhang, M.; Ning, J.; Yang, F.; Si, C.
Research on Wafer-Level MEMS Packaging with Through-Glass Vias. Micromachines 2019, 10, 15.
https://doi.org/10.3390/mi10010015
AMA Style
Yang F, Han G, Yang J, Zhang M, Ning J, Yang F, Si C.
Research on Wafer-Level MEMS Packaging with Through-Glass Vias. Micromachines. 2019; 10(1):15.
https://doi.org/10.3390/mi10010015
Chicago/Turabian Style
Yang, Fan, Guowei Han, Jian Yang, Meng Zhang, Jin Ning, Fuhua Yang, and Chaowei Si.
2019. "Research on Wafer-Level MEMS Packaging with Through-Glass Vias" Micromachines 10, no. 1: 15.
https://doi.org/10.3390/mi10010015
APA Style
Yang, F., Han, G., Yang, J., Zhang, M., Ning, J., Yang, F., & Si, C.
(2019). Research on Wafer-Level MEMS Packaging with Through-Glass Vias. Micromachines, 10(1), 15.
https://doi.org/10.3390/mi10010015